Patents by Inventor John Zyskind
John Zyskind has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11901692Abstract: A semiconductor laser device is provided. The semiconductor laser device includes: a substrate having a first facet; a guiding layer having a second facet through which an output light is configured to be emitted; a bottom dielectric layer between the substrate and the guiding layer; and a top dielectric layer on the guiding layer. The second facet is at an angle relative to the first facet.Type: GrantFiled: December 3, 2021Date of Patent: February 13, 2024Assignee: Skorpios Technologies, Inc.Inventors: Murtaza Askari, Stephen B. Krasulick, Majid Sodagar, John Zyskind
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Patent number: 11557880Abstract: A method of fabricating a gain medium includes growing a p-type layer doped with zinc on a substrate, growing an undoped layer including one or both of InP or InGaAsP on the p-type layer, growing a region that includes multiple quantum wells (MQWs) on the undoped layer, and growing an n-type layer on the region. The undoped layer has a thickness that is sufficient to prevent Zn diffusion from the p-type layer into the region during subsequent growth or wafer fabrication steps.Type: GrantFiled: October 1, 2020Date of Patent: January 17, 2023Inventors: John Y. Spann, John Zyskind
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Publication number: 20220166183Abstract: A semiconductor laser device is provided. The semiconductor laser device includes: a substrate having a first facet; a guiding layer having a second facet through which an output light is configured to be emitted; a bottom dielectric layer between the substrate and the guiding layer; and a top dielectric layer on the guiding layer. The second facet is at an angle relative to the first facet.Type: ApplicationFiled: December 3, 2021Publication date: May 26, 2022Inventors: Murtaza Askari, Stephen B. Krasulick, Majid Sodagar, John Zyskind
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Patent number: 11079549Abstract: A device is provided for optical mode spot size conversion to optically couple a semiconductor waveguide with an optical fiber. The device includes a waveguide comprising a waveguide taper region, which comprises a shoulder portion and a ridge portion above the shoulder portion. The ridge portion has a width that tapers to meet a width of the shoulder portion. The waveguide taper region comprises a first material. The device also has a mode converter coupled to the waveguide. The mode converter includes a plurality of stages, and each of the plurality of stages tapers in a direction similar to a direction of taper of the waveguide taper region. The mode converter is made of a second material different from the first material.Type: GrantFiled: April 3, 2020Date of Patent: August 3, 2021Assignee: Skorpios Technologies, Inc.Inventors: Majid Sodagar, Stephen B. Krasulick, John Zyskind, Paveen Apiratikul, Luca Cafiero
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Publication number: 20210184435Abstract: A method of fabricating a gain medium includes growing a p-type layer doped with zinc on a substrate, growing an undoped layer including one or both of InP or InGaAsP on the p-type layer, growing a region that includes multiple quantum wells (MQWs) on the undoped layer, and growing an n-type layer on the region. The undoped layer has a thickness that is sufficient to prevent Zn diffusion from the p-type layer into the region during subsequent growth or wafer fabrication steps.Type: ApplicationFiled: October 1, 2020Publication date: June 17, 2021Inventors: John Y. Spann, John Zyskind
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Patent number: 10928588Abstract: A device for optical communication is described. The device comprises two transceivers integrated on one chip. A first transceiver can be used with existing optical-communication architecture. As a more advanced optical-communication architecture becomes adopted, the device can be switched from using the first transceiver to using a second transceiver to communicate using the more advanced optical-communication architecture.Type: GrantFiled: October 15, 2018Date of Patent: February 23, 2021Assignee: Skorpios Technologies, Inc.Inventors: Majid Sodagar, Stephen B. Krasulick, John Zyskind, Paveen Apiratikul, Luca Cafiero
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Patent number: 10895686Abstract: A method of fabricating a waveguide mode expander includes providing a substrate including a waveguide, bonding a chiplet including multiple optical material layers in a mounting region adjacent an output end of the waveguide, and selectively removing portions of the chiplet to form tapered stages that successively increase in number and lateral size from a proximal end to a distal end of the chiplet. The first optical material layer supports an input mode substantially the same size as a mode exiting the waveguide. One or more of the overlying layers, when combined with the first layer, support a larger, output optical mode size. Each tapered stage of the mode expander is formed of a portion of a respective layer of the chiplet. The first layer and the tapered stages form a waveguide mode expander that expands an optical mode of light traversing the chiplet.Type: GrantFiled: May 1, 2018Date of Patent: January 19, 2021Assignee: Skorpios Technologies, Inc.Inventors: Damien Lambert, Guoliang Li, John Zyskind, Stephen B. Krasulick
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Publication number: 20200400891Abstract: A device is provided for optical mode spot size conversion to optically couple a semiconductor waveguide with an optical fiber. The device includes a waveguide comprising a waveguide taper region, which comprises a shoulder portion and a ridge portion above the shoulder portion. The ridge portion has a width that tapers to meet a width of the shoulder portion. The waveguide taper region comprises a first material. The device also has a mode converter coupled to the waveguide. The mode converter includes a plurality of stages, and each of the plurality of stages tapers in a direction similar to a direction of taper of the waveguide taper region. The mode converter is made of a second material different from the first material.Type: ApplicationFiled: April 3, 2020Publication date: December 24, 2020Inventors: Majid Sodagar, Stephen B. Krasulick, John Zyskind, Paveen Apiratikul, Luca Cafiero
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Patent number: 10833480Abstract: A method of fabricating a gain medium includes growing a p-type layer doped with zinc on a substrate, growing an undoped layer including one or both of InP or InGaAsP on the p-type layer, growing a region that includes multiple quantum wells (MQWs) on the undoped layer, and growing an n-type layer on the region. The undoped layer has a thickness that is sufficient to prevent Zn diffusion from the p-type layer into the region during subsequent growth or wafer fabrication steps.Type: GrantFiled: July 3, 2019Date of Patent: November 10, 2020Assignee: Skorpios Technologies, Inc.Inventors: John Y. Spann, John Zyskind
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Publication number: 20200169063Abstract: A method of fabricating a gain medium includes growing a p-type layer doped with zinc on a substrate, growing an undoped layer including one or both of InP or InGaAsP on the p-type layer, growing a region that includes multiple quantum wells (MQWs) on the undoped layer, and growing an n-type layer on the region. The undoped layer has a thickness that is sufficient to prevent Zn diffusion from the p-type layer into the region during subsequent growth or wafer fabrication steps.Type: ApplicationFiled: July 3, 2019Publication date: May 28, 2020Inventors: John Y. Spann, John Zyskind
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Patent number: 10649148Abstract: A device is provided for optical mode spot size conversion to optically couple a semiconductor waveguide with an optical fiber. The device includes a waveguide comprising a waveguide taper region, which comprises a shoulder portion and a ridge portion above the shoulder portion. The ridge portion has a width that tapers to meet a width of the shoulder portion. The waveguide taper region comprises a first material. The device also has a mode converter coupled to the waveguide. The mode converter includes a plurality of stages, and each of the plurality of stages tapers in a direction similar to a direction of taper of the waveguide taper region. The mode converter is made of a second material different from the first material.Type: GrantFiled: October 25, 2018Date of Patent: May 12, 2020Assignee: Skorpios Technologies, Inc.Inventors: Majid Sodagar, Stephen B. Krasulick, John Zyskind, Paveen Apiratikul, Luca Cafiero
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Publication number: 20190170953Abstract: A v-groove assembly is used to edge couple a lensed fiber (e.g., an optical fiber made of silica) with a waveguide in a photonic chip. The v-groove assembly is made from fused silica. Fused silica is used to so that an adhesive (e.g., epoxy resin) used in bonding the lensed fiber to the v-groove assembly and/or bonding the v-groove assembly to the photonic chip can be cured, at least partially, by light.Type: ApplicationFiled: September 24, 2018Publication date: June 6, 2019Inventors: Daming Liu, John Zyskind
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Publication number: 20190170944Abstract: A device is provided for optical mode spot size conversion to optically couple a semiconductor waveguide with an optical fiber. The device includes a waveguide comprising a waveguide taper region, which comprises a shoulder portion and a ridge portion above the shoulder portion. The ridge portion has a width that tapers to meet a width of the shoulder portion. The waveguide taper region comprises a first material. The device also has a mode converter coupled to the waveguide. The mode converter includes a plurality of stages, and each of the plurality of stages tapers in a direction similar to a direction of taper of the waveguide taper region. The mode converter is made of a second material different from the first material.Type: ApplicationFiled: October 25, 2018Publication date: June 6, 2019Inventors: Majid Sodagar, Stephen B. Krasulick, John Zyskind, Paveen Apiratikul, Luca Cafiero
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Publication number: 20190113680Abstract: A device for optical communication is described. The device comprises two transceivers integrated on one chip. A first transceiver can be used with existing optical-communication architecture. As a more advanced optical-communication architecture becomes adopted, the device can be switched from using the first transceiver to using a second transceiver to communicate using the more advanced optical-communication architecture.Type: ApplicationFiled: October 15, 2018Publication date: April 18, 2019Applicant: Skorpios Technologies, Inc.Inventors: Majid Sodagar, Stephen B. Krasulick, John Zyskind, Paveen Apiratikul, Luca Cafiero
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Publication number: 20180348432Abstract: A method of fabricating a waveguide mode expander includes providing a substrate including a waveguide, bonding a chiplet including multiple optical material layers in a mounting region adjacent an output end of the waveguide, and selectively removing portions of the chiplet to form tapered stages that successively increase in number and lateral size from a proximal end to a distal end of the chiplet. The first optical material layer supports an input mode substantially the same size as a mode exiting the waveguide. One or more of the overlying layers, when combined with the first layer, support a larger, output optical mode size. Each tapered stage of the mode expander is formed of a portion of a respective layer of the chiplet. The first layer and the tapered stages form a waveguide mode expander that expands an optical mode of light traversing the chiplet.Type: ApplicationFiled: May 1, 2018Publication date: December 6, 2018Inventors: Damien Lambert, Guoliang Li, John Zyskind, Stephen B. Krasulick
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Patent number: 10107976Abstract: A v-groove assembly is used to edge couple a lensed fiber (e.g., an optical fiber made of silica) with a waveguide in a photonic chip. The v-groove assembly is made from fused silica. Fused silica is used to so that an adhesive (e.g., epoxy resin) used in bonding the lensed fiber to the v-groove assembly and/or bonding the v-groove assembly to the photonic chip can be cured, at least partially, by light.Type: GrantFiled: April 22, 2016Date of Patent: October 23, 2018Assignee: Skorpios Technologies, Inc.Inventors: Daming Liu, John Zyskind
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Patent number: 9977188Abstract: A method of fabricating a waveguide mode expander includes providing a substrate including a waveguide, bonding a chiplet including multiple optical material layers in a mounting region adjacent an output end of the waveguide, and selectively removing portions of the chiplet to form tapered stages that successively increase in number and lateral size from a proximal end to a distal end of the chiplet. The first optical material layer supports an input mode substantially the same size as a mode exiting the waveguide. One or more of the overlying layers, when combined with the first layer, support a larger, output optical mode size. Each tapered stage of the mode expander is formed of a portion of a respective layer of the chiplet. The first layer and the tapered stages form a waveguide mode expander that expands an optical mode of light traversing the chiplet.Type: GrantFiled: February 23, 2016Date of Patent: May 22, 2018Assignee: Skorpios Technologies, Inc.Inventors: Damien Lambert, Guoliang Li, John Zyskind, Stephen B. Krasulick
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Patent number: 9885832Abstract: A waveguide mode expander couples a smaller optical mode in a semiconductor waveguide to a larger optical mode in an optical fiber. The waveguide mode expander comprises a shoulder made of crystalline silicon and a ridge made of non-crystalline silicon (e.g., amorphous silicon). In some embodiments, the ridge of the waveguide mode expander has a plurality of stages, the plurality of stages have different widths and/or thicknesses at a given cross section.Type: GrantFiled: May 27, 2015Date of Patent: February 6, 2018Assignee: Skorpios Technologies, Inc.Inventors: Damien Lambert, Nikhil Kumar, Elton Marchena, Daming Liu, Guoliang Li, John Zyskind
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Publication number: 20160341919Abstract: A v-groove assembly is used to edge couple a lensed fiber (e.g., an optical fiber made of silica) with a waveguide in a photonic chip. The v-groove assembly is made from fused silica. Fused silica is used to so that an adhesive (e.g., epoxy resin) used in bonding the lensed fiber to the v-groove assembly and/or bonding the v-groove assembly to the photonic chip can be cured, at least partially, by light.Type: ApplicationFiled: April 22, 2016Publication date: November 24, 2016Applicant: Skorpios Technologies, Inc.Inventors: Daming Liu, John Zyskind
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Patent number: 9461770Abstract: A multi-channel transceiver using a floating frequency grid for multi-channel, optical communication is presented. Transmitter frequencies are permitted to drift, and a receiver is tuned to compensate for drifts in the transmitter frequencies.Type: GrantFiled: September 12, 2014Date of Patent: October 4, 2016Assignee: Skorpios Technologies, Inc.Inventors: Robert J. Stone, John Zyskind