Patents by Inventor Jon R. Kirchhoff

Jon R. Kirchhoff has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240050924
    Abstract: A method for extracting a metal species from a solution is described, where the metal species comprises a rare earth element, Th, or U. The method involves the use of poly(caffeic acid) as a sorbent material. The poly(caffeic acid) may be crosslinked with a diamine crosslinker such as ethylenediamine.
    Type: Application
    Filed: July 28, 2023
    Publication date: February 15, 2024
    Applicant: The University of Toledo
    Inventors: Jon R. Kirchhoff, Sandhya Adhikari, Govind Sharma Shyam Sunder
  • Patent number: 11634517
    Abstract: Materials and methods for extracting metals from solutions, involving a polymer of Formula A are described: where each X is independently either S or O, and n is an integer greater than 1.
    Type: Grant
    Filed: September 26, 2019
    Date of Patent: April 25, 2023
    Assignee: The University of Toledo
    Inventors: Jon R. Kirchhoff, Ahmad Rohanifar, Govind Sharma Shyam Sunder
  • Publication number: 20200102410
    Abstract: Materials and methods for extracting metals from solutions, involving a polymer of Formula A are described: where each X is independently either S or O, and n is an integer greater than 1.
    Type: Application
    Filed: September 26, 2019
    Publication date: April 2, 2020
    Applicant: The University of Toledo
    Inventors: Jon R. Kirchhoff, Ahmad Rohanifar, Govind Sharma Shyam Sunder
  • Patent number: 5431800
    Abstract: A method for the preparation of layered electrodes, including ultramicroelectrodes, through application of a thin film coating of an inorganic material to a conductor by use of chemical vapor deposition. The chemical vapor deposition techniques of the present invention provide a layered electrode that is efficiently and effectively manufactured in a standard reaction chamber at atmospheric pressure. The preferred conductors are carbon fibers and foams, and metal (platinum or gold) wires, meshes and foams. The precursors for the thin film deposition include those that yield thin-films of insulators, semiconductors, metals, and superconductors. During the chemical vapor deposition process, a thin film coating is formed on the conductor by the pyrolytic decomposition of the precursor vapor at the surface of the heated conductor. The hardness and rigidity of the thin film layer imparts durability and structure to the fragile and flexible conductors without significantly increasing the size of the device.
    Type: Grant
    Filed: November 5, 1993
    Date of Patent: July 11, 1995
    Assignee: The University of Toledo
    Inventors: Jon R. Kirchhoff, Dean M. Giolando