Patents by Inventor John Waldvogel

John Waldvogel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Use of anti-agglomerants in high gas to oil ratio formations
    Patent number: 9988568
    Abstract: The present invention generally relates to one or more compositions and methods for inhibiting the formation of gas hydrate agglomerates in a fluid. The fluid may be contained, for example, in an oil or gas pipeline or refinery.
    Type: Grant
    Filed: January 30, 2015
    Date of Patent: June 5, 2018
    Assignee: Ecolab USA Inc.
    Inventors: John Waldvogel, Qiwei Li, Peter Webber, Andrea Gutierrez, Pritesh Sharma
  • USE OF ANTI-AGGLOMERANTS IN HIGH GAS TO OIL RATIO FORMATIONS
    Publication number: 20160222277
    Abstract: The present invention generally relates to one or more compositions and methods for inhibiting the formation of gas hydrate agglomerates in a fluid. The fluid may be contained, for example, in an oil or gas pipeline or refinery.
    Type: Application
    Filed: January 30, 2015
    Publication date: August 4, 2016
    Inventors: John Waldvogel, Qiwei Li, Peter Webber, Andrea Gutierrez, Pritesh Sharma
  • ELECTRICAL CIRCUIT APPARATUS
    Publication number: 20070119904
    Abstract: An electrical circuit apparatus that includes; a substrate having a top side, a ground layer, at least one thermal aperture, and at least one solder aperture; a heat sink; and an adhesive layer for mechanically coupling the heat sink to the ground layer of the substrate, the adhesive layer having at least one aperture wherein aligning the at least one substrate solder aperture with the at least one adhesive layer aperture enables solder wetting in a predetermined area between the heat sink and the ground layer of the substrate.
    Type: Application
    Filed: January 30, 2007
    Publication date: May 31, 2007
    Applicant: MOTOROLA, INC.
    Inventors: John Waldvogel, Herman Miller
  • Electrical circuit apparatus and method for assembling same
    Publication number: 20070012751
    Abstract: An electrical circuit apparatus (300) that includes; a substrate (330) having a top side, a ground layer (336), at least one thermal aperture (332), and at least one solder aperture (334); a heat sink (310); and an adhesive layer (320) for mechanically coupling the heat sink to the ground layer of the substrate, the adhesive layer having at least one aperture (322) wherein aligning the at least one substrate solder aperture with the at least one adhesive layer aperture enables solder wetting in a predetermined area between the heat sink and the ground layer of the substrate.
    Type: Application
    Filed: July 13, 2005
    Publication date: January 18, 2007
    Inventors: John Waldvogel, Herman Miller
  • Electrical circuit apparatus and methods for assembling same
    Publication number: 20050121774
    Abstract: An electrical circuit apparatus (300) that includes: a substrate (330) having a ground layer (336), at least one thermal aperture (332), and at least one solder aperture (334); a heat sink (310); and an adhesive layer (320) for mechanically coupling the heat sink to the ground layer of the substrate such that at least a portion of the at least one substrate thermal aperture overlaps the heat sink, the adhesive layer having at least one thermal aperture (322) and at least one solder aperture (324), wherein aligning the at least one substrate solder aperture with the at least one adhesive layer solder aperture and aligning the at least one substrate thermal aperture with the at least one adhesive layer thermal aperture enables solder wetting in a predetermined area between the heat sink and the ground layer of the substrate.
    Type: Application
    Filed: January 7, 2005
    Publication date: June 9, 2005
    Inventors: John Waldvogel, Brian Bielick, Herman Miller, Billy Van Cannon
  • Electrical circuit apparatus and method
    Publication number: 20050092814
    Abstract: An electrical circuit apparatus (300) that includes: a substrate (330) having a ground layer (336), at least one device aperture (332), and at least one solder aperture (334); a heat sink (310); and an adhesive layer (320) for mechanically coupling the heat sink to the ground layer of the substrate such that at least a portion of the substrate device aperture overlaps the heat sink, the adhesive layer having at least one device aperture and at least one solder aperture, wherein aligning the at least one substrate solder aperture with the at least one adhesive layer solder aperture and aligning the at least one substrate device aperture with the at least one adhesive layer device aperture enables solder wetting in a predetermined area between the heat sink and the ground layer of the substrate.
    Type: Application
    Filed: December 1, 2004
    Publication date: May 5, 2005
    Inventors: John Waldvogel, Brian Bielick, Herman Miller, Billy Van Cannon