Abstract: The invention encompasses a torus formed by heated and cooled junctions of dissimilar metals such as copper and nickel to generate a low voltage current and form an electrical path of greatly enhanced conductivity wherein a greater current flow may be induced to form a stronger magnetic field. Current at higher voltage may be incrementally removed by magnetic field arrangements to act as magnetic variable switches while at the same time the magnetic field is contained and current also flows through the torus.

Abstract: A low voltage high amperage thermopile generating and electron storage unit is disclosed wherein current is formed by heating and cooling alternate junctions of dissimilar metals arranged in a circular fashion and may be enhanced with an electrical flux pump. Current may be withdrawn using an ultra fast thermopile type switch to connect to an electrical load source.

Abstract: The electromagnetically accelerated impact oil well drill uses magnetic interaction of a ringing circuit formed in each of multiple accelerating coils with the electromagnetic field of charge rings around an expendable ice filled plastic drill head to accelerate the drillhead to hypervelocity with the drill head properly aligned to shoot down through an upper installed oil well casing. The oil well casing being fitted with a rapidly operating diverter valve to deflect effluent from the casing from blowing back into the electromagnetically accelerated impact drill.

Abstract: A method for electromagnetic acceleration of an object involving interaction of magnetic forces between magnetic rings on the object to be accelerated and alternating magnetic fields in a ringing circuit formed in each of a series of linearly arranged doughnut shaped accelerator coils with the frequency of the ringing circuit generated in each coil being adjusted according to velocity of the body being accelerated by adjusting the capacitance in each ringing coil circuit; computation being necessary for each particular application to properly match components to achieve desired velocity.

Abstract: This invention gives an indication of blood glucose by measuring the glucose content in sweat. Other bodily fluids such as saliva, urine, or tears could also be used. The measuring system in our unit includes the substrate which may have printed wiring thereon; a plurality of oxygen sensors for measuring oxygen remaining after oxidation of the glucose with glucose oxidase and a reference oxygen sensor, all covered by a semi-porous membrane; a wick for conveying sweat to the glucose sensors and beyond; a battery, and a plurality of electroplateable indicator bars for indicating the glucose concentration in the sweat by difference in electrical output between the reference oxygen sensor and oxygen sensors that measure oxygen after reaction with the glucose oxidase or glucose sensors; a calibrateable legend associated with the bars relates the plating to the glucose level in the blood. In a second embodiment a liquid crystal display replaces the electroplateable indicator bars.

Abstract: The invention encompasses plating to form leads to allow one step bonding of a chip to tape; one step bonding of leads on the tape to a special chip package wherein chip packages may be stacked and connected as well as surface mounted and formation of a very dense circuitry on one or both sides of a board by using a photo imagable dielectric to separate circuitry and allow plating thru to form integral connections and edge connectors to connect circuitry to allow use of both sides of a board.

Abstract: A fuel assisted electromagnetic launcher wherein a payload is contained in a forward portion of a pointed cylindrical launch container and rocket fuel is contained in a rearward portion; and wherein a launch preparation unit in the launcher cools and heats alternate junctions in circular disposed thermopiles around the cylindrical launch container; and wherein electrical coils encased in plastic form a cylindrical barrel. With the coils with spacers in between each containing a photoelectric detector charged by an external D.C.

Abstract: The disclosure describes an apparatus to use multiple expendable electromagnetically accelerated drill heads that are propelled into a electromagnetic accelerator that further accelerates the expendable drill heads to velocities as high as 30,000 ft./second to drill horizontal holes. Acceleration is achieved by making use of electromagnetic forces induced in a coil by opening a charged "ringing" circuit containing a capacitor interacting with magnetic poles around the expendable projectiles or drill head. Multiple accelerating coils, each charged by a D.C. source, are used while initial acceleration may be by interaction of electromagnetic fields between conductive rings on the drill head and induction coils.

Abstract: This assembly allows connecting in one operation a plurality of chips to chips and to a substrate or each chip to a substrate using an elastomeric pressure means that continues to pressure chips connecting micron sized leads to chip pads on one end and to circuitry on a substrate on the other end; a metallic cover fastening to the substrate and containing said electronic pressure means also includes a ribbed projection to hermetically seal the unit so that the substrate itself becomes an integral part of the assembly package.

Abstract: A preformed metallic tape for thermocompression bonding to electronic component chips and a method and apparatus for the use thereof. The tape has etched thereinto a chip bonding site which includes a central, pull-tab region surrounded by a frame region. Intermediate the pull-tab and the frame regions, electrically conductive leads are formed and connected to the pull-tab. Several of the leads are further connected to the frame. The leads are formed with neck regions located respectively between their ends and the pull-tab and frame. One surface of the tape is a bonding surface and the opposite surface is a pressure pad surface. Protruding above the pressure pad surface are a plurality of mushroom-shaped pressure pads located respectively at the ends of leads. The tape is bonded to a chip by first aligning mating electrical contact pads thereof and terminal ends of the leads. The pads are then urged into the tape so that the pressure pads located on the opposite side thereof contact a heated anvil.

Abstract: An apparatus and a method of use thereof for cast encapsulation of items, particularly electronic components. The apparatus consists of a plurality of identically shaped split matrix elements. Each matrix element has a first surface for receiving and securing the item to be encapsulated. A second surface of another identically shaped matrix element, located on a side thereof opposite to its first surface, is then mated with the first surface securing the item. Thus mated, the first and second surfaces establish a molding cavity for enclosing the item and an orifice providing access thereto. This process of securing an item to a first surface and enclosing it with a second surface is repeated thereby assembling a stack of matrix elements. This stack is then rigidly secured and the molding cavities are filled with particulate filler material through upright orifices. Excess filler is removed by quickly turning the stack over and then righting it again.

Abstract: A preformed metallic tape for thermocompression bonding to electronic component chips and a method and apparatus for the use thereof. The tape has etched thereinto a chip bonding site which includes a central, pull-tab region surrounded by a frame region. Intermediate the pull-tab and the frame regions, electrically conductive leads are formed and connected to the pull-tab. Several of the leads are further connected to the frame. The leads are formed with neck regions located respectively between their ends and the pull-tab and frame. One surface of the tape is a bonding surface and the opposite surface is a pressure pad surface. Protruding above the pressure pad surface are a plurality of mushroom-shaped pressure pads located respectively at the ends of leads. The tape is bonded to a chip by first aligning mating electrical contact pads thereof and terminal ends of the leads. The pads are then urged into the tape so that the pressure pads located on the opposite side thereof contact a heated anvil.

Abstract: An apparatus and a method of use thereof for cast encapsulation of items, particularly electronic components. The apparatus consists of a plurality of identically shaped split matrix elements. Each matrix element has a first surface for receiving and securing the item to be encapsulated. A second surface of another identically shaped matrix element, located on a side thereof opposite to its first surface, is then mated with the first surface securing the item. Thus mated, the first and second surfaces establish a molding cavity for enclosing the item and an orifice providing access thereto. This process of securing an item to a first surface and enclosing it with a second surface is repeated thereby assembling a stack of matrix elements. This stack is then rigidly secured and the molding cavities are filled with particulate filler material through upright orifices. Excess filler is removed by quickly turning the stack over and then righting it again.