Patents by Inventor Johnny Monis Nigos

Johnny Monis Nigos has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Room temperature gold wire bonding
    Patent number: 6698646
    Abstract: The present invention is a method for bonding gold wire to gold bond pads at temperatures lower than 125 degrees Celsius, and more particularly at room temperature, defined to be 25 degrees Celsius. By applying compressive force and ultrasonic energy, an intermetallic bond can be formed between a gold wire and a gold bond pad without elevating the temperature. Furthermore, the present invention uses ultrasonic energy with frequencies low enough to be in the range of commercially available wire bonders.
    Type: Grant
    Filed: September 11, 2002
    Date of Patent: March 2, 2004
    Assignee: Agilent Technologies, Inc.
    Inventors: Kim H Chen, Soojin Choi, Chun Yee Chan, Johnny Monis Nigos
  • Room temperature gold wire bonding
    Publication number: 20030006271
    Abstract: The present invention is a method for bonding gold wire to gold bond pads at temperatures lower than 125 degrees Celsius, and more particularly at room temperature, defined to be 25 degrees Celsius. By applying compressive force and ultrasonic energy, an intermetallic bond can be formed between a gold wire and a gold bond pad without elevating the temperature. Furthermore, the present invention uses ultrasonic energy with frequencies low enough to be in the range of commercially available wire bonders.
    Type: Application
    Filed: September 11, 2002
    Publication date: January 9, 2003
    Inventors: Kim H. Chen, Soojin Choi, Chun Yee Chan, Johnny Monis Nigos
  • Room temperature gold wire bonding
    Publication number: 20030006267
    Abstract: The present invention is a method for bonding gold wire to gold bond pads at temperatures lower than 125 degrees Celsius, and more particularly at room temperature, defined to be 25 degrees Celsius. By applying compressive force and ultrasonic energy, an intermetallic bond can be formed between a gold wire and a gold bond pad without elevating the temperature. Furthermore, the present invention uses ultrasonic energy with frequencies low enough to be in the range of commercially available wire bonders.
    Type: Application
    Filed: June 14, 2001
    Publication date: January 9, 2003
    Inventors: Kim H. Chen, Soojin Choi, Chun Yee Chan, Johnny Monis Nigos