Abstract: An integrated circuit is wire bonded in a manner such that there is consistent RF performance from integrated circuit package to integrated circuit package. Bond distances within the integrated circuit are measured, each corresponding to a wire bond to be formed. An area under a hypothetical wire bond profile is calculated as a function of the bond distances, a baseline wire length, and a baseline loop height. A wire is bonded across a given one of the bond distances to form a given one of the wire bonds. A wire bond profile for the given wire bond is provided having an area thereunder that is substantially equal to the calculated area.

Abstract: An integrated circuit is wire bonded in a manner such that there is consistent RF performance from integrated circuit package to integrated circuit package. Bond distances within the integrated circuit are measured, each corresponding to a wire bond to be formed. An area under a hypothetical wire bond profile is calculated as a function of the bond distances, a baseline wire length, and a baseline loop height. A wire is bonded across a given one of the bond distances to form a given one of the wire bonds. A wire bond profile for the given wire bond is provided having an area thereunder that is substantially equal to the calculated area.

Abstract: An integrated circuit is wire bonded in a manner such that there is consistent RF performance from integrated circuit package to integrated circuit package. Bond distances within the integrated circuit are measured, each corresponding to a wire bond to be formed. An area under a hypothetical wire bond profile is calculated as a function of the bond distances, a baseline wire length, and a baseline loop height. A wire is bonded across a given one of the bond distances to form a given one of the wire bonds. A wire bond profile for the given wire bond is provided having an area thereunder that is substantially equal to the calculated area.

Abstract: An integrated circuit is wire bonded in a manner such that there is consistent RF performance from integrated circuit package to integrated circuit package. Bond distances within the integrated circuit are measured, each corresponding to a wire bond to be formed. An area under a hypothetical wire bond profile is calculated as a function of the bond distances, a baseline wire length, and a baseline loop height. A wire is bonded across a given one of the bond distances to form a given one of the wire bonds. A wire bond profile for the given wire bond is provided having an area thereunder that is substantially equal to the calculated area.

Abstract: There is disclosed a power amplifier includes an in-phase power splitter generating two split signals from an input signal, and two amplifiers capable of operating in different modes. The split signals are provided as respective inputs to the two amplifiers which are coupled through transmission lines such that as the first amplifier approaches the maximum power it can produce, the output from the second amplifier begins to contribute to the power amplifier output and supplements and modifies the power provided by the first amplifier thereby extending the range of input power over which the power amplifier delivers output power.

Abstract: An apparatus which aligns a ball grid array (BGA) device over a substrate. The apparatus preferably includes a cup-shaped member for cupping and holding the solder balls of the BGA device, and an elongate member attached to the cup-shaped member. The cup-shaped member is attached between the BGA device and the substrate at two or more different positions so that the solder balls of the BGA device become aligned over the terminals of the substrate by operation of gravity.

Abstract: A transmission line balun transformer for providing a single ended output signal from a pair of differential input signals includes two transmission line signal couplers. The couplers are individually designed to be relatively loosely coupled devices, i.e. having a coupling factor greater than 3 dB, but are coupled together with proper phase relationships so as to achieve a relatively tighter composite coupling characteristic in the order of 3 dB, thereby resulting in an increase in bandwidth.