Abstract: A bonded multi-layer RF window may include an external layer of dielectric material having desired thermal properties, an internal layer of dielectric material exposed to plasma inside a reaction chamber, and an intermediate layer of bonding material between the external layer and the internal layer. Heat produced by the chemical reaction inside the chamber and by the transmission of RF energy through the window may be conducted from the internal layer to the external layer, which may be cooled during a semiconductor wafer manufacturing process. A bonded multi-layer RF window may include cooling conduits for circulating coolant to facilitate cooling of the internal layer; additionally or alternatively, gas distribution conduits and gas injection apertures may be included for delivering one or more process gases into a reaction chamber. A system including a plasma reaction chamber may employ the inventive bonded multi-layer RF window.

Abstract: The present invention relates to a device that supplies electricity to a substrate. In one embodiment, the device includes multiple contacts, a current sensor, and a current regulator. The current sensor is attached to each of the plurality of contacts to sense their electric current. A current regulator controls current applied to each of the multiple contacts in response to the current sensor. In another embodiment, a compliant ridge is formed about the periphery of each contact to seal the contact from undesired chemicals.

Abstract: The present invention relates to a device that supplies electricity to a substrate. In one embodiment, the device includes multiple contacts, a current sensor, and a current regulator. The current sensor is attached to each of the plurality of contacts to sense their electric current. A current regulator controls current applied to each of the multiple contacts in response to the current sensor. In another embodiment, a compliant ridge is formed about the periphery of each contact to seal the contact from undesired chemicals.

Abstract: Apparatus for supporting a workpiece and method of making same. The apparatus comprises a flex circuit laminated to a contoured support pedestal. The flex circuit includes a reinforced layer to improve puncture resistance of the flex circuit. The top surface of the chuck has a contoured topography that is achieved by machining the upper surface of the pedestal prior to lamination of the flex circuit to the pedestal. The contoured topography improves the flow of backside cooling gas resulting in a more uniform wafer temperature profile.

Abstract: A failure resistant electrostatic chuck 20 for holding a substrate 35 during processing of the substrate 35 comprises one or more electrodes 25 covered by an insulator 30, the electrodes 25 capable of electrostatically holding a substrate 35 when a voltage is applied thereto. An electrical power bus 40 comprises one or more output terminals 45 that conduct voltage to the electrodes 25. The fuses 50 are positioned in hollow cavities 55 in the insulator 30, and electrically connect the electrodes 25 in series to the output terminals 45 of the power bus 40. Each fuse 50 can electrically disconnect an electrode 25 from an output terminal 45 when the insulator 30 covering the electrode 25 punctures and exposes the electrode 25 to a plasma process environment thereby causing a plasma current discharge to flow through the fuse 50.