Abstract: Various embodiments implement an electronic design with one or more electrical analyses or simulations. Pre-layout and/or post-layout design data of an electronic design or a portion thereof may be identified at a physical design implementation module. A first stage analysis may be performed on the electronic design or the portion thereof at least by computing electrical characteristics with a reduced representation in the electronic design or the portion thereof. Electrical behavior of the electronic design or the portion thereof may be generated at least by performing a second stage analysis on the electronic design or the portion thereof with one or more adjusted electrical characteristics. The electronic design or the portion thereof may then be implemented based in part or in whole upon the one or more electrical analyses or simulations.

Abstract: Various embodiments implement an electronic design with power gate analyses using time varying resistors. Design data of an electronic design or a portion thereof may be identified at an electronic design implementation module. First stage electrical characteristics may be generated at least by performing a first stage electrical analysis on a reduced representation of the electronic design or the portion thereof. Second stage electrical characteristics may further be generated at least by performing a second stage electrical analysis on a parasitic injected representation of the electronic design or the portion thereof with a time-varying model for the power gate. The electronic design or the portion thereof may then be further implemented based in part or in whole upon the one or more electrical analyses or simulations.

Abstract: A system, method, and computer program product is disclosed for performing electrical analysis of a circuit design. A voltage-based approach is described for performing two-stage transient EM-IR drop analysis of an electronic design. A two-stage approach is performed in some embodiments, in which the first stage operates by calculating the voltage at certain interface nodes. In the second stage, simulation is performed to simulate the circuit to concurrently obtain the current at the interface nodes. In some embodiments, multiple adjacent devices as identified as interface devices for purposes of the analysis. One situation where it may be useful to analyze a larger portion of the circuitry in this way where the analysis is being performed on a netlist having a power gate.

Abstract: A thermally aware design automation suite integrates system-level thermal awareness into design of semiconductor chips, performing fine-grain static and/or transient thermal simulations of the chips based on thermal models and boundary conditions. The thermal simulations are performed in accordance with one or more grids, with boundaries and/or resolutions being determined by adaptive and/or hierarchical multi-dimensional techniques. The adaptive grid techniques include material-boundary, rate-of-change, and convergence-information heuristics. For example, a finer grid is used in a region having higher temperature gradients compared to a region having lower temperature gradients. The hierarchical grid techniques are based on critical, intermediate, and boundary regions specified manually or automatically, each region having a respective grid resolution.

Abstract: Transient thermal simulation of semiconductor chips uses region-wise variable spatial grids and variable temporal intervals, enabling spatio-temporal thermal analysis of semiconductor chips. Temperature rates of change across a die and/or package of an integrated circuit are computed and tracked versus time. Critical time interval(s) for temperature evaluation are determined. Temperatures of elements, components, devices, and interconnects are updated based on a 3D full chip temperature analysis. Respective power dissipations are updated, as a function of the temperatures, with an automated interface to one or more circuit simulation tools. Subsequently new temperatures are determined as a function of the power dissipations. User definable control and observation parameters enable flexible and efficient transient thermal analysis. The parameters relate to power sources, monitoring, reporting, error tolerances, and output snapshots.

Abstract: A thermally aware design automation suite integrates system-level thermal awareness into design of semiconductor chips, performing fine-grain static and/or transient thermal simulations of the chips based on thermal models and boundary conditions. The thermal simulations are performed in accordance with one or more grids, with boundaries and/or resolutions being determined by adaptive and/or hierarchical multi-dimensional techniques. The adaptive grid techniques include material-boundary, rate-of-change, and convergence-information heuristics. For example, a finer grid is used in a region having higher temperature gradients compared to a region having lower temperature gradients. The hierarchical grid techniques are based on critical, intermediate, and boundary regions specified manually or automatically, each region having a respective grid resolution.