Patents by Inventor Johnny R.F. Baca

Johnny R.F. Baca has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6863444
    Abstract: This invention relates to an optical transmitter, receiver or transceiver module, and more particularly, to an apparatus for connecting a first optical connector to a second optical connector. The apparatus comprises: (1) a housing having at least a first end and at least a second end, the first end of the housing capable of receiving the first optical connector, and the second end of the housing capable of receiving the second optical connector; (2) a longitudinal cavity extending from the first end of the housing to the second end of the housing; and (3) an electromagnetic shield comprising at least a portion of the housing.
    Type: Grant
    Filed: December 26, 2000
    Date of Patent: March 8, 2005
    Assignee: EMCORE Corporation
    Inventors: Gene R. Anderson, Marcelino G. Armendariz, Johnny R.F. Baca, Robert P. Bryan, Richard F. Carson, Edwin B. Duckett, III, Frederick B. McCormick, Gregory V. Miller, David W. Peterson, Terrance T. Smith
  • Patent number: 6799902
    Abstract: An optoelectronic mounting structure is provided that may be used in conjunction with an optical transmitter, receiver or transceiver module. The mounting structure may be a flexible printed circuit board. Thermal vias or heat pipes in the head region may transmit heat from the mounting structure to the heat spreader. The heat spreader may provide mechanical rigidity or stiffness to the heat region. In another embodiment, an electrical contact and ground plane may pass along a surface of the head region so as to provide an electrical contact path to the optoelectronic devices and limit electromagnetic interference. In yet another embodiment, a window may be formed in the head region of the mounting structure so as to provide access to the heat spreader. Optoelectronic devices may be adapted to the heat spreader in such a manner that the devices are accessible through the window in the mounting structure.
    Type: Grant
    Filed: December 26, 2000
    Date of Patent: October 5, 2004
    Assignee: Emcore Corporation
    Inventors: Gene R. Anderson, Marcelino G. Armendariz, Johnny R. F. Baca, Robert P. Bryan, Richard F. Carson, Dahwey Chu, Edwin B. Duckett, III, Frederick B. McCormick, David W. Peterson, Gary D. Peterson, Cathleen A. Reber, Bill H. Reysen
  • Publication number: 20020122636
    Abstract: An optoelectronic mounting structure is provided that may be used in conjunction with an optical transmitter, receiver or transceiver module. The apparatus comprises: (1) a mounting structure; (2) an array of optoelectronic devices adapted to the mounting structure, the optoelectronic devices having at least a first end; (3) an array of optical elements, the array of optical elements having at least a first end; (4) the first end of the array of optical elements proximate to the first end of the array of optoelectronic devices in such a manner that one or more optical elements is optically aligned to one or more optoelectronic devices; and (5) a heat spreader passing along a surface of a head region of the mounting structure. The mounting structure may be a flexible printed circuit board. Thermal vias or heat pipes in the head region may transmit heat from the mounting structure to the heat spreader. The heat spreader may provide mechanical rigidity or stiffness to the heat region.
    Type: Application
    Filed: December 26, 2000
    Publication date: September 5, 2002
    Inventors: Gene R. Anderson, Marcelino G. Armendariz, Johnny R.F. Baca, Robert P. Bryan, Richard F. Carson, Dahwey Chu, Edwin B. Duckett, Frederick B. McCormick, David W. Peterson, Gary D. Peterson, Cathleen A. Reber, Bill H. Reysen