Abstract: An innovative passive cooling solution with sealed UAV enclosure system allows heat from a semiconductor chip to be dissipated to the ambient environment through evaporation/condensation phase-change cooling and air cooling a heat sink such as a fin without any additional power consumption to operate cooling solution. One example of such a solution may include a pipe with a fin and a fluid. The pipe may include a wick structure along an inner surface of the pipe configured to allow the fluid to travel within the wick structure and to allow a vapor form of the fluid to exit the wick structure towards a center of the pipe.

Abstract: In accordance with one aspect of the present disclosure, a head unit of a movable barrier operator is provided including a motor for moving a movable barrier and a first circuit board operable to provide power to the motor. The head unit includes a fire-resistant container that contains the first circuit board. This permits the electrical components of the head unit that utilize higher voltage, such as 120 volts, to be provided on the first circuit board and contained in the fire-resistant container. The head unit further includes a second circuit board outside of the fire-resistant container and operably coupled to the first circuit board. Because the second circuit board is outside of the fire-resistant container, the second circuit board may contain electrical components of the head unit that operate at lower voltages, such as at or below 24 volts.

Abstract: Disclosed are compounds of formula (I), pharmaceutical compositions comprising such compounds and methods/uses of using the same, for example, for treating a JAK-related disorder, such as cancer, cancer cachexia or an immune disorder: wherein R1 is methyl or ethyl; R2 is selected from methyl, ethyl, methoxy and ethoxy; R3 is selected from hydrogen, chlorine, fluorine, bromine and methyl; R4 is selected from methyl, ethyl and —CH2OCH3; R5 and R6 are each individually methyl or hydrogen; and R7 is selected from methyl, ethyl, —(CH2)2OH and —(CH2)2OCH3, or a pharmaceutically acceptable salt thereof.

Abstract: Disclosed are compounds of formula (I), pharmaceutical compositions comprising such compounds and methods/uses of using the same, for example, for treating a JAK-related disorder, such as cancer, cancer cachexia or an immune disorder: wherein R1 is methyl or ethyl; R2 is selected from methyl, ethyl, methoxy and ethoxy; R3 is selected from hydrogen, chlorine, fluorine, bromine and methyl; R4 is selected from methyl, ethyl and —CH2OCH3; R5 and R6 are each individually methyl or hydrogen; and R7 is selected from methyl, ethyl, —(CH2)2OH and —(CH2)2OCH3, or a pharmaceutically acceptable salt thereof.

Abstract: Various aspects of the present disclosure include methods, components and wireless devices configured to determine appropriate generalized system-wide thermal management policies and settings in wireless devices depending upon whether communication activities are driving or otherwise causing thermal conditions. In various aspects, a processor may determine workload characteristics and select and apply an appropriate thermal management policy/solution (or thermal configuration, settings etc.) based on the determine workload characteristics. The processor may determine workload characteristics based upon data from two or more temperature sensors within the wireless device. The processor may select a generalized system-wide thermal management policy suitable for operating when communication activities (e.g., 5G communication activities) are generating so much heat that CPU-centric thermal management policies are in appropriate.

Abstract: The present invention relates to compounds of formulae I and H, or pharmaceutically acceptable salts or esters thereof. Further aspects of the invention relate to pharmaceutical compositions and therapeutic uses of said compounds in the treatment of diseases of uncontrolled cell growth, proliferation and/or survival, inappropriate cellular immune responses, inappropriate cellular inflammatory responses, or neurodegenerative disorders, preferably tauopathies, even more preferably. Alzheimer's disease.

Abstract: An innovative passive cooling solution with sealed UAV enclosure system allows heat from a semiconductor chip to be dissipated to the ambient environment through evaporation/condensation phase-change cooling and air cooling a heat sink such as a fin without any additional power consumption to operate cooling solution. One example of such a solution may include a pipe with a fin and a fluid. The pipe may include a wick structure along an inner surface of the pipe configured to allow the fluid to travel within the wick structure and to allow a vapor form of the fluid to exit the wick structure towards a center of the pipe.

Abstract: Disclosed are compounds of formula (I), pharmaceutical compositions comprising such compounds and methods/uses of using the same, for example, for treating a JAK-related disorder, such as cancer, cancer cachexia or an immune disorder: wherein R1 is methyl or ethyl; R2 is selected from methyl, ethyl, methoxy and ethoxy; R3 is selected from hydrogen, chlorine, fluorine, bromine and methyl; R4 is selected from methyl, ethyl and —CH2OCH3; R5 and R6 are each individually methyl or hydrogen; and R7 is selected from methyl, ethyl, —(CH2)2OH and —(CH2)2OCH3, or a pharmaceutically acceptable salt thereof.

Abstract: In accordance with one aspect of the present disclosure, a head unit of a movable barrier operator is provided including a motor for moving a movable barrier and a first circuit board operable to provide power to the motor. The head unit includes a fire-resistant container that contains the first circuit board. This permits the electrical components of the head unit that utilize higher voltage, such as 120 volts, to be provided on the first circuit board and contained in the fire-resistant container. The head unit further includes a second circuit board outside of the fire-resistant container and operably coupled to the first circuit board. Because the second circuit board is outside of the fire-resistant container, the second circuit board may contain electrical components of the head unit that operate at lower voltages, such as at or below 24 volts.

Abstract: A device that includes a region comprising an integrated device, and a heat dissipating device coupled to the region comprising the integrated device. The heat dissipating device is configured to dissipate heat away from the region. The heat dissipating device includes a fluid, an evaporator configured to evaporate the fluid, a condenser configured to condense the fluid, an inner wall coupled to the evaporator and the condenser, an outer shell encapsulating the fluid, the evaporator, the condenser and the inner wall, an evaporation portion configured to channel an evaporated fluid from the evaporator to the condenser, and a collection portion configured to channel a condensed fluid from the condenser to the evaporator. The heat dissipating device includes one or more piezo structures configured to move fluid inside the heat dissipating device.

Abstract: The present invention relates to compounds of formulae I and H, or pharmaceutically acceptable salts or esters thereof. Further aspects of the invention relate to pharmaceutical compositions and therapeutic uses of said compounds in the treatment of diseases of uncontrolled cell growth, proliferation and/or survival, inappropriate cellular immune responses, inappropriate cellular inflammatory responses, or neurodegenerative disorders, preferably tauopathies, even more preferably. Alzheimer's disease.

Abstract: The present invention relates to compounds of formulae I and H, or pharmaceutically acceptable salts or esters thereof. Further aspects of the invention relate to pharmaceutical compositions and therapeutic uses of said compounds in the treatment of diseases of uncontrolled cell growth, proliferation and/or survival, inappropriate cellular immune responses, inappropriate cellular inflammatory responses, or neurodegenerative disorders, preferably tauopathies, even more preferably, Alzheimer's disease.

Abstract: Disclosed are compounds of formula (I), pharmaceutical compositions comprising such compounds and methods/uses of using the same, for example, for treating a JAK-related disorder, such as cancer, cancer cachexia or an immune disorder: wherein R1 is methyl or ethyl; R2 is selected from methyl, ethyl, methoxy and ethoxy; R3 is selected from hydrogen, chlorine, fluorine, bromine and methyl; R4 is selected from methyl, ethyl and —CH2OCH3; R5 and R6 are each individually methyl or hydrogen; and R7 is selected from methyl, ethyl, —(CH2)2OH and —(CH2)2OCH3, or a pharmaceutically acceptable salt thereof.

Abstract: Various aspects of the present disclosure include methods, components and wireless devices configured to determine appropriate generalized system-wide thermal management policies and settings in wireless devices depending upon whether communication activities are driving or otherwise causing thermal conditions. In various aspects, a processor may determine workload characteristics and select and apply an appropriate thermal management policy/solution (or thermal configuration, settings etc.) based on the determine workload characteristics. The processor may determine workload characteristics based upon data from two or more temperature sensors within the wireless device. The processor may select a generalized system-wide thermal management policy suitable for operating when communication activities (e.g., 5G communication activities) are generating so much heat that CPU-centric thermal management policies are in appropriate.

Abstract: The present invention relates to compounds of formulae I, or pharmaceutically acceptable salts or esters thereof, wherein: R1 is selected from H and CO—NR8R9, wherein R8 and R9 are each independently selected from H, alkyl, cycloalkyl and mono or bicyclic heterocycloalkyl, wherein said alkyl group is optionally substituted by one or more R12 groups, and said heterocycloalkyl is optionally substituted by R10 or R12; or R8 and R9 are linked, together with the nitrogen to which they are attached, to form a heterocycloalkyl group optionally containing one or more additional heteroatoms, and optionally substituted by one or more groups select from R10 and (CH2)mR12; R2 is selected from H and alkyl, wherein said alkyl group is optionally substituted by one or more R12 groups; R3 is selected from alkyl, cycloalkyl and heterocycloalkyl, each of which may be optionally substituted by halo, OH or alkoxy; Z1, Z2, Z3 and Z4 are all C; R4, R5, R6 and R7 are each independently selected from H, alkyl, CN, NO2, OH, alkoxy, N

Abstract: A device that includes an integrated device and a heat dissipating device coupled to the integrated device. The heat dissipating device includes an electro-osmotic (EO) pump. The electro-osmotic (EO) pump includes a casing comprising a first opening and a second opening; a membrane located in the casing; an anode electrode; a cathode electrode; and a catalyst layer formed on a surface of the membrane. The membrane includes a plurality of channels. The electro-osmotic (EO) pump is configured to provide a fluid to flow from the first opening of the casing, through the plurality of channels of the membrane and out of the second opening of the casing. The catalyst layer is configured to recombine gas ions that are produced by the electro-osmotic (EO) pump.

Abstract: A device that includes a region comprising an integrated device, and a heat dissipating device coupled to the region comprising the integrated device. The heat dissipating device is configured to dissipate heat away from the region. The heat dissipating device includes a fluid, an evaporator configured to evaporate the fluid, a condenser configured to condense the fluid, an inner wall coupled to the evaporator and the condenser, an outer shell encapsulating the fluid, the evaporator, the condenser and the inner wall, an evaporation portion configured to channel an evaporated fluid from the evaporator to the condenser, and a collection portion configured to channel a condensed fluid from the condenser to the evaporator. The heat dissipating device includes one or more piezo structures configured to move fluid inside the heat dissipating device.

Abstract: A device that includes a region comprising an integrated device, and a heat dissipating device coupled to the region comprising the integrated device. The heat dissipating device is configured to dissipate heat away from the region. The heat dissipating device includes a fluid, an evaporator configured to evaporate the fluid, a condenser configured to condense the fluid, an inner wall coupled to the evaporator and the condenser, an outer shell encapsulating the fluid, the evaporator, the condenser and the inner wall, an evaporation portion configured to channel an evaporated fluid from the evaporator to the condenser, wherein the evaporation portion is at least partially defined by the inner wall, and a collection portion configured to channel a condensed fluid from the condenser to the evaporator, wherein the collection portion is at least partially defined by the inner wall. The heat dissipating device may be a multi-phase heat dissipating device.

Abstract: Aspects include computing devices, systems, and methods for managing a first computing device component of a computing device in order to extend an operating life of the computing device component. In an aspect, a processing device may determine a condition estimator of the first computing device component, determine whether the condition estimator of the first computing device component indicates that a condition of the first computing device component is worse than the condition of a second computing device component, and assign workloads to the first and second computing device components to balance deterioration of the condition of the first and second computing device components in response to determining that the condition estimator of the first computing device component indicates that the condition of the first computing device component is worse than the condition of the second computing device component.

Abstract: Disclosed are compounds of formula (I), pharmaceutical compositions comprising such compounds and methods/uses of using the same, for example, for treating a JAK-related disorder, such as cancer, cancer cachexia or an immune disorder: wherein R1 is methyl or ethyl; R2 is selected from methyl, ethyl, methoxy and ethoxy; R3 is selected from hydrogen, chlorine, fluorine, bromine and methyl; R4 is selected from methyl, ethyl and —CH2OCH3; R5 and R6 are each individually methyl or hydrogen; and R7 is selected from methyl, ethyl, —(CH2)2OH and —(CH2)2OCH3, or a pharmaceutically acceptable salt thereof.