Abstract: According to embodiments of the invention, temperature, current, or other physical quantities associated with an integrated circuit, which can also include a processor, may be converted to a digital signal, and that digital signal used to choose a corresponding frequency offset that is added to any pre-established overclocking frequency. Embodiments of the invention allow a user to specify a dynamic range between which the frequency offset is bounded during overclocking of the integrated circuit. The programmable lower limit specifies the frequency where the integrated circuit begins to overclock. The programmable upper limit specifies the maximum overclocking frequency that is allowed. Setting the lower limit to be equal to the upper limit forces overclocking to occur at only the specified value.

Abstract: An improved lead frame structure for use in a semiconductor package, including: a plurality of leads; a paddle structure electrically isolated from the leads, the paddle structure including at least one lower paddle section having a first top surface to which a die may be attached, at least one mesa section disposed proximate the paddle section and having a second top surface disposed at a different elevation than the first top surface, the lower paddle section and the mesa section being joined by a wall section; and a plurality of tie bars attached to the paddle structure for supporting the paddle structure; whereby contact pads of a die attached to the first top surface may be electrically connected to the second top surface and to the leads prior to encapsulation thereof. A plurality of tie bars extends from opposite edges of the paddle structure, the tie bars providing for stabilizing the paddle structure during package fabrication.