Patents by Inventor Jon Greenwood

Jon Greenwood has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8669166
    Abstract: One illustrative method disclosed herein includes forming a plurality of die above a crystalline semiconducting substrate, irradiating and cooling an edge region of the substrate to form an amorphous region in the edge region of the substrate and, after forming the amorphous region, performing at least one process operation to reduce the thickness of the substrate.
    Type: Grant
    Filed: August 15, 2012
    Date of Patent: March 11, 2014
    Assignee: GLOBALFOUNDRIES Inc.
    Inventors: Rahul Agarwal, Ramakanth Alapati, Jon Greenwood
  • Publication number: 20140051233
    Abstract: One illustrative method disclosed herein includes forming a plurality of die above a crystalline semiconducting substrate, irradiating and cooling an edge region of the substrate to form an amorphous region in the edge region of the substrate and, after forming the amorphous region, performing at least one process operation to reduce the thickness of the substrate.
    Type: Application
    Filed: August 15, 2012
    Publication date: February 20, 2014
    Applicant: GLOBALFOUNDRIES INC.
    Inventors: Rahul Agarwal, Ramakanth Alapati, Jon Greenwood
  • Patent number: D1016688
    Type: Grant
    Filed: February 27, 2023
    Date of Patent: March 5, 2024
    Assignee: PACCAR Inc
    Inventors: Victor Garcia, Reed Greenwood, Quentin Vanderlaan, Brad Powell, Jon Forrest Acton
  • Patent number: D1016689
    Type: Grant
    Filed: February 27, 2023
    Date of Patent: March 5, 2024
    Assignee: PACCAR Inc
    Inventors: Victor Garcia, Reed Greenwood, Brad Powell, Jon Forrest Acton