Abstract: An integrated circuit package includes a transmission line structure, wire bonds, a first post and a second post. The transmission line structure runs from a printed circuit board (PCB) to an integrated circuit (IC) and includes a center transmission line between two ground lines and sealed from exposure to air. The wire bonds connect the transmission line structure to pads on the integrated circuit from where the center transmission line exits the integrated circuit package. The wire bonds are selected to have an impedance matched to impedance of the integrated circuit. The first post supports the center transmission line where the center transmission line enters the integrated circuit package from the printed circuit board. The second post supports the center transmission line where the center transmission line exits the integrated circuit package to connect to the wire bonds.

Abstract: An integrated circuit package includes a transmission line structure, conductive bonds, a post and a dielectric post. The transmission line structure runs from a printed circuit board (PCB) to an integrated circuit (IC) and includes a center transmission line surrounded by ground and sealed from exposure to air. The conductive bonds connect the transmission line structure to pads on the integrated circuit from where the center transmission line exits the integrated circuit package. The first post is part of the center transmission line where the center transmission line enters the integrated circuit package from the printed circuit board. The dielectric post supports the center transmission line where the center transmission line exits the integrated circuit package to connect to the conductive bonds and compensates part of the conductive bond inductance.

Abstract: An integrated circuit package includes a transmission line structure, conductive bonds, a post and a dielectric post. The transmission line structure runs from a printed circuit board (PCB) to an integrated circuit (IC) and includes a center transmission line surrounded by ground and sealed from exposure to air. The conductive bonds connect the transmission line structure to pads on the integrated circuit from where the center transmission line exits the integrated circuit package. The first post is part of the center transmission line where the center transmission line enters the integrated circuit package from the printed circuit board. The dielectric post supports the center transmission line where the center transmission line exits the integrated circuit package to connect to the conductive bonds and compensates part of the conductive bond inductance.

Abstract: An integrated circuit package includes a transmission line structure, wire bonds, a first post and a second post. The transmission line structure runs from a printed circuit board (PCB) to an integrated circuit (IC) and includes a center transmission line between two ground lines and sealed from exposure to air. The wire bonds connect the transmission line structure to pads on the integrated circuit from where the center transmission line exits the integrated circuit package. The wire bonds are selected to have an impedance matched to impedance of the integrated circuit. The first post supports the center transmission line where the center transmission line enters the integrated circuit package from the printed circuit board. The second post supports the center transmission line where the center transmission line exits the integrated circuit package to connect to the wire bonds.

Abstract: Gypsum wallboard can be made lighter and less dense, without sacrificing strength, by adding to the gypsum slurry used in making the board a styrene butadiene polymer latex substantially stable against divalent ions in which the styrene butadiene polymer includes at least 0.25 wt. % of an ionic monomer.

Abstract: A latex binder for a pigmented paper coating, the latex including particles of an emulsion copolymer comprising (i) from about 15 to about 35 weight % mer units deriving from the polymerization of acrylonitrile; (ii) from about 25 to about 65 weight % mer units deriving from the polymerization of conjugated diene monomer; and (iii) from about 5 to about 55 weight % mer units deriving from the polymerization of alkenyl aromatic monomer, based upon the total weight of the mer units within the particle.

Abstract: A latex binder for a pigmented paper coating, the latex including particles of an emulsion copolymer comprising (i) from about 15 to about 35 weight % mer units deriving from the polymerization of acrylonitrile; (ii) from about 25 to about 65 weight % mer units deriving from the polymerization of conjugated diene monomer; and (iii) from about 5 to about 55 weight % mer units deriving from the polymerization of alkenyl aromatic monomer, based upon the total weight of the mer units within the particle.

Abstract: Gypsum wallboard can be made lighter and less dense, without sacrificing strength, by adding to the gypsum slurry used in making the board a styrene butadiene polymer latex substantially stable against divalent ions in which the styrene butadiene polymer includes at least 0.25 wt. % of an ionic monomer.

Abstract: A polymer latex suitable for use in gypsum wallboard or other applications. The polymer latex is a styrene butadiene latex that is substantially stable against divalent ions. The polymer latex includes styrene, butadiene, and an ionic monomer comprised of a 2-acrylamido-2-methyl propanesulfonic acid salt. The polymer latex may also include hydrophilic adjunct comonomers. The latex includes at least 0.25 wt. % of the ionic monomer.

Abstract: A latex composition having a polymodal particle size distribution. The latex composition is useful in paper coatings.

Abstract: A polymer latex suitable for use in gypsum wallboard or other applications. The polymer latex is a styrene butadiene latex that is substantially stable against divalent ions. The polymer latex includes styrene, butadiene, and an ionic monomer comprised of a 2-acrylamido-2-methyl propanesulfonic acid salt. The polymer latex may also include hydrophilic adjunct comonomers. The latex includes at least 0.25 wt. % of the ionic monomer.

Abstract: A hardware accelerator includes hardware support for a combinational only cycle and a latch only cycle in a simulation model with a single partition of latches and combinational logic. Preferred embodiments use a special 4-input 1-output function unit in the hardware accelerator in place of the normal latch function that write back the old latch value for combinational only cycles. Other embodiments include hardware support for separate array write disables for arrays and transparent latches depending on whether the cycle is a combinational only cycle and a latch only cycle. A conditional array write disable dependent on the occurrence of a hardware breakpoint is also included that supports switching from a latch plus combinational cycle to a latch only cycle, to give control to the user before evaluating the combinational logic if a breakpoint occurs on a latch.

Abstract: A polyvinyl alcohol copolymer latex composition comprises an intimate polymer composition obtained from 10% to 60% by weight of a substantially hydrolyzed low molecular weight polyvinyl alcohol (PVOH); 2% to 80% by weight of at least one diene; 2% to 80% by weight of at least one hydrophobic monomer other than a diene and optionally either up to 10% by weight of at least one hydrophilic ethylenically unsaturated acid monomer or up to 40% by weight of a cationic monomer. The copolymer latex composition can be prepared as an emulsion from an aqueous blend of the above listed monomers which are generally added at various stages during the polymerization and a free radical initiator, surfactants, and, if desirable, chain transfer agents. Up to 80% of the PVOH may be added after the monomers have been polymerized.

Abstract: Gypsum wallboard can be made lighter and less dense, without sacrificing strength, by adding to the gypsum slurry used in making the board a styrene butadiene polymer latex substantially stable against divalent ions in which the styrene butadiene polymer includes at least 0.25 wt. % of an ionic monomer.

Abstract: A polyvinyl alcohol copolymer latex composition comprises an intimate polymer composition obtained from 10% to 60% by weight of a substantially hydrolyzed low molecular weight polyvinyl alcohol (PVOH); 2% to 80% by weight of at least one diene; 2% to 80% by weight of at least one hydrophobic monomer other than a diene and optionally either up to 10% by weight of at least one hydrophilic ethylenically unsaturated acid monomer or up to 40% by weight of a cationic monomer. The copolymer latex composition can be prepared as an emulsion from an aqueous blend of the above listed monomers which are generally added at various stages during the polymerization and a free radical initiator, surfactants, and, if desirable, chain transfer agents. Up to 80% of the PVOH may be added after the monomers have been polymerized.

Abstract: A cement composition comprising a polymeric latex prepared by aqueous emulsion polymerization of a monomeric mixture comprising styrene and butadiene in the presence of a seed polymer prepared by aqueous emulsion polymerization of styrene and a salt of 2-acrylamido-2-methylpropanesulfonic acid.

Abstract: A polymeric latex prepared by aqueous emulsion polymerization of a monomeric mixture comprising styrene and butadiene in the presence of a seed polymer prepared by aqueous emulsion polymerization of styrene and a salt of 2-acrylamido-2-methylpropanesulfonic acid.

Abstract: A polymeric latex prepared by aqueous emulsion polymerization of a monomeric mixture comprising styrene and butadiene in the presence of a seed polymer prepared by aqueous emulsion polymerization of styrene and a salt of 2-acrylamido-2-methylpropanesulfonic acid.

Abstract: A polymeric latex prepared by aqueous emulsion polymerization of a monomeric mixture comprising styrene and butadiene in the presence of a seed polymer prepared by aqueous emulsion polymerization of styrene and a salt of 2-acrylamido-2-methylpropanesulfonic acid.

Abstract: A polymeric latex prepared by aqueous emulsion polymerization of a monomeric mixture comprising styrene and butadiene in the presence of a seed polymer prepared by aqueous emulsion polymerization of styrene and a salt of 2-acrylamido-2-methylpropanesulfonic acid.