Abstract: Mobile terminals include a housing, an electronic circuit and a speaker assembly positioned in the housing. The speaker assembly includes a first speaker positioned adjacent a first side of the electronic circuit and a second speaker positioned adjacent the first speaker on the first side of the electronic circuit. A grommet may be positioned in the housing that is configured to receive the first speaker and the second speaker and the first speaker and the second speaker are positioned in the grommet. The first speaker can be a receiver speaker and the second speaker can be a micro-speaker.

Abstract: Mobile terminals include a housing, an electronic circuit and a speaker assembly positioned in the housing. The speaker assembly includes a first speaker positioned adjacent a first side of the electronic circuit and a second speaker positioned adjacent the first speaker on the first side of the electronic circuit. A grommet may be positioned in the housing that is configured to receive the first speaker and the second speaker and the first speaker and the second speaker are positioned in the grommet. The first speaker can be a receiver speaker and the second speaker can be a micro-speaker.

Abstract: An improved RF shielding device is disclosed. An RF shielding device includes a shield can having sidewalls defining a number of guide tabs thereon enabling the shield can to be inserted within a molding apparatus such that an electrically conductive gasket may be molded directly to the sidewalls of the shield can.

Abstract: A shield including a cover and pins is inserted in a solder-free connection into an electronic substrate for shielding electronic components on the substrate in an electronic device. The shield has a conductive cover, preferably with an integrally formed roof and wall, which defines a cavity. The cavity is configured to receive an electronic component or components positioned therein. The shield also has a conductive mounting pins which extend from the cover. The cover and the pins are preferably formed as a single piece. The shield also preferably includes a conductive gasket connected in a groove in the cover between the cover and the electronic substrate. Methods of assembling the shield on an electronic substrate in forming an electronic package for an electronic device are also provided.