Abstract: Embodiments of the present disclosure include an apparatus having a band including a high thermally conductive material is disposed at least partially around an inductor.

Abstract: Embodiments of the present disclosure include an apparatus having a band including a high thermally conductive material is disposed at least partially around an inductor.

Abstract: Embodiments of the present disclosure include an apparatus having a band including a high thermally conductive material is disposed at least partially around an inductor.

Abstract: An apparatus includes at least one top magnetic core comprising a first material with a first resistivity. The apparatus further includes at least one bottom magnetic core coupled to the at least one top magnetic core, the at least one bottom magnetic core comprising a second material with a second resistivity and at least one internal conductor coupled to the at least one top magnetic core and the at least one bottom magnetic core.

Abstract: Embodiments of the present disclose a power module system including a power module operatively coupled to an integrated circuit die, where the power module includes a band comprising of a high thermally conductive material disposed around an inductor and where the band is at least partially disposed around the inductor

Abstract: Embodiments of the present disclosure include an apparatus having a band including a high thermally conductive material is disposed at least partially around an inductor.

Abstract: Embodiments of the present disclosure include an apparatus having a band including a high thermally conductive material is disposed at least partially around an inductor.

Abstract: A packaged integrated circuit and method of forming the same. The package integrated circuit includes an integrated circuit formed on a semiconductor die affixed to a surface of a multi-layer substrate, and a switch-mode regulator formed on the semiconductor die (or another semiconductor die) affixed to the surface of the multi-layer substrate. The integrated circuit and the switch-mode regulator are integrated within a package to form the packaged integrated circuit.

Abstract: A packaged integrated circuit and method of forming the same. The package integrated circuit includes an integrated circuit formed on a semiconductor die affixed to a surface of a multi-layer substrate, and a switch-mode regulator formed on the semiconductor die (or another semiconductor die) affixed to the surface of the multi-layer substrate. The integrated circuit and the switch-mode regulator are integrated within a package to form the packaged integrated circuit.

Abstract: Disclosed is a method and apparatus to protect a limb having a wound or condition requiring dryness from moisture. The method of applying a protective covering for a wound or condition requiring dryness comprising the steps of positioning a waterproof polyester fabric sock around an appendage having a gasket secured to an open end of the sock for sealing the sock to an appendage.

Abstract: A method of forming a magnetic device by providing a conductive substrate and placing a magnetic core proximate the conductive substrate with a surface thereof facing the conductive substrate. The method also includes placing a conductive clip proximate a surface of the magnetic core and electrically coupling ends of the conductive clip to the conductive substrate to cooperatively form a winding therewith about the magnetic core.

Abstract: A power module located on a conductive substrate including power conversion circuitry. The power conversion circuitry includes a magnetic device and at least one switch. The magnetic device includes a magnetic core having a surface facing the conductive substrate and a conductive clip facing a surface of the magnetic core with ends of the conductive clip electrically coupled to the conductive substrate to cooperatively form a winding therewith about the magnetic core. The power module also includes an encapsulant about the power conversion circuitry.

Abstract: A magnetic device that includes a magnetic core having a surface facing a conductive substrate. The magnetic device also includes a conductive clip facing a surface of the magnetic core with ends of the conductive clip electrically coupled to the conductive substrate to cooperatively form a winding therewith about the magnetic core.

Abstract: A method of forming a power module located on a conductive substrate by providing power conversion circuitry. The method of providing the power conversion circuitry includes forming a magnetic device by placing a magnetic core proximate a conductive substrate with a surface thereof facing a conductive substrate, and placing a conductive clip proximate a surface of the magnetic core. The method of forming the magnetic device also includes electrically coupling ends of the conductive clip to the conductive substrate to cooperatively form a winding therewith about the magnetic core. The method of providing the power conversion circuitry also includes providing at least one switch on the conductive substrate. The method of forming the power module also includes depositing an encapsulant about the power conversion circuitry.

Abstract: A method of manufacturing an encapsulated package for a magnetic device on a substrate. In one embodiment, the method includes providing a magnetic core on the substrate and placing a shielding structure over the magnetic core to create a chamber thereabout. The method also includes depositing an encapsulant about a portion of the magnetic core within the chamber. The shielding structure limits the encapsulant entering the chamber.

Abstract: A power module located on a substrate. In one embodiment, the power module includes power conversion circuitry with a magnetic device and at least one switch. The magnetic device includes a magnetic core with a shielding structure located about the magnetic core configured to create a chamber thereabout. The power module also includes an encapsulant about the power conversion circuitry. The shielding structure is configured to limit the encapsulant entering the chamber thereby allowing the encapsulant to surround a portion of the magnetic core within the chamber.

Abstract: A method of manufacturing a power module on a substrate. In one embodiment, the method includes providing power conversion circuitry including providing a magnetic device having a magnetic core and at least one switch on the substrate. The method also includes placing a shielding structure over the magnetic core to create a chamber thereabout. The method also includes depositing an encapsulant about the power conversion circuitry. The shielding structure limits the encapsulant entering the chamber thereby allowing the encapsulant to surround a portion of the magnetic core within the chamber.

Abstract: An encapsulatable package for a magnetic device that includes a magnetic core. In one embodiment, the encapsulatable package for the magnetic device also includes a shielding structure located about the magnetic core configured to create a chamber thereabout. The shielding structure is configured to limit an encapsulant entering the chamber.

Abstract: An encapsulatable package for a magnetic device that includes a magnetic core. In one embodiment, the encapsulatable package for the magnetic device includes a shielding structure located about the magnetic core configured to create a chamber thereabout and configured to limit an encapsulant entering the chamber. The encapsulatable package for the magnetic device also includes a baffle within the chamber configured to direct the encapsulant away from the magnetic core.

Abstract: An assembly and method for installing a back-band utilize ratchet straps and pawl members interconnected with the back band and cockpit area of a kayak. The pawl member may be mounted to either the back-band or kayak. The ratchet strap has a first end insertable in the pawl members, and inclined teeth engage the pawl member. A second end of the ratchet strap is secured to either the kayak or back-band. In addition, a band and buckle assembly may interconnect with the back-band and kayak to support and align the back-band in the kayak cockpit.