Patents by Inventor JOHNNY CHIAHAO LI

JOHNNY CHIAHAO LI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240086601
    Abstract: A method of generating a first performance-data-library (for a standard-cell-library) includes: for each standard cell that includes multiple gates, sorting the gates into groups including searching for matched ones amongst the gates (matched gates), grouping corresponding matched gates into corresponding multiple member-gates, and (for unmatched ones of the gates having no other matched gate (unmatched gates)), grouping the unmatched gates into corresponding single-member groups; for each standard cell, generating a corresponding first volume of performance data including, for each group, discretely calculating the first volume of performance data, mapping the volume of performance data to the subject gate in the group, and, for each multimember group, mapping the volume of performance data to non-subject gates; and basing the first performance-data-library at least in part on the first volumes of performance data.
    Type: Application
    Filed: January 23, 2023
    Publication date: March 14, 2024
    Inventors: Johnny Chiahao LI, Tzu-Hsuan HO, Pei-Wei LAO, Bing-Hsiu WU, Jerry Chang Jui KAO
  • Publication number: 20240077534
    Abstract: Systems, methods, and devices are described herein for pre-setting scan flip-flops using combinational logic circuits. A system includes a plurality of flip-flop devices and a first pre-setting combinational logic circuit. The plurality of flip-flop devices are coupled together in series and configured to receive a scan input signal, capture data output from each flip-flop device of the plurality of flip-flop devices based on the scan input signal, and generate a scan output signal comprising the captured data. The first pre-setting combinational logic circuit is coupled to a first flip-flop device of the plurality of flip-flop devices. The first pre-setting combinational logic circuit includes a plurality of transistors and is configured to override and set either the scan input signal to the first flip-flop device or the scan output signal of the first flip-flop device based on selective operation of the plurality of transistors.
    Type: Application
    Filed: January 6, 2023
    Publication date: March 7, 2024
    Inventors: Johnny Chiahao Li, Sheng-Hsiung Chen, Tzu-Ying Lin, Yung-Chen Chien, Jerry Chang Jui Kao, Xiangdong Chen
  • Publication number: 20240070364
    Abstract: An integrated circuit includes a first power rail and a second power rail extending in a first direction, and a first power grid stub connected to the first power rail through a first via-connector. The integrated circuit also includes a first vertical conducting line extending in a second direction in a circuit cell between a first vertical cell boundary and a second vertical cell boundary. The first vertical conducting line and the first power grid stub are in a same metal layer and aligned with each other along the second direction.
    Type: Application
    Filed: August 23, 2022
    Publication date: February 29, 2024
    Inventors: Johnny Chiahao LI, Sheng-Hsiung CHEN, Hui-Zhong ZHUANG, Jerry Chang Jui KAO, Xiangdong CHEN, Chung-Hsing WANG
  • Publication number: 20230385504
    Abstract: A method of forming an integrated circuit (IC) includes generating a netlist of a first circuit, generating a first cell layout of the first circuit, placing the first cell layout, by an automatic placement and routing (APR) tool, in a first region of a layout design. The first circuit is configured as a non-functional circuit. The first circuit includes a first pin and a second pin that are electrically disconnected from each other. Generating the netlist of the first circuit includes designating the first pin and the second pin as a first group of pins that are to be connected together. Placing the first cell layout by the APR tool includes connecting the first pin and the second pin in the first group of pins together thereby changing the first circuit to a second circuit. The second circuit is configured as a functional version of the first circuit.
    Type: Application
    Filed: August 23, 2022
    Publication date: November 30, 2023
    Inventors: Johnny Chiahao LI, Jung-Chan YANG, Jian-Sing LI, Hui-Zhong ZHUANG, Jerry Chang Jui KAO, Xiangdong CHEN
  • Publication number: 20230259686
    Abstract: A semiconductor device, method, and system of arranging patterns of the same are provided. The method includes generating a plurality of gate patterns and conductive patterns, wherein each of the plurality of gate patterns and conductive patterns is located at a first horizontal level and extends along a first direction. The method also includes selecting one of the gate patterns as an input pin or one of the conductive patterns as an output pin. The method further includes generating, based on a selected gate pattern or a selected conductive pattern, a plurality of metallization patterns. Each of the plurality of metallization patterns is located at a second horizontal level overlying the first horizontal level and extends along a second direction substantially perpendicular to the first direction.
    Type: Application
    Filed: February 17, 2022
    Publication date: August 17, 2023
    Inventors: ANURAG VERMA, MENG-KAI HSU, JOHNNY CHIAHAO LI, SHENG-HSIUNG CHEN, CHENG-YU LIN, HUI-ZHONG ZHUANG, JERRY CHANG JUI KAO
  • Publication number: 20230260786
    Abstract: A method includes forming a conductive member over a first conductive line; forming a second conductive line over the conductive member; and removing a portion of the conductive member exposed by the second conductive line to form a conductive via. The formation of the second conductive line is implemented prior to the formation of the conductive via. A semiconductor structure includes a first conductive line having a first surface; a second conductive line disposed above the first conductive line and having a second surface overlapping the first surface; and a conductive via electrically connected to the first surface and the second surface. The conductive via includes a first end disposed within the first surface, a second end disposed within the second surface, and a cross-section between the first end and the second end, wherein at least two of interior angles of the cross-section are substantially unequal to 90°.
    Type: Application
    Filed: February 17, 2022
    Publication date: August 17, 2023
    Inventors: JOHNNY CHIAHAO LI, SHIH-MING CHANG, KEN-HSIEN HSIEH, CHI-YU LU, YUNG-CHEN CHIEN, HUI-ZHONG ZHUANG, JERRY CHANG JUI KAO, XIANGDONG CHEN