Abstract: Soldering method and apparatus comprising a soldering device having a hand grip portion and an electrically heated soldering element extending from said hand grip portion and terminating in a soldering tip, a housing structure adapted to be supported in a position disposed in spaced relation from the solder device, the housing structure supporting a solder wire supply spool to be unwound therefrom, a tubing structure extending from the housing structure and connected with the soldering device for closely peripherally confining a leading portion of solder wire of substantial longitudinal extent extending from the spool with the free end thereof adjacent the soldering tip and for maintaining such confinement during longitudinal movement thereof in a direction wherein the free end engages the soldering tip while enabling the soldering device to be substantially freely manually moved in spaced relation relative to the housing structure by an operator grasping the hand grip portion thereof, the tubing structure in