Abstract: Provided is a robot comprising a telescopic-drive mechanism which does not contaminate works in a purified environment such as a clean room, is easy to handle, and requires no cover for covering the telescopic-drive mechanism. A robot comprises: an up-down axis in which a plurality of hollow axis sectional elements telescopically continue; and a telescopic-drive mechanism for driving the up-down axis to be vertically extended or retracted between an extended state in which a tip end of the up-down axis extends with respect to a base end thereof and a retracted state in which the tip end is moved close to the base end, wherein the telescopic-drive mechanism is integrated on one side of the up-down axis without being exposed from the up-down axis.

Abstract: A plurality of cleaning devices of the same type are attached to one support arm. The cleaning devices are simultaneously moved over a surface to be cleaned of a substrate supported and spun by a substrate supporting and spinning mechanism. Thus, the same type of cleaning devices share the task of cleaning the entire surface of the substrate, thereby to improve cleaning efficiency and shorten cleaning time. Different types of cleaning devices may be attached to the support arm for simultaneous cleaning of the entire surface of the substrate. Where different types of cleaning brushes are attached to the support arm, a cleaning operation may be carried out by simultaneously using cleaning brushes of optimal hardness for different regions on the substrate surface.

Abstract: A substrate cleaning apparatus includes a spin support for supporting and spinning a substrate, a nozzle for discharging a cleaning liquid with a given cleaning condition from a discharge opening, a moving mechanism for moving the nozzle at least between center and edge of the substrate, a cleaning condition adjuster for adjusting the cleaning condition, and a controller for controlling the cleaning condition adjuster to vary the cleaning condition according to a cleaning liquid supply position movable over the substrate surface.

Abstract: A substrate treating apparatus for treating a substrate in a predetermined substrate treating region. Each holder arm is supported in a proximal end portion thereof by an arm support to be swingable about a pivotal axis. In time of substrate treatment, the arm support is raised by an air cylinder. With the ascent of the arm support, a cam follower attached to a proximal end of the holder arm is guided by a cam groove. The holder arm, while being raised, turns from a vertical standby posture to a horizontal posture for treating the substrate. As a result, a treating device attached to a distal end of the holder arm moves to a treating position. In the treating position, the treating device treats the substrate. The holder arms are maintained in the vertical standby posture when out of use in substrate treatment. Thus, the holder arms require a reduced standby space.

Abstract: A method of and apparatus for cleaning a substrate which require shorter processing time with high processing efficiency are disclosed. A cleaning brush pivots about a pivot axis between two positions. An ultrasonic cleaning nozzle pivots about a pivot axis between two positions. To perform a cleaning process, the cleaning brush and the ultrasonic cleaning nozzle are driven in accordance with a processing pattern previously produced by an operator. The processing pattern is produced so that the movement of the cleaning brush between two positions and the movement of the ultrasonic cleaning nozzle between two positions are not caused simultaneously. Any processing pattern desired by the operator may be produced if this requirement is satisfied. Execution of the cleaning process in accordance with the processing pattern allows cleaning of a substrate using the cleaning brush and the ultrasonic cleaning nozzle at the same time.

Abstract: A substrate heat-treating apparatus includes a heat-treating plate, and support pins extending through the heat-treating plate to be vertically movable relative thereto. The support pins support each substrate at a lower surface thereof such that edges of the substrate are at a higher level than a central region of the substrate. This construction facilitates air flows into and out of a space between the lower surface of the substrate and the upper surface of the heat-treating plate when the substrate is vertically moved.

Abstract: A substrate processing apparatus reduces an instantaneous maximum power consumption at turn-on. Power receiving parts of a plurality of processing units are connected to one end of a turn-on switch respectively through switches. The other end of the turn-on switch is connected to an external power source through a breaker. Timer values are set in advance in the timers, respectively. When the turn-on switch is turned on, the timers turn on the associated switches respectively after times which are defined by the timer values, whereby the processing units are provided with electric power, each with a delay of a constant time.

Abstract: A unit arrangement part comprises a chemical cabinet on its lowermost part, while coating units for forming a resist film on a substrate and developing units for developing the substrate after exposure are arranged on four corners of an apparatus above the chemical cabinet. Further, multistage thermal processing units for thermal-processing the substrate are arranged on front and rear portions of the apparatus above these wet processing units. A cleaning unit for supplying a cleaning liquid such as pure water and cleaning the substrate is arranged on a front side of the apparatus between the coating units as a substrate processing unit. Thus provided is a substrate processing apparatus having excellent workability in maintenance with a high degree of freedom in arrangement of processing units.

Abstract: A substrate supporting device has a turntable mounted on a rotary shaft for supporting a substrate and spinning the substrate about a vertical axis. The turntable is replaceable by a load measuring device including a load meter mounted on a support bracket having a tube attachable to the rotary shaft. The load meter receives a cleaning brush to measure a pressing load applied therefrom. The load meter has a pressure sensor with an upper surface thereof at an equal level to the surface of the substrate to be placed on the substrate supporting device. Thus, a pressure to be applied to the substrate is measured in the same position as where the substrate is actually treated.

Abstract: A cleaning brush is fixed to a cleaner support that is mounted to a rotary element for vertical movement with respect thereto. The rotary element is rotatably supported by a forward portion of a support arm that is pivotable about a vertical axis at the rear of the support arm. A closed space defined by a bellows is connected to air piping having a pressure gauge and a regulator. The regulator is operable in response to variations of pressure resulting from engagement of the cleaning brush with a substrate, to control pressure within said bellows whereby the latter expands and contracts to raise or lower the cleaner support relative to the substrate as required to maintain the pressure in a predetermined range. The aforesaid construction responds fast enough to allow the cleaning brush to follow warping of the substrate with facility, and by so doing clean an entire substrate surface uniformly.