Patents by Inventor Jon Lasiter
Jon Lasiter has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11877041Abstract: An image sensor including a planar sensor array, a lens configured to form an optical image on the planar sensor array and characterized by a locus of focal points on a curved surface, and a cover glass with multiple thickness levels or multiple cover glasses of different sizes. The one or more cover glasses are configured to shift the locus of focal points for large field angles, such that there are multiple intersections between the planar sensor array and the locus of focal points for a large FOV, and thus multiple zones with best focus on the planar sensor array.Type: GrantFiled: July 23, 2020Date of Patent: January 16, 2024Assignee: QUALCOMM IncorporatedInventors: Russell Gruhlke, Ravindra Vaman Shenoy, Jon Lasiter, Donald William Kidwell, Khurshid Syed Alam, Kebin Li
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Patent number: 11711594Abstract: An image sensor device includes two or more image sensor arrays (or two or more regions of an image sensor array) and a low-power processor in a same package for capturing two or more images of an object, such as an eye of a user, using light in two or more wavelength bands, such as visible band, near-infrared band, and short-wave infrared band. The image sensor device includes one or more lens assemblies and/or a beam splitter for forming an image of the object on each of the two or more image sensor arrays. The image sensor device also includes one or more filters configured to select light from multiple wavelength bands for imaging by the respective image sensor arrays.Type: GrantFiled: March 1, 2021Date of Patent: July 25, 2023Assignee: QUALCOMM IncorporatedInventors: Jon Lasiter, Ravindra Vaman Shenoy, Ravishankar Sivalingam, Russell Gruhlke, Donald William Kidwell, Khurshid Syed Alam, Kebin Li
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Patent number: 11678043Abstract: Various aspects of the present disclosure generally relate to a sensor module. In some aspects, a sensor module may include a collar configured to be attached to a camera module for a user device. The collar may include a first opening that is configured to align with an aperture of a camera of the camera module, and a second opening. The sensor module may include a sensor embedded in the collar. The sensor may be aligned with the second opening of the collar. Numerous other aspects are provided.Type: GrantFiled: September 3, 2021Date of Patent: June 13, 2023Assignee: QUALCOMM IncorporatedInventors: Russell Gruhlke, Jon Lasiter, Ravindra Vaman Shenoy, Ravishankar Sivalingam, Kebin Li, Khurshid Syed Alam
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Patent number: 11450964Abstract: An apparatus is disclosed for an antenna with a conductive cage. In an example aspect, the apparatus includes a ground plane with at least one opening. The apparatus also includes at least one antenna assembly with at least one radiating element, at least one feed via, and a conductive cage. The radiating element is implemented on a first plane that is substantially parallel to the ground plane. The feed via is connected to the at least one radiating element and is configured to connect to at least one transmission line through the opening. The conductive cage includes at least three ground vias, which are connected to the ground plane at positions that are distributed around the opening. Lengths of the at least three ground vias extend a portion of a distance between the ground plane and the radiating element.Type: GrantFiled: September 9, 2020Date of Patent: September 20, 2022Assignee: QUALCOMM IncorporatedInventors: Seong Heon Jeong, Mohammad Ali Tassoudji, Jeremy Darren Dunworth, Jon Lasiter, Ravindra Vaman Shenoy
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Publication number: 20220279137Abstract: An image sensor device includes two or more image sensor arrays (or two or more regions of an image sensor array) and a low-power processor in a same package for capturing two or more images of an object, such as an eye of a user, using light in two or more wavelength bands, such as visible band, near-infrared band, and short-wave infrared band. The image sensor device includes one or more lens assemblies and/or a beam splitter for forming an image of the object on each of the two or more image sensor arrays. The image sensor device also includes one or more filters configured to select light from multiple wavelength bands for imaging by the respective image sensor arrays.Type: ApplicationFiled: March 1, 2021Publication date: September 1, 2022Inventors: Jon LASITER, Ravindra Vaman SHENOY, Ravishankar SIVALINGAM, Russell GRUHLKE, Donald William KIDWELL, Khurshid Syed ALAM, Kebin LI
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Patent number: 11411321Abstract: An antenna system includes: a ground conductor; a substrate; a pair of planar dipole conductors disposed such that at least a portion of the substrate is disposed between the ground conductor and the pair of dipole conductors; a pair of energy couplers each electrically connected to a respective one of the pair of dipole conductors; and a pair of isolated lobes including electrically-conductive material. The pair of isolated lobes are electrically separate from the pair of dipole conductors and the pair of energy couplers, and disposed between the pair of dipole conductors and the ground conductor.Type: GrantFiled: December 5, 2019Date of Patent: August 9, 2022Assignee: QUALCOMM IncorporatedInventors: Jon Lasiter, Donald William Kidwell, Jr., Ravindra Vaman Shenoy, Mohammad Ali Tassoudji, Jeremy Darren Dunworth, Vladimir Aparin, Yu-Chin Ou, Seong Heon Jeong
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Patent number: 11277559Abstract: In one example, an image sensor module comprises one or more covers having at least a first opening and a second opening, a first lens mounted in the first opening and having a first field of view (FOV) centered at a first axis having a first orientation, a second lens mounted in the second opening and having a second FOV centered at a second axis having a second orientation different from the first orientation, a first image sensor housed within the one or more covers and configured to detect light via the first lens, and a second image sensor housed within the one or more covers and configured to detect light via the second lens. The first image sensor and the second image sensor are configured to provide, based on the detected light, image data of a combined FOV larger than each of the first FOV and the second FOV.Type: GrantFiled: April 23, 2020Date of Patent: March 15, 2022Assignee: QUALCOMM IncorporatedInventors: Jon Lasiter, Evgeni Gousev, Ravindra Vaman Shenoy, Russell Gruhlke, Khurshid Syed Alam, Kebin Li, Edwin Chongwoo Park
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Publication number: 20220077586Abstract: An apparatus is disclosed for an antenna with a conductive cage. In an example aspect, the apparatus includes a ground plane with at least one opening. The apparatus also includes at least one antenna assembly with at least one radiating element, at least one feed via, and a conductive cage. The radiating element is implemented on a first plane that is substantially parallel to the ground plane. The feed via is connected to the at least one radiating element and is configured to connect to at least one transmission line through the opening. The conductive cage includes at least three ground vias, which are connected to the ground plane at positions that are distributed around the opening. Lengths of the at least three ground vias extend a portion of a distance between the ground plane and the radiating element.Type: ApplicationFiled: September 9, 2020Publication date: March 10, 2022Inventors: Seong Heon Jeong, Mohammad Ali Tassoudji, Jeremy Darren Dunworth, Jon Lasiter, Ravindra Vaman Shenoy
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Publication number: 20220030148Abstract: An image sensor including a planar sensor array, a lens configured to form an optical image on the planar sensor array and characterized by a locus of focal points on a curved surface, and a cover glass with multiple thickness levels or multiple cover glasses of different sizes. The one or more cover glasses are configured to shift the locus of focal points for large field angles, such that there are multiple intersections between the planar sensor array and the locus of focal points for a large FOV, and thus multiple zones with best focus on the planar sensor array.Type: ApplicationFiled: July 23, 2020Publication date: January 27, 2022Inventors: Russell GRUHLKE, Ravindra Vaman SHENOY, Jon LASITER, Donald William KIDWELL, Khurshid Syed ALAM, Kebin LI
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Patent number: 11228086Abstract: An antenna package comprising a chip package including a plurality of feed lines, a first half antenna subassembly electrically coupled to the feed lines, and a second half antenna subassembly electrically coupled to the feed lines, wherein the first and second half antenna subassemblies point away from each other in a direction substantially perpendicular to the chip package. The antenna subassemblies may be millimeter (mm) wave antennas covering from approximately 24 to 43.5 GHz. The antenna subassemblies include a flex substrate formed from printed circuit boards (PCB) or flex-film PCB.Type: GrantFiled: June 11, 2018Date of Patent: January 18, 2022Assignee: Qualcomm IncorporatedInventors: Jon Lasiter, Ravindra Vaman Shenoy, Mohammad Ali Tassoudji, Seong Heon Jeong, Jeremy Darren Dunworth
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Patent number: 11223116Abstract: Certain aspects of the present disclosure provide a glass ceramic antenna package having a large bandwidth (e.g., 19 GHz) for millimeter wave (mmWave) applications, for example. The antenna package generally includes an antenna element comprising a first substrate layer and a second substrate layer, wherein the first substrate layer comprises an antenna, wherein the second substrate layer comprises shielding elements and feed lines, and wherein the feed lines are electrically coupled to the antenna. The antenna package also includes a lead frame adjacent to one or more lateral surfaces of the antenna element.Type: GrantFiled: June 29, 2018Date of Patent: January 11, 2022Assignee: QUALCOMM IncorporatedInventors: Jon Lasiter, Seong Heon Jeong, Ravindra Vaman Shenoy, Jeremy Darren Dunworth, Mohammad Ali Tassoudji
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Publication number: 20210400178Abstract: Various aspects of the present disclosure generally relate to a sensor module. In some aspects, a sensor module may include a collar configured to be attached to a camera module for a user device. The collar may include a first opening that is configured to align with an aperture of a camera of the camera module, and a second opening. The sensor module may include a sensor embedded in the collar. The sensor may be aligned with the second opening of the collar. Numerous other aspects are provided.Type: ApplicationFiled: September 3, 2021Publication date: December 23, 2021Inventors: Russell GRUHLKE, Jon LASITER, Ravindra Vaman SHENOY, Ravishankar SIVALINGAM, Kebin LI, Khurshid Syed ALAM
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Patent number: 11115576Abstract: Various aspects of the present disclosure generally relate to a sensor module. In some aspects, a sensor module may include a collar configured to be attached to a camera module for a user device. The collar may include a first opening that is configured to align with an aperture of a camera of the camera module, and a second opening. The sensor module may include a sensor embedded in the collar. The sensor may be aligned with the second opening of the collar. Numerous other aspects are provided.Type: GrantFiled: July 24, 2019Date of Patent: September 7, 2021Assignee: QUALCOMM IncorporatedInventors: Russell Gruhlke, Jon Lasiter, Ravindra Vaman Shenoy, Ravishankar Sivalingam, Kebin Li, Khurshid Syed Alam
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Publication number: 20210175636Abstract: An antenna system includes: a ground conductor; a substrate; a pair of planar dipole conductors disposed such that at least a portion of the substrate is disposed between the ground conductor and the pair of dipole conductors; a pair of energy couplers each electrically connected to a respective one of the pair of dipole conductors; and a pair of isolated lobes including electrically-conductive material. The pair of isolated lobes are electrically separate from the pair of dipole conductors and the pair of energy couplers, and disposed between the pair of dipole conductors and the ground conductor.Type: ApplicationFiled: December 5, 2019Publication date: June 10, 2021Inventors: Jon LASITER, Donald William KIDWELL, JR., Ravindra Vaman SHENOY, Mohammad Ali TASSOUDJI, Jeremy Darren DUNWORTH, Vladimir Aparin, Yu-Chin OU, Seong Heon JEONG
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Publication number: 20200344413Abstract: In one example, an image sensor module comprises one or more covers having at least a first opening and a second opening, a first lens mounted in the first opening and having a first field of view (FOV) centered at a first axis having a first orientation, a second lens mounted in the second opening and having a second FOV centered at a second axis having a second orientation different from the first orientation, a first image sensor housed within the one or more covers and configured to detect light via the first lens, and a second image sensor housed within the one or more covers and configured to detect light via the second lens. The first image sensor and the second image sensor are configured to provide, based on the detected light, image data of a combined FOV larger than each of the first FOV and the second FOV.Type: ApplicationFiled: April 23, 2020Publication date: October 29, 2020Inventors: Jon LASITER, Evgeni GOUSEV, Ravindra Vaman SHENOY, Russell GRUHLKE, Khurshid Syed ALAM, Kebin LI, Edwin Chongwoo PARK
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Publication number: 20200314305Abstract: Various aspects of the present disclosure generally relate to a sensor module. In some aspects, a sensor module may include a collar configured to be attached to a camera module for a user device. The collar may include a first opening that is configured to align with an aperture of a camera of the camera module, and a second opening. The sensor module may include a sensor embedded in the collar. The sensor may be aligned with the second opening of the collar. Numerous other aspects are provided.Type: ApplicationFiled: July 24, 2019Publication date: October 1, 2020Inventors: Russell GRUHLKE, Jon LASITER, Ravindra Vaman SHENOY, Ravishankar SIVALINGAM, Kebin LI, Khurshid Syed ALAM
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Patent number: 10770646Abstract: Techniques and structures are provided for manufacturing a flexible PMUT array. In one embodiment, a piezoelectric micromechanical ultrasonic transducer (PMUTs) array comprises a plurality of PMUTs, where each PMUT in the flexible array of PMUTs includes: a first polymer layer configured to support the PMUT, a mechanical layer configured to provide planarization to the PMUT, a first electrode, a second electrode, a piezoelectric layer configured to separate the first electrode and the second electrode, patterns on the first electrode, the piezoelectric material, and the second electrode configured to route electrical signals, and a cavity configured to adjust a frequency response of the PMUT.Type: GrantFiled: February 27, 2017Date of Patent: September 8, 2020Assignee: QUALCOMM IncorporatedInventors: Donald William Kidwell, Jr., Ravindra Shenoy, Jon Lasiter
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Patent number: 10722918Abstract: Methods, systems, computer-readable media, and apparatuses for high density Micro-Electro-Mechanical Systems (MEMS) are presented. In some embodiments, a method for manufacturing a micro-electro-mechanical device on a substrate can comprise etching a release via through a layer of the device. The method can further comprise creating a cavity in the layer of the device using the release via as a conduit to access the desired location of the cavity, the cavity enabling movement of a transducer of the device. The method can then comprise depositing low impedance, electrically conductive material into the release via to form an electrically conductive path through the layer. Finally, the method can comprise electrically coupling the electrically conductive material to an electrode of the transducer.Type: GrantFiled: September 1, 2016Date of Patent: July 28, 2020Assignee: QUALCOMM IncorporatedInventors: Donald William Kidwell, Jr., Ravindra Shenoy, Jon Lasiter
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Publication number: 20200006846Abstract: Certain aspects of the present disclosure provide a glass ceramic antenna package having a large bandwidth (e.g., 19 GHz) for millimeter wave (mmWave) applications, for example. The antenna package generally includes an antenna element comprising a first substrate layer and a second substrate layer, wherein the first substrate layer comprises an antenna, wherein the second substrate layer comprises shielding elements and feed lines, and wherein the feed lines are electrically coupled to the antenna. The antenna package also includes a lead frame adjacent to one or more lateral surfaces of the antenna element.Type: ApplicationFiled: June 29, 2018Publication date: January 2, 2020Inventors: Jon LASITER, Seong Heon JEONG, Ravindra Vaman SHENOY, Jeremy Darren DUNWORTH, Mohammad Ali TASSOUDJI
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Publication number: 20190379102Abstract: An antenna package comprising a chip package including a plurality of feed lines, a first half antenna subassembly electrically coupled to the feed lines, and a second half antenna subassembly electrically coupled to the feed lines, wherein the first and second half antenna subassemblies point away from each other in a direction substantially perpendicular to the chip package. The antenna subassemblies may be millimeter (mm) wave antennas covering from approximately 24 to 43.5 GHz. The antenna subassemblies include a flex substrate formed from printed circuit boards (PCB) or flex-film PCB.Type: ApplicationFiled: June 11, 2018Publication date: December 12, 2019Inventors: Jon LASITER, Ravindra Vaman SHENOY, Mohammad Ali TASSOUDJI, Seong Heon JEONG, Jeremy Darren DUNWORTH