Patents by Inventor Jon P. Kerrick

Jon P. Kerrick has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5779836
    Abstract: Described is a method of making a double-sided printed wiring board (PWB) comprising a core of electrically conductive material to improve the thermal distribution and cross-talk shielding of the PWB. Relief apertures and separation slots are chemically milled into the core. A layer of particulate-free dielectric material and a layer of conductive material are laminated to both sides of the core and dielectric material substantially fills the relief apertures during lamination. Holes are drilled through the PWB at the relief apertures to accommodate electrical communication between both sides of the board. Holes are also drilled through the conductive material of the core to accommodate an electrical ground. The surface of the PWB and the side walls of the holes are coated with a second layer of electrically conductive material.
    Type: Grant
    Filed: October 31, 1996
    Date of Patent: July 14, 1998
    Inventor: Jon P. Kerrick
  • Patent number: 5763060
    Abstract: Described is a printed wiring board comprising a composite of an electrically conductive core laminated with layers of dielectric material and electrically conductive material.
    Type: Grant
    Filed: July 11, 1996
    Date of Patent: June 9, 1998
    Assignee: Advance Circuits, Inc.
    Inventor: Jon P. Kerrick