Patents by Inventor Jon Gregory Aday

Jon Gregory Aday has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Fingerprint sensor device and methods thereof
    Patent number: 11003884
    Abstract: A fingerprint sensor device includes a sensor substrate, a plurality of sensor circuits over a first surface of the sensor substrate, and a transceiver layer located over the plurality of sensor circuits and the first surface of the sensor substrate. The transceiver layer includes a piezoelectric layer and a transceiver electrode positioned over the piezoelectric layer. The piezoelectric layer and the transceiver electrode are configured to generate one or more ultrasonic waves or to receive one or more ultrasonic waves. The fingerprint sensor device may include a cap coupled to the sensor substrate and a cavity formed between the cap and the sensor substrate. The cavity and the sensor substrate may form an acoustic barrier.
    Type: Grant
    Filed: February 10, 2017
    Date of Patent: May 11, 2021
    Assignee: QUALCOMM Incorporated
    Inventors: Nicholas Ian Buchan, Mario Francisco Velez, Chin-Jen Tseng, Hrishikesh Vijaykumar Panchawagh, Firas Sammoura, Jessica Liu Strohmann, Kostadin Dimitrov Djordjev, David William Burns, Leonard Eugene Fennell, Jon Gregory Aday
  • INTERFACE SUBSTRATE AND METHOD OF MAKING THE SAME
    Publication number: 20200066964
    Abstract: A package may include a substrate and a semiconductor die with the substrate having a smaller width than the semiconductor die and encapsulated in a mold compound. In one example, the package may be a wafer level package that allows an external connection on the backside of the package to enable manufacturing in a panel or wafer form.
    Type: Application
    Filed: October 28, 2019
    Publication date: February 27, 2020
    Inventors: Jon Gregory ADAY, Hong Bok WE, Steve Joseph BEZUK, Nicholas Ian BUCHAN
  • Interface substrate and method of making the same
    Patent number: 10516092
    Abstract: A package may include a substrate and a semiconductor die with the substrate having a smaller width than the semiconductor die and encapsulated in a mold compound. In one example, the package may be a wafer level package that allows an external connection on the backside of the package to enable manufacturing in a panel or wafer form.
    Type: Grant
    Filed: September 2, 2016
    Date of Patent: December 24, 2019
    Assignee: QUALCOMM Incorporated
    Inventors: Jon Gregory Aday, Hong Bok We, Steve Joseph Bezuk, Nicholas Ian Buchan
  • FINGERPRINT SENSOR DEVICE AND METHODS THEREOF
    Publication number: 20170364726
    Abstract: A fingerprint sensor device includes a sensor substrate, a plurality of sensor circuits over a first surface of the sensor substrate, and a transceiver layer located over the plurality of sensor circuits and the first surface of the sensor substrate. The transceiver layer includes a piezoelectric layer and a transceiver electrode positioned over the piezoelectric layer. The piezoelectric layer and the transceiver electrode are configured to generate one or more ultrasonic waves or to receive one or more ultrasonic waves. The fingerprint sensor device may include a cap coupled to the sensor substrate and a cavity formed between the cap and the sensor substrate. The cavity and the sensor substrate may form an acoustic barrier.
    Type: Application
    Filed: February 10, 2017
    Publication date: December 21, 2017
    Inventors: Nicholas Ian Buchan, Mario Francisco Velez, Chin-Jen Tseng, Hrishikesh Vijaykumar Panchawagh, Firas Sammoura, Jessica Liu Strohmann, Kostadin Dimitrov Djordjev, David Williams Burns, Leonard Eugene Fennell, Jon Gregory Aday
  • INTERFACE SUBSTRATE AND METHOD OF MAKING THE SAME
    Publication number: 20170323926
    Abstract: A package may include a substrate and a semiconductor die with the substrate having a smaller width than the semiconductor die and encapsulated in a mold compound. In one example, the package may be a wafer level package that allows an external connection on the backside of the package to enable manufacturing in a panel or wafer form.
    Type: Application
    Filed: September 2, 2016
    Publication date: November 9, 2017
    Inventors: Jon Gregory ADAY, Hong Bok WE, Steve Joseph BEZUK, Nicholas Ian BUCHAN
  • Thin substrate fabrication method and structure
    Patent number: 8017436
    Abstract: A method of forming a package includes forming a circuit pattern on a first carrier and embedding the circuit pattern in a dielectric material on a second carrier. The first carrier is removed and a buildup dielectric material is mounted to the dielectric material and the circuit pattern. Laser-ablated artifacts are formed in the buildup dielectric material and filled with an electrically conductive material to form a buildup circuit pattern. The second carrier is patterned into a stiffener, which provides rigidity to the thin package.
    Type: Grant
    Filed: December 10, 2007
    Date of Patent: September 13, 2011
    Assignee: Amkor Technology, Inc.
    Inventors: Ronald Patrick Huemoeller, Sukianto Rusli, Bob Shih-Wei Kuo, Jon Gregory Aday, Lee John Smith, Robert F. Darveaux