Patents by Inventor John Whitman

John Whitman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250042136
    Abstract: A variable transmission element includes a first substrate that has a first surface and a second surface opposite the first surface. A second substrate includes a third surface and a fourth surface opposite the third surface. The first and second surfaces face each other and are disposed in a spaced apart relationship so as to define a space therebetween. A seal formed of a sealing material extends along a perimeter of the first and second substrates. A first lamination layer comprises a first lamination material that is different from the sealing material and the first lamination layer is coupled to the second surface. A second lamination layer comprises a second lamination material that is different from the sealing material and the second lamination layer is coupled to the second substrate. An electro-optic device is disposed between the first lamination layer and the second lamination layer.
    Type: Application
    Filed: August 2, 2024
    Publication date: February 6, 2025
    Applicant: Gentex Corporation
    Inventors: Joel A. Stray, Matthew A. Koppey, Eric A. Gobrogge, Michael T. Stephenson, Derek J. Marshall, Andrew T. Mitchell, Brandon W. Whitman, Jason A. Musthaler, Erik John Larkin Helton
  • Publication number: 20170226468
    Abstract: Methods of inducing or increasing lipid and protein production in microalgae are disclosed. Methods of enhancing microalgae biomass are also disclosed. The methods may comprise inoculating a culture media with microalgae and propagating the microalgae under heterotrophic growth conditions. The heterotrophic growth conditions may comprise inhibiting exposure of the inoculated culture media to light. The methods may further comprise delivering oxygen into the inoculated culture media. Additionally, lipids, proteins, and other cellular components may be isolated and purified from microalgae cultivated under the disclosed methods.
    Type: Application
    Filed: April 25, 2017
    Publication date: August 10, 2017
    Applicant: ENTECH, LLC
    Inventors: John Whitman, Robert G. Barton, Michael Ripka, III, Michael Ripka, JR., Robert L. Harris
  • Patent number: 9670454
    Abstract: Methods of inducing or increasing lipid and protein production in microalgae are disclosed. Methods of enhancing microalgae biomass are also disclosed. The methods may comprise inoculating a culture media with microalgae and propagating the microalgae under heterotrophic growth conditions. The heterotrophic growth conditions may comprise inhibiting exposure of the inoculated culture media to light. The methods may further comprise delivering oxygen into the inoculated culture media. Additionally, lipids, proteins, and other cellular components may be isolated and purified from microalgae cultivated under the disclosed methods.
    Type: Grant
    Filed: August 8, 2016
    Date of Patent: June 6, 2017
    Assignee: Entech, LLC
    Inventors: John Whitman, Robert G. Barton, Michael Ripka, III, Michael Ripka, Jr., Robert L. Harris
  • Publication number: 20160348062
    Abstract: Methods of inducing or increasing lipid and protein production in microalgae are disclosed. Methods of enhancing microalgae biomass are also disclosed. The methods may comprise inoculating a culture media with microalgae and propagating the microalgae under heterotrophic growth conditions. The heterotrophic growth conditions may comprise inhibiting exposure of the inoculated culture media to light. The methods may further comprise delivering oxygen into the inoculated culture media. Additionally, lipids, proteins, and other cellular components may be isolated and purified from microalgae cultivated under the disclosed methods.
    Type: Application
    Filed: August 8, 2016
    Publication date: December 1, 2016
    Applicant: ENTECH, LLC
    Inventors: John Whitman, Robert G. Barton, Michael Ripka, III, Michael Ripka, JR., Robert L. Harris
  • Patent number: 9441197
    Abstract: Methods of inducing or increasing lipid and protein production in microalgae are disclosed. Methods of enhancing microalgae biomass are also disclosed. The methods may comprise inoculating a culture media with microalgae and propagating the microalgae under heterotrophic growth conditions. The heterotrophic growth conditions may comprise inhibiting exposure of the inoculated culture media to light. The methods may further comprise delivering oxygen into the inoculated culture media. Additionally, lipids, proteins, and other cellular components may be isolated and purified from microalgae cultivated under the disclosed methods.
    Type: Grant
    Filed: April 30, 2015
    Date of Patent: September 13, 2016
    Assignee: ENTECH, LLC
    Inventors: John Whitman, Robert G. Barton, Michael Ripka, III, Michael Ripka, Jr., Robert L. Harris
  • Publication number: 20150315538
    Abstract: Methods of inducing or increasing lipid and protein production in microalgae are disclosed. Methods of enhancing microalgae biomass are also disclosed. The methods may comprise inoculating a culture media with microalgae and propagating the microalgae under heterotrophic growth conditions. The heterotrophic growth conditions may comprise inhibiting exposure of the inoculated culture media to light. The methods may further comprise delivering oxygen into the inoculated culture media. Additionally, lipids, proteins, and other cellular components may be isolated and purified from microalgae cultivated under the disclosed methods.
    Type: Application
    Filed: April 30, 2015
    Publication date: November 5, 2015
    Inventors: John Whitman, Robert G. Barton, Michael Ripka, III, Michael Ripka, JR., Robert L. Harris
  • Patent number: 7202138
    Abstract: A method for spinning a material onto a semiconductor device structure so as to substantially fill recesses formed in a surface of the semiconductor device structure and to impart the material with a substantially planar surface and semiconductor device structures formed thereby. The thickness of the material covering the surface is less than the depth of the recesses. The surface may remain substantially uncovered by the material.
    Type: Grant
    Filed: November 28, 2001
    Date of Patent: April 10, 2007
    Assignee: Micron Technology, Inc.
    Inventors: John Whitman, John Davlin
  • Publication number: 20070004221
    Abstract: Methods for partially or substantially filling recesses (e.g., capacitor containers, shallow trenches for formation of shallow trench isolation (STI) structures, etc.) That communicate with a surface of the semiconductor device structure include applying material to a surface of the semiconductor device structure and spreading the material. The thickness of the material covering the surface may be less than (e.g., about half of or less than half of) the depths of the recesses. The surface may remain substantially uncovered by the material.
    Type: Application
    Filed: September 8, 2006
    Publication date: January 4, 2007
    Inventors: John Whitman, John Davlin
  • Publication number: 20070004219
    Abstract: A method for fabricating a semiconductor device structure includes applying a stress buffer material onto a semiconductor device structure and spreading the stress buffer material. When the stress buffer material is spread, it substantially fills recesses formed in a surface of the semiconductor device structure and imparts the stress buffer material with a substantially planar surface. The thickness of the stress buffer material covering the surface of the semiconductor device structure may be less than the depths of the recesses. The surface may remain substantially uncovered by the material.
    Type: Application
    Filed: September 8, 2006
    Publication date: January 4, 2007
    Inventors: John Whitman, John Davlin
  • Patent number: 7101771
    Abstract: A method for spinning a material onto a semiconductor device structure so as to substantially fill recesses formed in a surface of the semiconductor device structure and to impart the material with a substantially planar surface and semiconductor device structures formed thereby. The thickness of the material covering the surface is less than the depth of the recesses. The surface may remain substantially uncovered by the material.
    Type: Grant
    Filed: November 28, 2001
    Date of Patent: September 5, 2006
    Assignee: Micron Technology, Inc.
    Inventors: John Whitman, John Davlin
  • Publication number: 20050194661
    Abstract: A method and apparatus is provided for more efficient application of photoresist to a wafer surface. One aspect of the method comprises applying solvent to the wafer and spinning it to coat the entire wafer surface prior to the application of photoresist. This reduces surface tension on the wafer and reduces the amount of resist required to achieve a high quality film. The apparatus comprises adding a third solenoid and nozzle to the coating unit to accommodate the application of solvent to the center of the wafer surface. The method also describes incorporating a new solvent comprising diacetone alcohol, which is a low-pressure solvent, providing extended process latitudes and reduced material expenditures.
    Type: Application
    Filed: April 26, 2005
    Publication date: September 8, 2005
    Inventor: John Whitman
  • Patent number: 6884462
    Abstract: A method and apparatus is provided for more efficient application of photoresist to a wafer surface. One aspect of the method comprises applying solvent to the wafer and spinning it to coat the entire wafer surface prior to the application of photoresist. This reduces surface tension on the wafer and reduces the amount of resist required to achieve a high quality film. The apparatus comprises adding a third solenoid and nozzle to the coating unit to accommodate the application of solvent to the center of the wafer surface. The method also describes incorporating a new solvent comprising diacetone alcohol, which is a low-pressure solvent, providing extended process latitudes and reduced material expenditures.
    Type: Grant
    Filed: April 30, 2004
    Date of Patent: April 26, 2005
    Assignee: Micron Technology, Inc.
    Inventor: John Whitman
  • Publication number: 20050003087
    Abstract: A method and apparatus is provided for more efficient application of photoresist to a wafer surface. One aspect of the method comprises applying solvent to the wafer and spinning it to coat the entire wafer surface prior to the application of photoresist. This reduces surface tension on the wafer and reduces the amount of resist required to achieve a high quality film. The apparatus comprises adding a third solenoid and nozzle to the coating unit to accommodate the application of solvent to the center of the wafer surface. The method also describes incorporating a new solvent comprising diacetone alcohol, which is a low-pressure solvent, providing extended process latitudes and reduced material expenditures.
    Type: Application
    Filed: April 30, 2004
    Publication date: January 6, 2005
    Inventor: John Whitman
  • Patent number: 6758908
    Abstract: A method and apparatus is provided for more efficient application of photoresist to a wafer surface. One aspect of the method comprises applying solvent to the wafer and spinning it to coat the entire wafer surface prior to the application of photoresist. This reduces surface tension on the wafer and reduces the amount of resist required to achieve a high quality film. The apparatus comprises adding a third solenoid and nozzle to the coating unit to accommodate the application of solvent to the center of the wafer surface. The method also describes incorporating a new solvent comprising diacetone alcohol, which is a low-pressure solvent, providing extended process latitudes and reduced material expenditures.
    Type: Grant
    Filed: August 29, 2001
    Date of Patent: July 6, 2004
    Assignee: Micron Technology, Inc.
    Inventor: John Whitman
  • Patent number: 6579471
    Abstract: A method and apparatus is provided for more efficient application of photoresist to a wafer surface. One aspect of the method comprises applying solvent to the wafer and spinning it to coat the entire wafer surface prior to the application of photoresist. This reduces surface tension on the wafer and reduces the amount of resist required to achieve a high quality film. The apparatus comprises adding a third solenoid and nozzle to the coating unit to accommodate the application of solvent to the center of the wafer surface. The method also describes incorporating a new solvent comprising diacetone alcohol, which is a low-pressure solvent, providing extended process latitudes and reduced material expenditures.
    Type: Grant
    Filed: August 29, 2001
    Date of Patent: June 17, 2003
    Assignee: Micron Technology, Inc.
    Inventor: John Whitman
  • Publication number: 20020064967
    Abstract: A method for spinning a material onto a semiconductor device structure so as to substantially fill recesses formed in a surface of the semiconductor device structure and to impart the material with a substantially planar surface and semiconductor device structures formed thereby. The thickness of the material covering the surface is less than the depth of the recesses. The surface may remain substantially uncovered by the material.
    Type: Application
    Filed: November 28, 2001
    Publication date: May 30, 2002
    Inventors: John Whitman, John Davlin
  • Publication number: 20020034884
    Abstract: A method for spinning a material onto a semiconductor device structure so as to substantially fill recesses formed in a surface of the semiconductor device structure and to impart the material with a substantially planar surface and semiconductor device structures formed thereby. The thickness of the material covering the surface is less than the depth of the recesses. The surface may remain substantially uncovered by the material.
    Type: Application
    Filed: November 28, 2001
    Publication date: March 21, 2002
    Inventors: John Whitman, John Davlin
  • Publication number: 20020005539
    Abstract: A method for spinning a material onto a semiconductor device structure so as to substantially fill recesses formed in a surface of the semiconductor device structure and to impart the material with a substantially planar surface and semiconductor device structures formed thereby. The thickness of the material covering the surface is less than the depth of the recesses. The surface may remain substantially uncovered by the material.
    Type: Application
    Filed: August 30, 2001
    Publication date: January 17, 2002
    Inventors: John Whitman, John Davlin
  • Publication number: 20020006474
    Abstract: A method and apparatus is provided for more efficiently application of photoresist to a wafer surface. One aspect of the method comprises applying solvent to the wafer and spinning it to coat the entire wafer surface prior to the application of photoresist. This reduces surface tension on the wafer and reduces the amount of resist required to achieve a high quality film. The apparatus comprises adding a third solenoid and nozzle to the coating unit to accommodate the application of solvent to the center of the wafer surface. The method also describes incorporating a new solvent comprising Di-Acetone Alcohol, which is a low-pressure solvent, providing extended process latitudes and reduced material expenditures.
    Type: Application
    Filed: August 29, 2001
    Publication date: January 17, 2002
    Applicant: Micron Technology, Inc.
    Inventor: John Whitman
  • Publication number: 20020006473
    Abstract: A method and apparatus is provided for more efficiently application of photoresist to a wafer surface. One aspect of the method comprises applying solvent to the wafer and spinning it to coat the entire wafer surface prior to the application of photoresist. This reduces surface tension on the wafer and reduces the amount of resist required to achieve a high quality film. The apparatus comprises adding a third solenoid and nozzle to the coating unit to accommodate the application of solvent to the center of the wafer surface. The method also describes incorporating a new solvent comprising Di-Acetone Alcohol, which is a low-pressure solvent, providing extended process latitudes and reduced material expenditures.
    Type: Application
    Filed: August 29, 2001
    Publication date: January 17, 2002
    Applicant: Micron Technology, Inc.
    Inventor: John Whitman