Patents by Inventor John William Reeds, III

John William Reeds, III has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6513380
    Abstract: Disclosed is a MEMS sensor including a sense element and a single anchor that supports the sense element arranged in a central hub-like fashion that reduces the effects of thermal stress. Usually, two or more anchors are required to suitably constrain the sense element's motion. The anchor disclosed herein, however, supports the sense element with connection elements having a connection geometry that substantially limits the motion of the sense element to a single-degree-of-freedom. The connection elements may include, for example, converging flexures, an extender bar, or both.
    Type: Grant
    Filed: June 19, 2001
    Date of Patent: February 4, 2003
    Assignee: Microsensors, Inc.
    Inventors: John William Reeds, III, Ying Wen Hsu, Phu Cu Dao