Abstract: A heat sink comprising a plurality of cooling fins and a plurality of spacers. Each of the cooling fins is formed to assume a shape of letter L by bending a lower end of a metallic plate so that the bent portions serve as heat-collecting portions, and the spacers are provided between adjoining cooling fins for maintaining intervals between the cooling fins and for pressing the heat-collection portions of the cooling fins to the heat-radiating surface of an electronic component. The cooling fins and spacers are connected by connecting rods piercing through portions at which the fins and spacers are overlapped.