Abstract: An electronics unit including a plurality of electronics positioned therein that generate electromagnetic interference (EMI) and/or thermal energy. The electronics unit may include a housing defining a plurality of openings positioned on a first side thereof, and a plurality of clips attached to the housing. A corresponding clip of the plurality of clips is positioned in a corresponding opening of the plurality of opening for attachment to a vehicle. The plurality of clips enables thermal energy to be transmitted from the plurality of electronics to a first portion of the vehicle, and mitigates the EMI, when the electronics unit is attached to the vehicle.

Abstract: Methods and systems for an electronic package for a vehicle are provided. In one example, the electronic package includes a chassis having a plurality of bent tabs forming a plurality of respective vent openings in the chassis, and a circuit board coupled to the chassis, wherein the bent tabs directly contact the circuit board.

Abstract: An electronic device having at least one circuit board. The circuit board has a predetermined pattern of solder bumps facilitating a ground connection with a first enclosure member and/or a second enclosure member. The at least one circuit board is sandwiched between the first and second enclosure members, each of the first and second enclosure members has a surface facing the circuit board and the surface facing the circuit board has a bead extending therefrom contacting the predetermined pattern of solder bumps to complete the ground connection.

Abstract: An electronic device having at least one circuit board. The circuit board has a predetermined pattern of solder bumps facilitating a ground connection with a first enclosure member and/or a second enclosure member. The at least one circuit board is sandwiched between the first and second enclosure members, each of the first and second enclosure members has a surface facing the circuit board and the surface facing the circuit board has a bead extending therefrom contacting the predetermined pattern of solder bumps to complete the ground connection.

Abstract: Methods and systems for an electronic package for a vehicle are provided. In one example, the electronic package includes a chassis having a plurality of bent tabs forming a plurality of respective vent openings in the chassis, and a circuit board coupled to the chassis, wherein the bent tabs directly contact the circuit board.

Abstract: An electronic device having at least one circuit board. The circuit board has a predetermined pattern of solder bumps facilitating a ground connection with a first enclosure member and/or a second enclosure member. The at least one circuit board is sandwiched between the first and second enclosure members, each of the first and second enclosure members has a surface facing the circuit board and the surface facing the circuit board has a bead extending therefrom contacting the predetermined pattern of solder bumps to complete the ground connection.

Abstract: An electronic device having at least one circuit board. The circuit board has a predetermined pattern of solder bumps facilitating a ground connection with a first enclosure member and/or a second enclosure member. The at least one circuit board is sandwiched between the first and second enclosure members, each of the first and second enclosure members has a surface facing the circuit board and the surface facing the circuit board has a bead extending therefrom contacting the predetermined pattern of solder bumps to complete the ground connection.

Abstract: An electronic device having at least one circuit board. The circuit board has a predetermined pattern of solder bumps facilitating a ground connection with a first enclosure member and/or a second enclosure member. The at least one circuit board is sandwiched between the first and second enclosure members, each of the first and second enclosure members has a surface facing the circuit board and the surface facing the circuit board has a bead extending therefrom contacting the predetermined pattern of solder bumps to complete the ground connection.

Abstract: An electronic device having at least one circuit board. The circuit board has a predetermined pattern of solder bumps facilitating a ground connection with a first enclosure member and/or a second enclosure member. The at least one circuit board is sandwiched between the first and second enclosure members, each of the first and second enclosure members has a surface facing the circuit board and the surface facing the circuit board has a bead extending therefrom contacting the predetermined pattern of solder bumps to complete the ground connection.

Abstract: A vane assembly for distribution of a stratified fluid in an aircraft is taught herein. The vane assembly includes a housing including a housing inlet and a housing outlet. The housing inlet is configured to receive the stratified fluid with the stratified fluid including a first portion and a second portion. The housing outlet is configured to exhaust the stratified fluid. The housing defines an interior housing volume between the housing inlet and the housing outlet. The vane assembly further includes a vane disposed within the interior housing volume and bisecting the interior housing volume. The vane includes a leading edge adjacent the housing inlet and a trailing edge adjacent the housing outlet. The trailing edge is angularly offset from the leading edge.

Abstract: A vane assembly for distribution of a stratified fluid in an aircraft is taught herein. The vane assembly includes a housing including a housing inlet and a housing outlet. The housing inlet is configured to receive the stratified fluid with the stratified fluid including a first portion and a second portion. The housing outlet is configured to exhaust the stratified fluid. The housing defines an interior housing volume between the housing inlet and the housing outlet. The vane assembly further includes a vane disposed within the interior housing volume and bisecting the interior housing volume. The vane includes a leading edge adjacent the housing inlet and a trailing edge adjacent the housing outlet. The trailing edge is angularly offset from the leading edge.

Abstract: A method and apparatus for reducing the risk that a thrown toy will injure an animal. The apparatus consists of a toy which when thrown bounces erratically, which compressively elastically deforms, which includes a soft fabric outer surface that compresses to absorb blows, and which can withstand being bitten or chewed by a dog.

Abstract: A method and apparatus for reducing the risk that a thrown toy will injure an animal. The apparatus consists of a toy which when thrown bounces erratically, which compressively elastically deforms, which includes a soft fabric outer surface that compresses to absorb blows, and which can withstand being bitten or chewed by a dog.

Abstract: A method and apparatus for reducing the risk that a thrown toy will injure an animal. The apparatus consists of a toy which when thrown bounces erratically, which compressively elastically deforms, which includes a soft fabric outer surface that compresses to absorb blows, and which can withstand being bitten or chewed by a dog.

Abstract: A method and apparatus for reducing the risk that a thrown toy will injure an animal. The apparatus consists of a toy which when thrown bounces erratically, which compressively elastically deforms, which includes a soft fabric outer surface that compresses to absorb blows, and which can withstand being bitten or chewed by a dog.

Abstract: A method and apparatus for reducing the risk that a thrown toy will injure an animal. The apparatus consists of a toy which when thrown bounces erratically, which compressively elastically deforms, which includes a soft fabric outer surface that compresses to absorb blows, and which can withstand being bitten or chewed by a dog.