Abstract: In a thermoelectric module consisting of p- and n-conducting thermoelectric material pieces which are alternately connected to one another via electrically conductive contacts, the thermoelectric module (19) is thermally conductively connected to a micro heat exchanger (13) which comprises a plurality of continuous channels having a diameter of at most 1 mm, through which a fluid heat exchanger medium can flow.

Abstract: A semiconductor package for power transistors of the LDMOS type has a metallic substrate with a die mounted directly thereon, lead frame insulators mounted thereon adjacent the die and a plurality of leads mounted on the insulators and electrically coupled to the die by bond wires. The substrate includes a body having opposite surfaces comprising pure copper layers, and with the body interior being at least partially comprised of a copper/diamond composite so as to act as a heat spreader and provide improved heat removal and low thermal expansion, as well as an electrical connection for the die. The body may be entirely comprised of a copper/diamond composite, or it may be comprised of a copper/tungsten composite having a copper/diamond composite insert therein. The copper/diamond composite is comprised of diamond particles within a copper matrix.

Abstract: A small and durable antenna for use with radio and microwave communications is formed as a helical conductor contained in a multilayered non-ferrite ceramic chip. The dielectric constant of the ceramic is selected to match the antenna to its operating frequency, which may be in the range of 0.5 to 10.0 Gigahertz. A process for making such antennas is also disclosed. The antenna may be used in portable terminals and other devices requiring small, durable and inexpensive antennae.