Abstract: Interposer printed circuit boards for power modules and associated methods are disclosed. In at least one illustrative embodiment, a printed circuit board assembly may comprise a printed circuit board, an electrical component mounted on a surface of the printed circuit board, and an interposer printed circuit board mounted on the surface of the printed circuit board. The interposer printed circuit board may comprise a first signal path to transmit a first electrical signal and a second signal path to transmit a second electrical signal that is different from the first electrical signal. The interposer printed circuit board may be configured to provide a standoff to prevent the electrical component from contacting a motherboard when the printed circuit board assembly is mounted to the motherboard.

Abstract: Interposer printed circuit boards for power modules and associated methods are disclosed. In at least one illustrative embodiment, a printed circuit board assembly may comprise a printed circuit board having a surface, an electrical component mounted on the surface, a pin mounted on the surface, and an interposer printed circuit board mounted on the surface. The electrical component may have a first height orthogonal to the surface. The pin may have a second height orthogonal to the surface, where the second height is greater than the first height. The interposer printed circuit board may comprise a pad and an outer solder bump positioned on the pad. The outer solder bump may be positioned at a third height orthogonal to the surface, where the third height is greater than the first height.

Abstract: Interposer printed circuit boards for power modules and associated methods are disclosed. In at least one illustrative embodiment, a printed circuit board assembly may comprise a printed circuit board having a surface, an electrical component mounted on the surface, a pin mounted on the surface, and an interposer printed circuit board mounted on the surface. The electrical component may have a first height orthogonal to the surface. The pin may have a second height orthogonal to the surface, where the second height is greater than the first height. The interposer printed circuit board may comprise a pad and an outer solder bump positioned on the pad. The outer solder bump may be positioned at a third height orthogonal to the surface, where the third height is greater than the first height.

Abstract: Interposer printed circuit boards for power modules and associated methods are disclosed. In at least one illustrative embodiment, a printed circuit board assembly may comprise a printed circuit board having a surface, an electrical component mounted on the surface, a pin mounted on the surface, and an interposer printed circuit board mounted on the surface. The electrical component may have a first height orthogonal to the surface. The pin may have a second height orthogonal to the surface, where the second height is greater than the first height. The interposer printed circuit board may comprise a pad and an outer solder bump positioned on the pad. The outer solder bump may have a third height orthogonal to the surface, where the third height is greater than the first height.

Abstract: Interposer printed circuit boards for power modules and associated methods are disclosed. In at least one illustrative embodiment, a printed circuit board assembly may comprise a printed circuit board having a surface, an electrical component mounted on the surface, a pin mounted on the surface, and an interposer printed circuit board mounted on the surface. The electrical component may have a first height orthogonal to the surface. The pin may have a second height orthogonal to the surface, where the second height is greater than the first height. The interposer printed circuit board may comprise a pad and an outer solder bump positioned on the pad. The outer solder bump may have a third height orthogonal to the surface, where the third height is greater than the first height.

Abstract: Interposer printed circuit boards for power modules and associated methods are disclosed. In at least one illustrative embodiment, a printed circuit board assembly may comprise a printed circuit board, an electrical component mounted on a surface of the printed circuit board, and an interposer printed circuit board mounted on the surface of the printed circuit board. The interposer printed circuit board may comprise a first signal path to transmit a first electrical signal and a second signal path to transmit a second electrical signal that is different from the first electrical signal. The interposer printed circuit board may be configured to provide a standoff to prevent the electrical component from contacting a motherboard when the printed circuit board assembly is mounted to the motherboard.

Abstract: A method for generating reliability tests for a telephone system is based upon sampling an orthogonal array which covers various combinations of test parameters. Field data is collected of actual telephone activity on a telephone system. The field data is evaluated so as to determine call-mix characteristics. Probabilistic weights for the different call-mix characteristics are obtained, and then the probabilistic weights are used to sample the test case scenarios generated in the orthogonal array which have the same call-mix characteristics. These test case scenarios are used to run tests on the telephone system. These tests are preferably performed using automated test scripts. After the test data is collected, reliability metrics are calculated from the test data.

Abstract: A method for generating reliability tests for a telephone system is based upon sampling an orthogonal array which covers various combinations of test parameters. Field data is collected of actual telephone activity on a telephone system. The field data is evaluated so as to determine call-mix characteristics. Probabilistic weights for the different call-mix characteristics are obtained, and then the probabilistic weights are used to sample the test case scenarios generated in the orthogonal array which have the same call-mix characteristics. These test case scenarios are used to run tests on the telephone system. These tests are preferably performed using automated test scripts. After the test data is collected, reliability metrics are calculated from the test data.

Abstract: A method for developing platform independent applications comprises integrating an interface into a software development platform, receiving an input indicative of a desired mobile-device type designated to receive an application responsive to the platform independent code, enabling a user to develop an instruction set via the interface, generating a set of platform independent files responsive to the mobile-device type and the instruction set, forwarding the set of platform independent files to a device translator, and generating a device-specific application responsive to the mobile-device type and the platform independent files. A computing device exposes the functions of a software development platform, generates a representation of a set of instructions designated for execution on a mobile device, and transforms the representation. The mobile device receives a device independent representation of an application program designated for operation on the mobile device along with an application program.

Abstract: A system for personalized meal planning is provided which includes a client device and a meal planning center configured to communicate with the client device and to receive a customer's information, including a weight designator, a gender designator, a goal designator, and an activity level designator. The meal planning center includes a storage device and a processing unit. The storage device is configured to store recipe template files having an ingredient designator and a plurality of recipe rule factors, which include a nutrient contribution value, a minimum ingredient value, and a maximum ingredient value. A plurality of recipe rule factors are each assigned to each ingredient designator. The processing unit is configured to determine a nutritional allowance based upon the customer information and to create a recipe that satisfies the nutritional allowance by using the recipe rule factors assigned to the ingredient.