Patents by Inventor John Y. Chen

John Y. Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10439870
    Abstract: Systems and methods for allocating computing resources for a multi-tiered application are disclosed. A computer-implemented method includes: determining, by a computing device, a topology of a multi-tiered application; determining, by the computing device, a modeled setting of a computing resource for the multi-tiered application based on the determined topology; determining, by the computing device, an actual usage of the computing resource by the multi-tiered application; and adjusting, by the computing device, an allocation of the computing resource to the multi-tiered application based on the actual usage and the modeled setting.
    Type: Grant
    Filed: November 24, 2015
    Date of Patent: October 8, 2019
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Danny Y. Chen, David A. Cox, Brent R. Phillips, John H. Smith
  • Patent number: 10432745
    Abstract: Devices and techniques for accelerated packet processing are described herein. The device can match an action to a portion of a network data packet and accelerate the packet-processing pipeline for the network data packet through the machine by processing the action.
    Type: Grant
    Filed: January 24, 2018
    Date of Patent: October 1, 2019
    Assignee: Intel Corporation
    Inventors: Daniel Daly, John R. Fastabend, Matthew Vick, Brian J. Skerry, Marco Varlese, Jing Mark Chen, Danny Y. Zhou
  • Patent number: 9728481
    Abstract: An IC system includes low-power chips, e.g., memory chips, located proximate one or more higher power chips, e.g., logic chips, without suffering the effects of overheating. The IC system may include a high-power chip disposed on a packaging substrate and a low-power chip embedded in the packaging substrate to form a stack. Because portions of the packaging substrate thermally insulate the low-power chip from the high-power chip, the low-power chip can be embedded in the IC system in close proximity to the high-power chip without being over heated by the high-power chip. Such close proximity between the low-power chip and the high-power chip advantageously shortens the path length of interconnects therebetween, which improves device performance and reduces interconnect parasitics in the IC system.
    Type: Grant
    Filed: September 7, 2011
    Date of Patent: August 8, 2017
    Assignee: NVIDIA Corporation
    Inventors: Abraham F. Yee, Joe Greco, Jun Zhai, Joseph Minacapelli, John Y. Chen
  • Publication number: 20140339706
    Abstract: An integrated circuit package includes an interposer and an integrated circuit die. The interposer is formed from a layer of semiconductor material that is separated from a bulk portion of a semiconductor substrate, and the integrated circuit die is coupled to the interposer. Vias in the interposer can be formed in the thin layer of semiconductor material removed from the semiconductor substrate, and therefore can be scaled down significantly in size. Such reduced-size, through-interposer vias can be etched and filled much more cost-effectively and result in greatly reduced parasitic capacitance in the integrated circuit package.
    Type: Application
    Filed: May 17, 2013
    Publication date: November 20, 2014
    Applicant: NVIDIA CORPORATION
    Inventors: Abraham F. YEE, John Y. CHEN
  • Publication number: 20130058067
    Abstract: An IC system includes low-power chips, e.g., memory chips, located proximate one or more higher power chips, e.g., logic chips, without suffering the effects of overheating. The IC system may include a high-power chip disposed on a packaging substrate and a low-power chip embedded in the packaging substrate to form a stack. Because portions of the packaging substrate thermally insulate the low-power chip from the high-power chip, the low-power chip can be embedded in the IC system in close proximity to the high-power chip without being over heated by the high-power chip. Such close proximity between the low-power chip and the high-power chip advantageously shortens the path length of interconnects therebetween, which improves device performance and reduces interconnect parasitics in the IC system.
    Type: Application
    Filed: September 7, 2011
    Publication date: March 7, 2013
    Inventors: Abraham F. YEE, Joe Greco, Jun Zhai, Joseph Minacapelli, John Y. Chen
  • Publication number: 20130020640
    Abstract: A structure making up a part of a semiconductor device, such as a fin structure of a finFET device, is formed on and electrically isolated from a semiconductor substrate. The structure is comprised of the semiconductor substrate material and is electrically isolated from a remaining portion of the semiconductor substrate by an insulating barrier. The insulating barrier is formed by an isotropic oxidation process that oxidizes portions of the semiconductor substrate that are not protected by an oxidation barrier.
    Type: Application
    Filed: July 18, 2011
    Publication date: January 24, 2013
    Inventors: John Y. CHEN, Boon-Khim Liew
  • Patent number: 7930782
    Abstract: A tear and fatigue resistant gels, gel composites, and gel articles including collapsible articles having two or more communicating internal volumes like cavities when depressed by external pressure or force is capable of collapsing unto itself in a controllable and directionally preselected manner by venting static air within said internal through openings in said gel article, said gel of said article having rigidity of from about 20 gram Bloom to about 1,800 gram Bloom suitable for cushioning, cushioning composites, cushioning gel liners, cushioning composite gel liners, and other uses of selected shape gels, gel composites, and articles.
    Type: Grant
    Filed: June 5, 2007
    Date of Patent: April 26, 2011
    Assignee: Applied Elastomerics, Inc.
    Inventor: John Y. Chen
  • Patent number: 7661164
    Abstract: A tear and fatigue resistant gel article comprising two or more communicating internal volumes like cavities when depressed by external pressure or force is capable of collapsing unto itself in a controllable and directionally preselected manner by venting static air within said internal through openings in said gel article, said gel article is made from gel compositions having rigidity of from about 20 gram Bloom to about 1,800 gram Bloom suitable for cushioning and other uses.
    Type: Grant
    Filed: April 12, 2007
    Date of Patent: February 16, 2010
    Assignee: Applied Elastomerics, Inc.
    Inventor: John Y. Chen
  • Patent number: 7344568
    Abstract: Tear and fatique resistant SEEPS gels useful for making liners for orthotics and prosthetic uses.
    Type: Grant
    Filed: April 21, 2003
    Date of Patent: March 18, 2008
    Assignee: Applied Elastomerics, Inc.
    Inventor: John Y. Chen
  • Patent number: 7290367
    Abstract: A soft gelatinous elastomer composition and article useful as fishing bait, floss, liner and other uses formed from one or a mixture of two or more of a one or a mixture of two or more of a hydrogenated controlled distribution styrene block copolymer(s) and one or more plasticizers being in sufficient amounts to achieve a gel rigidity of from about 20 gram Bloom to about 1,800 gram BlooField of the Invention.
    Type: Grant
    Filed: December 25, 2003
    Date of Patent: November 6, 2007
    Assignee: Applied Elastomerics, Inc.
    Inventor: John Y. Chen
  • Patent number: 7234560
    Abstract: A vehicular safety system comprising an inflatable restraint gel cushion having a gel rigidity of from about 50 gram Bloom to about 1,200 gram bloom.
    Type: Grant
    Filed: September 30, 2003
    Date of Patent: June 26, 2007
    Assignee: Applied Elastomerics, Inc.
    Inventor: John Y. Chen
  • Patent number: 7226484
    Abstract: Soft, tear resistant gel, gel composites and gel articles for various uses formed from one or a mixture of two or more block copolymers with or without one or more selected other polymers and additives in combination with one or more selected plasticizers being in sufficient amounts to achieve a gel rigidity of from about 20 gram Bloom to about 1,800 gram Bloom.
    Type: Grant
    Filed: August 4, 2004
    Date of Patent: June 5, 2007
    Assignee: Applied Elastomerics, Inc.
    Inventor: John Y. Chen
  • Patent number: 7222380
    Abstract: SEEPS gel and gel foam molded shape articles for use in medical and sport health care, such use include therapeutic hand exercising grips, dental floss, crutch cushions, cervical pillows, bed wedge pillows, leg rest, cushions, mattress, bed pads, elbow padding, dermal pads, wheelchair cushions, helmet liner, cold and hot packs, exercise weight belts, traction pads and belts, cushions for splints, slings, and braces, cushions for the hand, wrist, finger, fore, knee, leg, clavicle, shoulder, foot, ankle, back, rib, soles for orthopedic shoes, and the like.
    Type: Grant
    Filed: April 21, 2003
    Date of Patent: May 29, 2007
    Assignee: Applied Elastomerics, Inc.
    Inventor: John Y. Chen
  • Patent number: 7208184
    Abstract: A soft gelatinous food elastomer composition and article useful as fishing bait formed from one or a mixture of two or more of a thermoplastic elastomer block copolymers) and one or more plasticizers and a food or components of food.
    Type: Grant
    Filed: July 20, 2002
    Date of Patent: April 24, 2007
    Assignee: Applied Elastomerics, Inc.
    Inventor: John Y. Chen
  • Patent number: 7193002
    Abstract: Adherent gels and adherent gel composites which can be made by applying an adherent gel onto one or more selected substrates of foam, plastic, fabric, metal, concrete, wood, wire screen, refractory material, glass, synthetic resin, synthetic fibers, and the like. Such adherent gels and gel composites are useful for protecting articles, the body and skin.
    Type: Grant
    Filed: April 21, 2003
    Date of Patent: March 20, 2007
    Assignee: Applied Elastomerics, Inc.
    Inventor: John Y. Chen
  • Patent number: 7159259
    Abstract: Novel gelatinous compositions and articles are formed from an intimate melt blend admixture of one or more of a selected block SEEPS copolymers in combination with one or more polymers of poly(styrene-butadiene-styrene), poly(styrene-butadiene)n, poly(styrene-isoprene-styrene), poly(styrene-isoprene)n, poly(styrene-ethylene-propylene), poly(styrene-ethylene-propylene-styrene)n, poly(styrene-ethylene-butylene-styrene)n, poly(styrene-ethylene-butylene), poly(styrene-ethylene-propylene)n, poly(styrene-ethylene-butylene)n, polystyrene, polybutylene, poly(ethylene-propylene), poly(ethylene-butylene), polypropylene, and polyethylene, and a plasticizing oil.
    Type: Grant
    Filed: December 31, 2002
    Date of Patent: January 9, 2007
    Assignee: Applied Elastomerics, Inc.
    Inventor: John Y. Chen
  • Patent number: 7134236
    Abstract: A non-tacky fishing bait made from a soft gelatinous elastomer composition comprising one or more of a linear, radial or multiblock copolymer(s) and in combination with one or more of a low and high viscosity plasticizers in sufficient amounts to achieve a gel rigidity of from about 20 gram Bloom to about 800 gram Bloom.
    Type: Grant
    Filed: July 20, 2002
    Date of Patent: November 14, 2006
    Assignee: Applied Elastomerics, Inc.
    Inventor: John Y. Chen
  • Patent number: 7134929
    Abstract: Composite gel articles shaped in the form of a body shaped suit for diving made by injection molding, extruding, spinning, casting, or dipping.
    Type: Grant
    Filed: April 21, 2003
    Date of Patent: November 14, 2006
    Assignee: Applied Elastomerics, Inc.
    Inventor: John Y. Chen
  • Patent number: 7108873
    Abstract: A soft gelatinous food elastomer composition and article useful as simulated food formed from one or a mixture of two or more of a thermoplastic elastomer block copolymer(s) and one or more plasticizers and a food or components of food. The plasticizers being in sufficient amounts to achieve a gel rigidity of from about 20 gram Bloom to about 1,800 gram Bloom.
    Type: Grant
    Filed: July 20, 2002
    Date of Patent: September 19, 2006
    Assignee: Applied Elastomerics, Inc.
    Inventor: John Y. Chen
  • Patent number: 7105607
    Abstract: Novel gelatinous compositions, composites, and articles are formed from an intimate melt blend admixture of one or more of a high viscosity poly(styrene-ethylene-butylene-styrene), poly(styrene-ethylene-propylene-styrene), poly(styrene-ethylene-butylene)n, poly(styrene-ethylene)n triblock and branched copolymers and the like, in combination with high levels or one or more selected plasticizing oil(s) to achieve improvements of compression set resistance and low gel tack.
    Type: Grant
    Filed: April 21, 2003
    Date of Patent: September 12, 2006
    Assignee: Applied Elastomerics, Inc.
    Inventor: John Y. Chen