Patents by Inventor John Wai Fong

John Wai Fong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11479683
    Abstract: In one aspect, inks for use with a three-dimensional printing system are described herein. In some embodiments, an ink described herein comprises up to about 90 wt. % monofunctional curable material, up to about 10 wt. % difunctional curable material, and up to about 10 wt. % liquid rubber, based on the total weight of the ink, wherein the liquid rubber comprises one or more curable moieties. In some cases, the liquid rubber comprises one or more ethylenically unsaturated moieties. For example, in some instances, the liquid rubber comprises a butadiene acrylonitrile copolymer.
    Type: Grant
    Filed: August 23, 2021
    Date of Patent: October 25, 2022
    Assignee: 3D SYSTEMS, INC.
    Inventors: John Wai Fong, Patricia Wang
  • Patent number: 11292927
    Abstract: In one aspect, inks for use with a three-dimensional printing system are described herein. In some embodiments, an ink described herein comprises up to about 90 wt. % monofunctional curable material, up to about 10 wt. % difunctional curable material, and up to about 10 wt. % liquid rubber, based on the total weight of the ink, wherein the liquid rubber comprises one or more curable moieties. In some cases, the liquid rubber comprises one or more ethyleneically unsaturated moieties. For example, in some instances, the liquid rubber comprises a butadiene acrylonitrile copolymer.
    Type: Grant
    Filed: September 7, 2018
    Date of Patent: April 5, 2022
    Assignee: 3D SYSTEMS, INCORPORATED
    Inventors: John Wai Fong, Patricia Wang
  • Publication number: 20210380825
    Abstract: In one aspect, inks for use with a three-dimensional printing system are described herein. In some embodiments, an ink described herein comprises up to about 90 wt. % monofunctional curable material, up to about 10 wt. % difunctional curable material, and up to about 10 wt. % liquid rubber, based on the total weight of the ink, wherein the liquid rubber comprises one or more curable moieties. In some cases, the liquid rubber comprises one or more ethylenically unsaturated moieties. For example, in some instances, the liquid rubber comprises a butadiene acrylonitrile copolymer.
    Type: Application
    Filed: August 23, 2021
    Publication date: December 9, 2021
    Inventors: John Wai Fong, Patricia Wang
  • Publication number: 20190002713
    Abstract: In one aspect, inks for use with a three-dimensional printing system are described herein. In some embodiments, an ink described herein comprises up to about 90 wt. % monofunctional curable material, up to about 10 wt. % difunctional curable material, and up to about 10 wt. % liquid rubber, based on the total weight of the ink, wherein the liquid rubber comprises one or more curable moieties. In some cases, the liquid rubber comprises one or more ethyleneically unsaturated moieties. For example, in some instances, the liquid rubber comprises a butadiene acrylonitrile copolymer.
    Type: Application
    Filed: September 7, 2018
    Publication date: January 3, 2019
    Inventors: John Wai Fong, Patricia Wang
  • Publication number: 20160145452
    Abstract: In one aspect, inks for use with a three-dimensional printing system are described herein. In some embodiments, an ink described herein comprises up to about 90 wt. % monofunctional curable material, up to about 10 wt. % difunctional curable material, and up to about 10 wt. % liquid rubber, based on the total weight of the ink, wherein the liquid rubber comprises one or more curable moieties. In some cases, the liquid rubber comprises one or more ethyleneically unsaturated moieties. For example, in some instances, the liquid rubber comprises a butadiene acrylonitrile copolymer.
    Type: Application
    Filed: November 23, 2015
    Publication date: May 26, 2016
    Inventors: John Wai FONG, Patricia WANG
  • Patent number: 8377623
    Abstract: The present invention provides a low viscosity photocurable composition including (i) a cationically curable component comprising a polyglycidyl epoxy compound (ii) a free radically active component (iii) a cationic photoinitiator (v) a free radical photoinitiator and optionally (iv) one or more optional components. The photocurable composition can be cured using rapid prototyping techniques to form clear, colorless three-dimensional articles having excellent mechanical properties.
    Type: Grant
    Filed: November 21, 2008
    Date of Patent: February 19, 2013
    Assignee: 3D Systems, Inc.
    Inventor: John Wai Fong
  • Patent number: 8334025
    Abstract: The present invention provides a low viscosity photocurable composition including (i) a cationically curable component (ii) a free radically active component (iii) an antimony-free cationic photoinitiator (v) a free radical photoinitiator, and (vi) a toughening agent. The photocurable composition can be cured using rapid prototyping techniques to form three-dimensional articles which can be used in various aerospace and investment casting applications.
    Type: Grant
    Filed: October 26, 2006
    Date of Patent: December 18, 2012
    Assignee: 3D Systems, Inc.
    Inventors: John Wai Fong, Richard N. Leyden, Laurence Messe, Ranjana C. Patel, Carole Chapelat
  • Patent number: 8227048
    Abstract: The present invention provides a clear, low viscosity photocurable composition including (i) a cationically curable compound (ii) an acrylate-containing compound (iii) a polyol-containing mixture (iv) a cationic photoinitiator and (v) a free radical photoinitiator. The photocurable composition can be cured using rapid prototyping techniques to form opaque-white three-dimensional articles having ABS-like properties.
    Type: Grant
    Filed: September 12, 2006
    Date of Patent: July 24, 2012
    Assignee: 3D Systems, Inc.
    Inventors: Richard N. Leyden, Laurence Messe, Frank Tran, David L. Johnson, John Wai Fong, Carole Chapelat, Ranjana C. Patel
  • Patent number: 8182882
    Abstract: A method of making a 3-D object from a photocurable composition, including (a) a cationically curable monomer; (b) a radically curable monomer; (c) reactive particles comprising a crosslinked polysiloxane core and a shell of reactive groups on an outer surface of the core, wherein the reactive groups comprise epoxy groups, ethylenically unsaturated groups, or hydroxy groups; (d) a radical photoinitiator; and (e) a cationic photoinitiator; the method comprising (1) forming a first layer of the photocurable composition; (2) exposing the first layer to actinic radiation sufficient to harden the first layer; (3) forming a second layer of the photocurable composition above the hardened first layer; (4) exposing the second layer to actinic radiation sufficient to harden the second layer; and (5) repeating steps (3)-(4) as needed to form a 3-D object.
    Type: Grant
    Filed: October 31, 2007
    Date of Patent: May 22, 2012
    Assignee: 3D Systems, Inc.
    Inventors: David Johnson, John Wai Fong
  • Patent number: 7964248
    Abstract: The present invention is directed to a photoinitiator composition comprising two different cationic photoinitiators and a photocurable composition comprising said photoinitiator composition. Moreover, the present invention relates to the use of the photoinitiator composition and the photocurable composition. Furthermore, the present invention relates to a process for producing a three dimensional article.
    Type: Grant
    Filed: April 9, 2008
    Date of Patent: June 21, 2011
    Assignee: Huntsman Advanced Materials Americas LLC
    Inventors: John Wai Fong, Carole Chapelat, Loic Messe, Ranjana Patel, Laurence Messe
  • Publication number: 20100327493
    Abstract: The present invention is directed to a photoinitiator composition comprising two different cationic photoinitiators and a photocurable composition comprising said photoinitiator composition. Moreover, the present invention relates to the use of the photoinitiator composition and the photocurable composition. Furthermore, the present invention relates to a process for producing a three dimensional article.
    Type: Application
    Filed: April 9, 2008
    Publication date: December 30, 2010
    Applicant: Huntsman Advanced Materials Americas LLC
    Inventors: John Wai Fong, Carole Chapelat, Loic Messe, Ranjana Patel, Laurence Messe
  • Publication number: 20100304100
    Abstract: The present invention provides a low viscosity photocurable composition including (i) a cationically curable component comprising a polyglycidyl epoxy compound (II) a free radically active component (iii) a cationic photoinitiator (v) a free radical photoinitiator and optionally (iv) one or more optional components. The photocurable composition can be cured using rapid prototyping techniques to form clear, colorless three-dimensional articles having excellent mechanical properties.
    Type: Application
    Filed: November 21, 2008
    Publication date: December 2, 2010
    Inventor: John Wai Fong
  • Patent number: 7820275
    Abstract: A photocurable composition comprising: (a) a cationically curable component preferably formed from one or more epoxy compound(s), (b) an acrylate component having no or a low amount of hydroxy groups preferably dipentaerythritol hexaacrylate, (c) a polyol component, preferably a polyether polyol, (d) a cationic photoinitiator; and (e) a free radical photoinitiator. The composition may produce when cured three-dimensional articles with high clarity and improved mechanical properties.
    Type: Grant
    Filed: November 4, 2004
    Date of Patent: October 26, 2010
    Assignee: Huntsman Advanced Materials Americas LLC
    Inventors: David L. Johnson, Frank Tran, John Wai Fong
  • Publication number: 20100015408
    Abstract: The present invention provides a low viscosity photocurable composition including (i) a cationically curable component (ii) a free radically active component (iii) an antimony-free cationic photoinitiator (v) a free radical photoinitiator, and (vi) a toughening agent. The photocurable composition can be cured using rapid prototyping techniques to form three-dimensional articles which can be used in various aerospace and investment casting applications.
    Type: Application
    Filed: October 26, 2006
    Publication date: January 21, 2010
    Applicant: Huntsman International LLC
    Inventors: John Wai Fong, Richard Leyden, Laurence Messe, Ranjana C. Patel, Carole Vandenabeele
  • Publication number: 20080182078
    Abstract: A photocurable composition comprising: (a) a cationically curable component preferably formed from one or more epoxy compound(s), (b) an acrylate component having no or a low amount of hydroxy groups preferably dipentaerythritol hexaacrylate, (c) a polyol component, preferably a polyether polyol, (d) a cationic photoinitiator; and (e) a free radical photoinitiator. The composition may produce when cured three-dimensional articles with high clarity and improved mechanical properties.
    Type: Application
    Filed: November 4, 2004
    Publication date: July 31, 2008
    Applicant: Huntsman Advanced Materials Americas Inc.
    Inventors: David L. Johnson, Frank Tran, John Wai Fong
  • Patent number: 7307123
    Abstract: A photocurable composition, including (a) a photocurable monomer, e.g. a cationically curable monomer and/or a radically curable monomer; (b) reactive particles comprising a crosslinked elastomeric core, e.g. made of polysiloxane material, and a shell of reactive groups on an outer surface of the core, wherein the reactive groups comprise epoxy groups, ethylenically unsaturated groups, or hydroxy groups; and (c) an appropriate photoinitiator, e.g. a radical photoinitiator; and a cationic photoinitiator. A method of making a 3-D object from such a composition and a 3-D object made by the method are also provided. The cured composition generally has a smooth surface. The use of the reactive particles makes the composition more stable and the particles do not readily separate out.
    Type: Grant
    Filed: April 18, 2003
    Date of Patent: December 11, 2007
    Assignee: Huntsman Advanced Materials Americas Inc.
    Inventors: David Johnson, John Wai Fong