Abstract: A sensor assembly comprises an integrated circuit (IC) substrate having an upper surface and operating circuitry, and a micro-electro-mechanical systems (MEMS) sensor die attached to the upper surface of the IC substrate in a stacked configuration. The MEMS sensor die in operative communication with the operating circuitry of the IC substrate. A seal ring surrounds an outer periphery of the upper surface of the IC substrate, and a seal cap is secured to the seal ring over the MEMS sensor die.

Abstract: A method for assembling a hermetically sealed package to contain a MEMS die and the hermetically sealed package are presented. The method includes selectively applying a glass mixture to a dome. The dome is heated to a first temperature sufficient to flow the glass mixture. The dome is pressed into contact with a carrier containing the MEMS device, the pressing being maintained at a pressure and for a temporal interval sufficient to flow the glass mixture onto the carrier. The dome is cooled while maintaining contact with the carrier, to a second temperature sufficient to allow the glass mixture to harden into a glass frit thereby to seal the carrier to the dome. The glass frit has a seal width.

Abstract: A method of packaging a MEMS device that includes, for example, the steps of providing a MEMS die that has a MEMS device, a seal ring and bond pads disposed thereon, providing a MEMS package that has a recess, a seal ring and bond pads disposed thereon, positioning the MEMS die over the MEMS package to align the seal rings and bond pads, inserting the MEMS die and MEMS package into a vacuum chamber and evacuating gasses therefrom to form a controlled vacuum pressure therein, sealing the MEMS package and the MEMS die together at the seal rings to form a package having a hermitically sealed interior chamber and simultaneously forming electrical connections between the corresponding bond pads.

Abstract: A method and a fused compound wafer including at least one first MEMS sensor and at least second MEMS sensor includes a first wafer. The first wafer includes at least one first MEMS sensor first subassembly and at least one second MEMS sensor first subassembly. A second wafer includes at least one first MEMS sensor second subassembly, at least one second MEMS sensor second assembly, and a fusing matrix. The fusing matrix includes a first joint configured to encapsulate each of the at least one first MEMS sensor first assembly and each of the at least one first MEMS sensor second assembly forming each at least one first MEMS sensor. A second joint is configured to encapsulate each of the at least one second MEMS first subassembly and each of the at least one second MEMS second subassembly forming each at least one second MEMS sensor.

Abstract: Methods of packaging devices such as MEMS devices are disclosed. An illustrative method of packaging a device in accordance with an illustrative embodiment of the present invention can include the steps of providing a substrate having an device provided therein or thereon, attaching a cap to the substrate and sealing the device within an interior cavity of the capped substrate, inserting the capped substrate into a vacuum chamber and evacuating gasses and/or contaminants contained within the interior cavity, and then injection molding a package about the capped substrate in the vacuum chamber. A number of small-sized openings disposed through the cap can be utilized to create a controlled vacuum pressure within the interior cavity of the device when the device is in the vacuum chamber, prior to injection molding the package about the capped substrate.

Abstract: Systems and methods for automatically attaching preforms to substrates. An example system includes a nest, a first component that places a substrate into the nest, a second component that places a preform on the substrate in the nest, a tacking device that tacks the preform to the substrate, a plurality of sensors that sense operational states of the components and the tacking device, and a controller that automatically controls operations of the components and the tacking device based on the sensed operational states.

Abstract: A method for assembling a hermetically sealed package to contain a MEMS die and the hermetically sealed package are presented. The method includes selectively applying a glass mixture to a dome. The dome is heated to a first temperature sufficient to flow the glass mixture. The dome is pressed into contact with a carrier containing the MEMS device, the pressing being maintained at a pressure and for a temporal interval sufficient to flow the glass mixture onto the carrier. The dome is cooled while maintaining contact with the carrier, to a second temperature sufficient to allow the glass mixture to harden into a glass frit thereby to seal the carrier to the dome. The glass frit has a seal width.

Abstract: A method and a fused compound wafer including at least one first MEMS sensor and at least second MEMS sensor includes a first wafer. The first wafer includes at least one first MEMS sensor first subassembly and at least one second MEMS sensor first subassembly. A second wafer includes at least one first MEMS sensor second subassembly, at least one second MEMS sensor second assembly, and a fusing matrix. The fusing matrix includes a first joint configured to encapsulate each of the at least one first MEMS sensor first assembly and each of the at least one first MEMS sensor second assembly forming each at least one first MEMS sensor. A second joint is configured to encapsulate each of the at least one second MEMS first subassembly and each of the at least one second MEMS second subassembly forming each at least one second MEMS sensor.

Abstract: A package for packaging one or more MEMS devices is disclosed. A package in accordance with an illustrative embodiment of the present invention can include a packaging structure having a base section, a top section, and an interior cavity adapted to contain a number of MEMS devices therein. In some embodiments, the packaging structure can include a first side, a second side, a third side, and a top end, which, in certain embodiments, may form a pinout plane surface that can be used to connect the packaging structure to other external components. In some embodiments, a number of MEMS-type inertial sensors contained within the interior cavity of the packaging structure can be used to detect and measure motion in multiple dimensions, if desired.

Abstract: An automated process for performing MEMS packaging including automatically attaching a die to a chip carrier, resulting in a chip carrier assembly, automatically moving the chip carrier assembly into a vacuum chamber, wherein the vacuum chamber includes one or more lids therein, automatically securing a lid to the chip carrier assembly within the vacuum chamber, thereby forming a packaged die, and automatically removing the packaged die from the vacuum chamber. Unique vacuum chambers suitable for MEMS packaging are also disclosed.

Abstract: A method for assembling a micro-electromechanical system (MEMS) device that includes a micro-machine is described. The method comprises forming the micro-machine on a die, the die having a top surface and a bottom surface, providing a plurality of die bonding pedestals on a surface of a housing, and mounting at least one of the top surface of the die and components of the micro-machine to the die bonding pedestals such that a bottom surface of the die at least partially shields components of the micro-machine from loose gettering material.

Abstract: A method for reducing occurrences of loose gettering material particles within micro-electromechanical system (MEMS) devices is described. The MEMS devices include a micro-machine within a substantially sealed cavity formed by a housing and a cover for the housing. The cavity containing a getter mounted on a getter substrate which is to be attached to the cover. The method includes providing an area between a portion of the cover and a portion of the getter substrate, positioning the getter within the area, and attaching the getter substrate to the cover.

Abstract: A method for increasing the bonding strength between a die and a housing for the die is described where a micro-electromechanical system (MEMS) device is formed on the die. The method includes depositing a plurality of contacts of bonding material between the substrate and die, and forming a bond between the die and the housing by applying at least 25,000 kilograms of force per gram of bonding material to the housing, the contacts, and the die.

Abstract: A method for assembling a micro-electromechanical system (MEMS) device that includes a micro-machine is described. The method comprises forming the micro-machine on a die, the die having a top surface and a bottom surface, providing a plurality of die bonding pedestals on a surface of a housing, and mounting at least one of the top surface of the die and components of the micro-machine to the die bonding pedestals such that a bottom surface of the die at least partially shields components of the micro-machine from loose gettering material.

Abstract: A method for increasing the bonding strength between a die and a housing for the die is described where a micro-electromechanical system (MEMS) device is formed on the die. The method comprises depositing a plurality of clusters of contact material onto a bottom surface of the housing, placing the die onto the clusters, and subjecting the housing, the clustered contacts, and the die to a thermocompression bonding process.

Abstract: A method for reducing occurrences of loose gettering material particles within micro-electromechanical system (MEMS) devices is described. The MEMS devices include a micro-machine within a substantially sealed cavity formed by a housing and a cover for the housing. The cavity containing a getter mounted on a getter substrate which is to be attached to the cover. The method includes providing an area between a portion of the cover and a portion of the getter substrate, positioning the getter within the area, and attaching the getter substrate to the cover.

Abstract: A method for increasing the bonding strength between a die and a housing for the die is described where a micro-electromechanical system (MEMS) device is formed on the die. The method includes depositing a plurality of contacts of bonding material between the substrate and die, and forming a bond between the die and the housing by applying at least 25,000 kilograms of force per gram of bonding material to the housing, the contacts, and the die.

Abstract: A method for increasing the bonding strength between a die and a housing for the die is described where a micro-electromechanical system (MEMS) device is formed on the die. The method comprises depositing a plurality of clusters of contact material onto a bottom surface of the housing, placing the die onto the clusters, and subjecting the housing, the clustered contacts, and the die to a thermocompression bonding process.

Abstract: A method for assembling a micro-electromechanical system (MEMS) device that includes a micro-machine is described. The method comprises forming the micro-machine on a die, the die having a top surface and a bottom surface, providing a plurality of die bonding pedestals on a surface of a housing, and mounting at least one of the top surface of the die and components of the micro-machine to the die bonding pedestals such that a bottom surface of the die at least partially shields components of the micro-machine from loose gettering material.

Abstract: A method for reducing occurrences of loose gettering material particles within micro-electromechanical system (MEMS) devices is described. The MEMS devices include a micro-machine within a substantially sealed cavity formed by a housing and a cover for the housing. The cavity containing a getter mounted on a getter substrate which is to be attached to the cover. The method includes providing an area between a portion of the cover and a portion of the getter substrate, positioning the getter within the area, and attaching the getter substrate to the cover.