Patents by Inventor Jon G. Aday

Jon G. Aday has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor module package substrate fabrication method
    Patent number: 6494361
    Abstract: Organic solderability protectant (OSP) is applied to copper bond pads. The copper bond pads include flip chip bond pads and SMD bond pads on a dielectric upper surface and BGA bond pads on a dielectric lower surface. Solder paste is applied to the flip chip bond pads. This solder paste is reflowed in an inert atmosphere to form solder-on-pads (SOPs) on the flip chip bond pads. Flux residue from the solder paste is then removed with water. By reflowing the solder paste in an inert atmosphere and removing the flux residue with water, degradation of the OSP and oxidation of the SMD and BGA bond pads is inhibited.
    Type: Grant
    Filed: January 26, 2001
    Date of Patent: December 17, 2002
    Assignee: Amkor Technology, Inc.
    Inventors: Christopher Scanlan, Jon G. Aday
  • Semiconductor module package substrate
    Patent number: 6445075
    Abstract: A substrate includes a flip chip bond pad and a first bond pad on a dielectric substrate layer. First and second organic solderability protectant (OSP) layers are on the flip chip bond and first bond pad, respectively. A solder paste is on the first OSP layer. The solder paste is reflowed in an inert atmosphere to form a solder-on-pad (SOP) directly on and in contact with the flip chip bond pad. A sufficient thickness of the second OSP layer remains after reflow to inhibit oxidation of the first bond pad.
    Type: Grant
    Filed: January 26, 2001
    Date of Patent: September 3, 2002
    Assignee: Amkor Technology, Inc.
    Inventors: Christopher Scanlan, Jon G. Aday
  • Surface acoustic wave device package and method
    Patent number: 5969461
    Abstract: A method for packaging an acoustic wave device (10) without contaminating an active area (12) disposed on a face (14) thereof, including steps of: providing a substrate with a top (30) having conductive pads (18), bonding stud bumps (20) to a periphery (22) of the face (14) of the acoustic wave device, disposing a dam (26) onto the top (30) of the substrate and inside of the location of the conductive pads (18), aligning and connecting the stud bumps (20) to the conductive pads (18) on the top of the substrate to form electrically conductive interconnections between the acoustic wave device (10) and the substrate (16), flowing an underfill material (28) at the periphery (22) of the acoustic wave device and around the interconnections such that the underfill material (28) stops at a boundary (32) defined by the dam (26), and curing the underfill material (28) to mechanically reinforce and protectively encapsulate the interconnections.
    Type: Grant
    Filed: April 8, 1998
    Date of Patent: October 19, 1999
    Assignee: CTS Corporation
    Inventors: Michael J. Anderson, Gregory Kennison, Jeffrey E. Christensen, Gary C. Johnson, Jon G. Aday