Abstract: In one aspect of the invention, an assembly includes an optical-electronic die having electrically conductive pads and a submount with first and second opposing sides and a third side essentially perpendicular to the first submount side. The first and third submount sides have an adjoining edge, with electrically conductive pads on the first submount side bonded to the die pads, second electrically conductive pads on the third side of the submount, and electrically conductive traces interconnecting the first and second submount pads. The conductive traces are formed on the first and third sides and adjoining edge of the submount by a process that uses a shadow mask.

Abstract: An optical subassembly is provided. A mounting structure having a plurality of angled conductive traces is disposed on a first surface of the mounting structure. A holding device, coupled to a second surface of the mounting structure, has a plurality of optical channels. A laser optical device is electrically connected to the conductive traces on the mounting structure. An optical signal is emitted or received by the laser optical device and is converted to an electrical signal. The electrical signal is transmitted by way of the plurality of angled conductive devices to the plurality of optical channels.

Abstract: An optical coupler and housing arrangement includes a housing portion adapted to receive an optical connector of a fiber optic cable, and further includes an optical coupler portion integrally formed with the housing portion. The optical coupler portion is adapted to transmit optical signals to and from the fiber optic cable. The optical coupler portion has a plurality of optical fibers for transmitting the optical signals. Each of the optical fibers extends from one end surface of the optical coupler portion to another end surface of the optical coupler portion. The housing portion has a recess for receiving the optical connector, with one of the end surfaces of the optical coupler portion forming a back surface of the recess.

Abstract: An optical coupler and housing arrangement includes a housing portion adapted to receive an optical connector of a fiber optic cable, and further includes an optical coupler portion integrally formed with the housing portion. The optical coupler portion is adapted to transmit optical signals to and from the fiber optic cable. The optical coupler portion has a plurality of optical fibers for transmitting the optical signals. Each of the optical fibers extends from one end surface of the optical coupler portion to another end surface of the optical coupler portion. The housing portion has a recess for receiving the optical connector, with one of the end surfaces of the optical coupler portion forming a back surface of the recess.

Abstract: In one aspect of the invention, an assembly includes an optical-electronic die having electrically conductive pads and a submount with first and second opposing sides and a third side essentially perpendicular to the first submount side. The first and third submount sides have an adjoining edge, with electrically conductive pads on the first submount side bonded to the die pads, second electrically conductive pads on the third side of the submount, and electrically conductive traces interconnecting the first and second submount pads. The conductive traces are formed on the first and third sides and adjoining edge of the submount by a process that uses a shadow mask.

Abstract: An optical subassembly is provided. A mounting structure having a plurality of angled conductive traces is disposed on a first surface of the mounting structure. A holding device, coupled to a second surface of the mounting structure, has a plurality of optical channels. A laser optical device is electrically connected to the conductive traces on the mounting structure. An optical signal is emitted or received by the laser optical device and is converted to an electrical signal. The electrical signal is transmitted by way of the plurality of angled conductive devices to the plurality of optical channels.

Abstract: A heatsink grounding mechanism and an associated circuit card and computer system. The circuit card includes a printed circuit board to an integrated circuit module is attached. A heatsink is positioned in contact with or in close proximity to the integrated circuit module package. A heatsink grounding piece of the grounding mechanism is utilized to ground the heatsink. The grounding piece includes a substantially rectangular and conductive grounding piece ring that defines an aperture. The dimensions are suitable for receiving and circumventing the integrated circuit module. The grounding piece includes a set of semi-rigid conductive spring arms that extend away from the grounding piece ring. The spring arms are positioned and oriented such that termination points of the spring arms contact grounding pads on the printed circuit board when the grounding piece is compressed between the heatsink and the circuit board.

Abstract: An apparatus and a method of mounting an array of different heatsinks to a closely packed array of processors, cache controller devices, and any other type of data processing element utilized within a data processing system. The apparatus includes a metal frame with multiple apertures in the bottom to allow access to the tops of the devices for which heatsinks will be provided. The metal frame has multiple apertures that allow access to the tops of the data processing elements underneath. The metal frame serves as a containment vehicle for multiple heatsinks, and also provides rigidity to the printed circuit board in the particularly vulnerable vicinity of the comers where the devices are attached to the printed circuit board.

Abstract: An apparatus and method therefore mount an array of different heatsinks to a closely packed array of data processing elements utilized within a data processing system. The apparatus includes a metal frame with multiple apertures in the bottom to allow access to the tops of the devices for which heatsinks will be provided. The metal frame has multiple apertures that allow access to the tops of the data processing elements underneath. The metal frame serves as a containment vehicle for multiple heatsinks, and also provides rigidity to the printed circuit board in the particularly vulnerable vicinity of the corners where the devices are attached to the printed circuit board.