Patents by Inventor John Wesley Hamlin

John Wesley Hamlin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHODS AND APPARATUS FOR MICRO-ELECTRO-MECHANICAL SYSTEMS (MEMS) DEVICES
    Publication number: 20240067519
    Abstract: Example methods, systems, and apparatus described herein provide a minimally invasive technique of controlling shape and stress in a MEMS device. An example method includes depositing a layer of material continuously across a semiconductor wafer, exposing the layer of material to oxygen plasma to increase a relative amount of oxygen within the layer of material; and etching the layer of material after exposing the layer of material to the oxygen plasma.
    Type: Application
    Filed: June 21, 2023
    Publication date: February 29, 2024
    Inventors: John Wesley Hamlin, Kathleen Rose Ferreira, Sean C. O'Brien, Jose A. Martinez
  • MULTI-LEVEL MICROELECTROMECHANICAL SYSTEM STRUCTURE WITH NON-PHOTODEFINABLE ORGANIC POLYMER SPACER LAYERS
    Publication number: 20230127477
    Abstract: In an example, a method includes depositing an organic polymer layer on one or more material layers. The method also includes thermally curing the organic polymer layer. The method includes depositing a hard mask on the organic polymer layer and depositing a photoresist layer on the hard mask. The method also includes patterning the photoresist layer to expose at least a portion of the hard mask. The method includes etching the exposed portion of the hard mask to expose at least a portion of the organic polymer layer. The method also includes etching the exposed portion of the organic polymer layer to expose at least a portion of the one or more material layers.
    Type: Application
    Filed: April 25, 2022
    Publication date: April 27, 2023
    Inventors: Christopher Murray BEARD, Song ZHENG, John Wesley HAMLIN, III, Win-Jae Jessie YUAN, Kelly Jay TAYLOR, Jose Antonio MARTINEZ SOTO
  • SYSTEM AND METHOD FOR ARRAY OF MEMS ELEMENTS
    Publication number: 20230077129
    Abstract: In an example, a method of manufacturing a MEMS device includes forming a via. The method also includes depositing metal in the via and depositing a first layer of a non-photoactive organic polymer on the metal. The method includes baking the first layer of the non-photoactive organic polymer. The method also includes depositing a second layer of the non-photoactive organic polymer on the first layer of the non-photoactive organic polymer after baking the first layer of the non-photoactive organic polymer. The method includes baking the second layer of the non-photoactive organic polymer. The method also includes etching the first layer and the second layer of the non-photoactive organic polymer.
    Type: Application
    Filed: June 17, 2022
    Publication date: March 9, 2023
    Inventors: Sean Christopher O'BRIEN, Kelly Jay TAYLOR, John Wesley HAMLIN, III, Christopher Murray BEARD
  • MEMS via with enhanced electrical and mechanical integrity
    Patent number: 11511989
    Abstract: Described examples include a micromechanical device having a substrate. The micromechanical device includes a MEMS element and a via between the MEMS element and the substrate, the via having a conductive layer extending from the substrate to the MEMS element and having a structural integrity layer on the conductive layer.
    Type: Grant
    Filed: March 6, 2019
    Date of Patent: November 29, 2022
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Earl Vedere Atnip, John Wesley Hamlin, Win Jae Jessie Yuan
  • MEMS VIA WITH ENHANCED ELECTRICAL AND MECHANICAL INTEGRITY
    Publication number: 20200207609
    Abstract: Described examples include a micromechanical device having a substrate. The micromechanical device includes a MEMS element and a via between the MEMS element and the substrate, the via having a conductive layer extending from the substrate to the MEMS element and having a structural integrity layer on the conductive layer.
    Type: Application
    Filed: March 6, 2019
    Publication date: July 2, 2020
    Inventors: Earl Vedere Atnip, John Wesley Hamlin, Win Jae Jessie Yuan