Abstract: An electronic module cage for receiving an electronic module (such as a pluggable optical module (POM)), includes a cage body mounted to a printed circuit board (PCB), the cage body having a first opening configured to receive an electronic module, the cage body comprising a spring feature, the spring feature configured to apply a biasing pressure to the electronic module in a direction away from the printed circuit board and toward a heat dissipating element such that a surface of the electronic module contacts the heat dissipating element through a second opening in the cage body.

Abstract: An electronic system may include a housing and one or more electronic modules. The housing and electronic modules may be configured to allow different numbers and types of electronic modules to be attached to the exterior of the housing.

Abstract: A convection-cooled electronic system includes an electronic device and a stand. The electronic device has air intake openings in a lower housing portion and air exhaust openings in an upper housing portion. The stand has air intake openings. The stand has a periphery, a flat base, and a slot extending across the widest portion of the stand. The slot has a shape configured to receive the lower portion of the device housing. Heat emitted by electronic components within the device housing creates airflow by convection, which causes air to be drawn into the stand through the stand air intake openings and communicated into the device air intake openings. The air is heated as it passes through the device housing, and the heated air exits the device housing through the air exhaust openings.

Abstract: A convection-cooled electronic system includes an electronic device and a stand. The electronic device has air intake openings in a lower housing portion and air exhaust openings in an upper housing portion. The stand has air intake openings. The stand has a periphery, a flat base, and a slot extending across the widest portion of the stand. The slot has a shape configured to receive the lower portion of the device housing. Heat emitted by electronic components within the device housing creates airflow by convection, which causes air to be drawn into the stand through the stand air intake openings and communicated into the device air intake openings. The air is heated as it passes through the device housing, and the heated air exits the device housing through the air exhaust openings.