Patents by Inventor Johnny M. Cook, Jr.

Johnny M. Cook, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6441480
    Abstract: A microelectronic package comprises a substrate, a electronic chip mounted on the substrate, a thermal interface material, a spring clip, and a retention frame. The thermal interface material is located between the electronic chip and the slug and is capable of thermally coupling the electronic chip to a slug without curing. The spring clip is located between the retention frame and the slug. In the assembled microelectronic package, the retention frame caps the substrate, and the spring clip applies a constant force to the slug to ensure reliable and continuous thermal contact between the electronic chip and the slug.
    Type: Grant
    Filed: August 24, 1999
    Date of Patent: August 27, 2002
    Assignee: Intel Corporation
    Inventors: Timothy M. Takeuchi, Imran Yusuf, Johnny M. Cook, Jr.
  • Publication number: 20020079571
    Abstract: A microelectronic package comprises a substrate, a electronic chip mounted on the substrate, a thermal interface material, a spring clip, and a retention frame. The thermal interface material is located between the electronic chip and the slug and is capable of thermally coupling the electronic chip to a slug without curing. The spring clip is located between the retention frame and the slug. In the assembled microelectronic package, the retention frame caps the substrate, and the spring clip applies a constant force to the slug to ensure reliable and continuous thermal contact between the electronic chip and the slug.
    Type: Application
    Filed: August 24, 1999
    Publication date: June 27, 2002
    Inventors: TIMOTHY M. TAKEUCHI, IMRAN YUSUF, JOHNNY M. COOK JR.
  • Patent number: 6256199
    Abstract: An integrated circuit cartridge and method has been described. The cartridge includes a heat pipe that comes in thermal contact with at least one integrated circuit die. A spring clip is utilized to provide a compressive force to maintain a substantially even bond line thickness in the presence of opposing forces, such as forces caused by thermal cycling, power cycling, shocks, and vibration. The spring clip can modulate the compressive force applied as a function of parameters on the spring clip. Parameters include load arm width, load arm thickness, load arm curvature, and the location of tabs relative to load arms. A cartridge cover supplies physical protection for pins that protrude from the cartridge. The cartridge cover also supplies key features that aid in alignment of the pins and a socket.
    Type: Grant
    Filed: October 1, 1999
    Date of Patent: July 3, 2001
    Assignee: Intel Corporation
    Inventors: Imran Yusuf, Hong Xie, Johnny M. Cook, Jr., Peter Brandenburger, Biju Chandran, Hamid Ekhlassi