Patents by Inventor Johnathan Falterrneier

Johnathan Falterrneier has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High aspect ratio mask open without hardmask
    Publication number: 20070037100
    Abstract: A method of etching a stack of dielectric mask layers by reactive ion etch steps in order to open an aperture for etching into a semiconductor substrate improves the selectivity of the reactive ion etch relative to photoresist to the extent that an etch of an equivalent of 2000 nm of oxide is made with only photoresist as the etch mask, instead of a hardmask, thereby permitting the etch to be performed in a single chamber of an etch tool.
    Type: Application
    Filed: August 9, 2005
    Publication date: February 15, 2007
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Johnathan Falterrneier, Yuko Ninomiya