Abstract: An apparatus is provided for packing semiconductor die. The apparatus will comprise the followings: Basically, a semiconductor die is sticked thereon a metal frame by a full tape which is an adhesive material, an uncovered housing is formed around the semiconductor die and around a part of the metal frame, wherein the metal frame having a metal wire connected the die below, a plurality of metal balls being connected under other parts of the metal frame. Also, some other related apparatus are provided.

Abstract: A method of forming a HSQFN (High Stand-off Quad Flat Non-leaded) package comprises providing a leadframe with bonding pads and die pads for receiving a die. Then, the die is attached on the die pad and bonding wires are connected between the bonding pads and the die for electrical connection. Molding process is used to encompass the die by compound from a first surface of the leadframe. Then, backside etching is used to etch the leadframe from a second surface of the leadframe to expose a lower surface of the compound, thereby separating the bonding pads and the die pads. A sigulation is applied to separate each individual package by cutting the leadframe and the compound.

Abstract: The lead frame package with dummy chip comprising a lead frame with a plurality of first leads, molding compound, a dummy chip and a die. Wherein the molding compound encapsulates the die and the dummy chip, the dummy chip is arranged on a lower portion of the molding compound. The die is stacked on an upper surface of the dummy chip by using an adhesive material. A plurality of bonding wires are connected between the die and an end of the plurality of leads over the dummy chip.