Patents by Inventor Jon Reid

Jon Reid has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ACOUSTEOMIC SENSING AND MONITORING USING A HUMAN-CENTRIC INTELLIGENT ACOUSTEOMIC ARRAY
    Publication number: 20240065568
    Abstract: An appliance for monitoring blood flow is provided. The appliance includes a plurality of spatially separated acousteomic sensors for auscultation detection of a patient; a hardware processor and a non-transitory computer-readable medium that stores a trained computer model for modeling a function of a healthy heart for analyzing the acousteomic signals; and a transmitter that transmits the acousteomic signals from the plurality of acousteomic sensors.
    Type: Application
    Filed: December 23, 2021
    Publication date: February 29, 2024
    Applicant: THE JOHNS HOPKINS UNIVERSITY
    Inventors: Andreas G. ANDREOU, Rajat MITTAL, Christos SAPSANIS, Jung Hee SEO, W. Reid THOMPSON, Jon R. RESAR
  • Low copper electroplating solutions for fill and defect control
    Patent number: 10214826
    Abstract: Certain embodiments herein relate to a method of electroplating copper into damascene features using a low copper concentration electrolyte having less than about 10 g/L copper ions and about 2-15 g/L acid. Using the low copper electrolyte produces a relatively high overpotential on the plating substrate surface, allowing for a slow plating process with few fill defects. The low copper electrolyte may have a relatively high cloud point.
    Type: Grant
    Filed: January 29, 2013
    Date of Patent: February 26, 2019
    Assignee: Novellus Systems, Inc.
    Inventors: Jian Zhou, Jon Reid
  • CURRENT RAMPING AND CURRENT PULSING ENTRY OF SUBSTRATES FOR ELECTROPLATING
    Publication number: 20140224661
    Abstract: In some method and apparatus disclosed herein, the profile of current delivered to the substrate provides a relatively uniform current density on the substrate surface during immersion. These methods include controlling the current density applied across a substrate's surface during immersion by dynamically controlling the current to account for the changing substrate surface area in contact with electrolyte during immersion. In some cases, current density pulses and/or steps are used during immersion, as well.
    Type: Application
    Filed: January 7, 2013
    Publication date: August 14, 2014
    Inventors: Tighe A. Spurlin, Jian Zhou, Edward C. Opocensky, Jon Reid, Steven T. Mayer
  • LOW COPPER ELECTROPLATING SOLUTIONS FOR FILL AND DEFECT CONTROL
    Publication number: 20140209476
    Abstract: Certain embodiments herein relate to a method of electroplating copper into damascene features using a low copper concentration electrolyte having less than about 10 g/L copper ions and about 2-15 g/L acid. Using the low copper electrolyte produces a relatively high overpotential on the plating substrate surface, allowing for a slow plating process with few fill defects. The low copper electrolyte may have a relatively high cloud point.
    Type: Application
    Filed: January 29, 2013
    Publication date: July 31, 2014
    Inventors: Jian Zhou, Jon Reid
  • Deposit morphology of electroplated copper
    Patent number: 7879218
    Abstract: The present invention provides improved methods and devices for electroplating copper on a wafer. Some implementations of the present invention involve the pre-treatment of the wafer with a solution containing accelerator molecules. Preferably, the bath into which the wafer is subsequently placed for electroplating has a reduced concentration of accelerator molecules. The pre-treatment causes a reduction in roughness of the electroplated copper surface, particularly during the initial phases of copper growth.
    Type: Grant
    Filed: December 18, 2003
    Date of Patent: February 1, 2011
    Assignee: Novellus Systems, Inc.
    Inventors: Eric Webb, Jon Reid, Yuichi Takada, Timothy Archer
  • Weatherproofed Assembly For Housing Electronic Hardware
    Publication number: 20080192413
    Abstract: Weatherproofed assembly for housing electronic hardware, the assembly comprising a back plate arranged for fastening to a surface and a front housing arranged for, at least partially, containing the electronic hardware. The front housing including a sealing member, wherein the front housing is further arranged for fastening to the back plate so that during the fastening, the sealing member sealingly engages the back plate to weatherproof the electronic hardware within the assembly.
    Type: Application
    Filed: March 24, 2006
    Publication date: August 14, 2008
    Applicant: Bio Recongnition Systems Pty Ltd
    Inventors: Jon Reid, Michael Soire
  • Methods for the electrochemical deposition of copper onto a barrier layer of a work piece
    Patent number: 7405157
    Abstract: Methods are provided for electrochemically depositing copper on a work piece. One method includes the step of depositing overlying the work piece a barrier layer having a surface and subjecting the barrier layer surface to a surface treatment adapted to facilitate deposition of copper on the barrier layer. Copper then is electrochemically deposited overlying the barrier layer.
    Type: Grant
    Filed: March 2, 2005
    Date of Patent: July 29, 2008
    Assignee: Novellus Systems, Inc.
    Inventors: Jon Reid, Seyang Park
  • Method and apparatus for uniform electroplating of integrated circuits using a variable field shaping element
    Patent number: 6402923
    Abstract: An electrochemical reactor is used to electrofill damascene architecture for integrated circuits. A shield is used to screen the applied field during electroplating operations to compensate for potential drop along the radius of a wafer. The shield establishes an inverse potential drop in the electrolytic fluid to overcome the resistance of a thin film seed layer of copper on the wafer.
    Type: Grant
    Filed: March 27, 2000
    Date of Patent: June 11, 2002
    Inventors: Steven T. Mayer, Richard Hill, Alain Harrus, Evan Patton, Robert Contolini, Steve Taatjes, Jon Reid