Abstract: An integrated circuit package includes a transmission line structure, wire bonds, a first post and a second post. The transmission line structure runs from a printed circuit board (PCB) to an integrated circuit (IC) and includes a center transmission line between two ground lines and sealed from exposure to air. The wire bonds connect the transmission line structure to pads on the integrated circuit from where the center transmission line exits the integrated circuit package. The wire bonds are selected to have an impedance matched to impedance of the integrated circuit. The first post supports the center transmission line where the center transmission line enters the integrated circuit package from the printed circuit board. The second post supports the center transmission line where the center transmission line exits the integrated circuit package to connect to the wire bonds.

Abstract: An integrated circuit package includes a transmission line structure, conductive bonds, a post and a dielectric post. The transmission line structure runs from a printed circuit board (PCB) to an integrated circuit (IC) and includes a center transmission line surrounded by ground and sealed from exposure to air. The conductive bonds connect the transmission line structure to pads on the integrated circuit from where the center transmission line exits the integrated circuit package. The first post is part of the center transmission line where the center transmission line enters the integrated circuit package from the printed circuit board. The dielectric post supports the center transmission line where the center transmission line exits the integrated circuit package to connect to the conductive bonds and compensates part of the conductive bond inductance.

Abstract: An integrated circuit package includes a transmission line structure, conductive bonds, a post and a dielectric post. The transmission line structure runs from a printed circuit board (PCB) to an integrated circuit (IC) and includes a center transmission line surrounded by ground and sealed from exposure to air. The conductive bonds connect the transmission line structure to pads on the integrated circuit from where the center transmission line exits the integrated circuit package. The first post is part of the center transmission line where the center transmission line enters the integrated circuit package from the printed circuit board. The dielectric post supports the center transmission line where the center transmission line exits the integrated circuit package to connect to the conductive bonds and compensates part of the conductive bond inductance.

Abstract: An integrated circuit package includes a transmission line structure, wire bonds, a first post and a second post. The transmission line structure runs from a printed circuit board (PCB) to an integrated circuit (IC) and includes a center transmission line between two ground lines and sealed from exposure to air. The wire bonds connect the transmission line structure to pads on the integrated circuit from where the center transmission line exits the integrated circuit package. The wire bonds are selected to have an impedance matched to impedance of the integrated circuit. The first post supports the center transmission line where the center transmission line enters the integrated circuit package from the printed circuit board. The second post supports the center transmission line where the center transmission line exits the integrated circuit package to connect to the wire bonds.

Abstract: A hardware accelerator includes hardware support for a combinational only cycle and a latch only cycle in a simulation model with a single partition of latches and combinational logic. Preferred embodiments use a special 4-input 1-output function unit in the hardware accelerator in place of the normal latch function that write back the old latch value for combinational only cycles. Other embodiments include hardware support for separate array write disables for arrays and transparent latches depending on whether the cycle is a combinational only cycle and a latch only cycle. A conditional array write disable dependent on the occurrence of a hardware breakpoint is also included that supports switching from a latch plus combinational cycle to a latch only cycle, to give control to the user before evaluating the combinational logic if a breakpoint occurs on a latch.

Abstract: Water-soluble polymers comprising N-vinyl amide such as an N-vinyl lactam are found to be useful in processes wherein the polymer is introduced into a subterranean wellbore. Polymers useful in the recovery of natural resources are prepared by polymerizing an N-vinyl lactam by free radical initiation with polymerization conducted in an aqueous solution polymerization medium preferably containing a mixture of dissolved electrolytes, or in a polymerization medium consisting essentially of a tertiary alkanol. Copolymers of such N-vinyl lactams with unsaturated amides and terpolymers prepared by polymerizing an N-vinyl lactam and an unsaturated amide with a selected termonomer compound are also useful when prepared by these methods. The invention also broadly encompasses utilizing a water-soluble polymer comprising at least one of a hydrophilic vinyl-containing sulfonate, phosphonate or ester and/or hydrophilic N-vinyl lactam for applications under hostile conditions.

Abstract: Polymerization in-situ to effect permeability contrast correction in oil-bearing subterranean formations comprising the injection of at least one water-soluble monomer comprising N-3-oxohydrocarbon-substituted acrylamides, such as diacetone acrylamide, and optionally at least one water-soluble comonomer, such as alpha,beta-unsaturated amides, alpha,beta-unsaturated nitriles, vinyl-containing sulfonates and N-vinyl amides and polymerization initiator to cause polymerization and formation of water-insoluble polymers in high permeability zones.

Abstract: Aluminum phosphate having reduced fines is produced by gelling said aluminum phosphate in the presence of an acrylamide polymer. The resulting support is of primary utility as a base for a chromium olefin polymerization catalyst but is also suitable as a support for titanium catalysts such as TiCl.sub.3, TiCl.sub.4 /MgCl.sub.2 and other conventional catalysts typically associated with polymerization of propylene.