Abstract: A water electrolysis cell includes an anode-side porous channel, a membrane electrode assembly, a cathode-side porous channel, and a separator disposed on at least any one of a side of the anode-side porous channel opposite to the membrane electrode assembly side and a side of the cathode-side porous channel opposite to the membrane electrode assembly side. The anode-side porous channel, the membrane electrode assembly, and the cathode-side porous channel are provided in this order. The membrane electrode assembly includes an anode catalyst layer, an electrolyte membrane, and a cathode catalyst layer in order from the anode-side porous channel side. An area in a plane direction of the anode-side porous channel is greater than an area in the plane direction of the cathode-side porous channel in a plan view.

Abstract: There is provided a method for forming end-face electrodes in which the end-face electrode can be securely formed with solder at a position in which a side electrode is formed and it can be formed without being affected by a jig for fixing a solder solid. By forming linear gaps on a master substrate, module substrates and a waste substrate are formed. At the side end of the gap of the module substrate, a side electrode is formed. A solder solid is pressed into the part of the gap in which the side electrode is formed and a reflow jig is placed. The surface of the solder solid is coated with flux and the solder solid is melted by heating so as to form the end-face electrode protruding from the substrate surface in the side electrode.

Abstract: There is provided a method for forming end-face electrodes in which the end-face electrode can be securely formed with solder at a position in which a side electrode is formed and it can be formed without being affected by a jig for fixing a solder solid. By forming linear gaps on a master substrate, module substrates and a waste substrate are formed. At the side end of the gap of the module substrate, a side electrode is formed. A solder solid is pressed into the part of the gap in which the side electrode is formed and a reflow jig is placed. The surface of the solder solid is coated with flux and the solder solid is melted by heating so as to form the end-face electrode protruding from the substrate surface in the side electrode.

Abstract: The present invention relates to a method for reinforcing a structure comprising the steps of forming a primer layer on the surface of a structure to be reinforced; forming if necessary a putty layer on the primer layer; applying an impregnating resin on the formed primer layer provided that the putty layer in case where the putty layer is formed on the primer layer, before, after or before and after cladding with the fiber sheets, to allow the resin to penetrate into the spaces in the fiber sheets; and curing the resin,the said primer, putty and impregnating resin comprising a resin composition which can cure at a temperature not more than 5.degree. C.