Abstract: An improved lead structure for tape automated bonding includes a stiffener which is an integral part of the leads. The stiffener maintains the alignment and spacing of the leads during fabrication and subsequent processing, e.g., bonding to a semiconductor chip. A laser is used to remove (or excise) the stiffener from the leads by cutting the leads individually or in groups. Several methods may be used to protect the semiconductor chip during excising, including focussing the beam so that the spot diameter at the focal point of the beam is less than one third of the distance between the focal point and the semiconductor device, providing a protective (e.g., reflective) coating on the semiconductor chip, or providing the laser beam with a shallow depth of field so that the beam is diverged at the surface of the semiconductor chip.

Abstract: Disclosed is a heat pipe heat exchanger for large scale integrated circuits. The heat pipe means is mounted on the substrate which supports the integrated circuit. The heat is conducted by the heat pipe means away from the integrated circuit to a surface area for dissipating heat. A plenum supplies a cooling medium across the surface area of the heat pipe means for removing the heat. An enclosing means for enclosing the surface area of the heat pipe means forms channels across the surface area for receiving the cooling medium supplied from the plenum.