Abstract: An apparatus for cooling an integrated circuit device includes a sealed thermally insulated chamber containing the integrated circuit device. A cooling element is located in chamber and is in thermal contact with the integrated circuit device for cooling the device. The integrated circuit device is mounted in a socket having socket pins that extend through a heater board forming one side of the device to projecting exposed external end portions. A heating element in the form of a polymer thick film resistor is deposited on the heater board on the inside of the chamber in the vicinity of the socket pins. The heating element is activated as necessary by a thermostatic control circuit to maintain the temperature of the exposed external end portions of the socket pins above a predetermined threshold to prevent moisture condensation on the projecting portions of the pins.

Abstract: A hot bar apparatus for effecting solder bonds for high density electronic components has a diamond or diamond-like (i.e. a generally diamond crystal lattice with graphite impurities) surface that makes contact with the leads of the electronic component and transmits the heat necessary to effect a solder bond. The diamond or diamond-like surface has superior wear characteristics over any other material, and it also is an electrical insulator to protect the electronic components from spurious voltages and currents generated by electrical currents that provide the heat for the hot bar.