Abstract: A charge pump comprises one or more pump stages for providing a negative boosted output voltage. Each of the one or more pump stages comprises a P-channel transistor formed in an isolated P-well and an N-channel transistor coupled in series with the P-channel transistor. Forming the P-channel transistor in the isolated P-well essentially eliminates a raised threshold voltage due to body effect.

Abstract: This disclosure describes a design tool that iteratively performs simulation sets on an integrated circuit design, each corresponding to a different hierarchical level with each of the simulation sets producing a different set of simulation results. Each of the simulation sets utilizes a different set of local parameter values that include extreme instance local parameter values based on the set of simulation results of a preceding simulation set. The design tool generates a set of hierarchically aggregated simulation results based upon the last set of simulation results and global parameters, and modifies the integrated circuit design based upon a yield estimation that is determined from comparing the set of hierarchically aggregated simulation results to specification requirements that correspond to the integrated circuit design.

Abstract: In a non-volatile memory, a method of performing a sensing operation to read a non-volatile (NV) element includes a first and a second phase. During the first phase, the NV element is coupled via a sense path transistor to a first capacitive element at a first input of an amplifier stage and a reference cell is coupled via a reference sense path transistor to a second capacitive element at a second input of the amplifier stage. During the second phase, the NV element is coupled via the sense path transistor to the second capacitive element and the reference cell is coupled via the reference sense path transistor to the first capacitive element. During the first phase, the first and second capacitive elements are initialized to voltages representative of states of the NV element and reference cell, respectively. During the second phase, the voltage differential between the two voltages is amplified.

Abstract: In a non-volatile memory, a method of performing a sensing operation to read a non-volatile (NV) element includes a first and a second phase. During the first phase, the NV element is coupled via a sense path transistor to a first capacitive element at a first input of an amplifier stage and a reference cell is coupled via a reference sense path transistor to a second capacitive element at a second input of the amplifier stage. During the second phase, the NV element is coupled via the sense path transistor to the second capacitive element and the reference cell is coupled via the reference sense path transistor to the first capacitive element. During the first phase, the first and second capacitive elements are initialized to voltages representative of states of the NV element and reference cell, respectively. During the second phase, the voltage differential between the two voltages is amplified.

Abstract: A charge pump comprises one or more pump stages for providing a negative boosted output voltage. Each of the one or more pump stages comprises a P-channel transistor formed in an isolated P-well and an N-channel transistor coupled in series with the P-channel transistor. Forming the P-channel transistor in the isolated P-well essentially eliminates a raised threshold voltage due to body effect.

Abstract: In a non-volatile memory, a method of performing a sensing operation to read a non-volatile (NV) element includes a first and a second phase. During the first phase, the NV element is coupled via a sense path transistor to a first capacitive element at a first input of an amplifier stage and a reference cell is coupled via a reference sense path transistor to a second capacitive element at a second input of the amplifier stage. During the second phase, the NV element is coupled via the sense path transistor to the second capacitive element and the reference cell is coupled via the reference sense path transistor to the first capacitive element. During the first phase, the first and second capacitive elements are initialized to voltages representative of states of the NV element and reference cell, respectively. During the second phase, the voltage differential between the two voltages is amplified.

Abstract: An integrated circuit (IC) device includes a static random access memory (SRAM) array, and a resistive memory (resistive memory) array. A first set of programmable resistive elements in the resistive memory array are used to store data from memory cells in the SRAM array. Sense amplifier circuitry is couplable to the SRAM array and the resistive memory array. An arbiter is configured to assert an resistive memory enable signal to couple the sense amplifier circuitry to the resistive memory array and decouple the sense amplifier circuitry from the SRAM array during a resistive memory read operation, and to couple the sense amplifier to the SRAM array and decouple the sense amplifier circuitry from the resistive memory array during an SRAM read operation.

Abstract: A charge pump comprises one or more pump stages for providing a negative boosted output voltage. Each of the one or more pump stages comprises a P-channel transistor formed in an isolated P-well and an N-channel transistor coupled in series with the P-channel transistor. Forming the P-channel transistor in the isolated P-well essentially eliminates a raised threshold voltage due to body effect.

Abstract: A charge pump comprises one or more pump stages for providing a negative boosted output voltage. Each of the one or more pump stages comprises a P-channel transistor formed in an isolated P-well and an N-channel transistor coupled in series with the P-channel transistor. Forming the P-channel transistor in the isolated P-well essentially eliminates a raised threshold voltage due to body effect.

Abstract: This disclosure describes a design tool that iteratively performs simulation sets on an integrated circuit design, each corresponding to a different hierarchical level with each of the simulation sets producing a different set of simulation results. Each of the simulation sets utilizes a different set of local parameter values that include extreme instance local parameter values based on the set of simulation results of a preceding simulation set. The design tool generates a set of hierarchically aggregated simulation results based upon the last set of simulation results and global parameters, and modifies the integrated circuit design based upon a yield estimation that is determined from comparing the set of hierarchically aggregated simulation results to specification requirements that correspond to the integrated circuit design.

Abstract: A voltage switch for handling negative voltages includes an input terminal coupled to a voltage that is greater than a voltage rating of oxide in the voltage switch, a top capacitor plate pre-charge module including three cascoded p-channel transistors coupled between a supply voltage and a top plate of a capacitor, a bottom capacitor plate pre-charge module including two cascoded n-channel transistors coupled between a bottom plate of the capacitor and ground, and an output voltage module including an output terminal and four cascoded n-channel transistors with control electrodes of a first and fourth of the cascoded n-channel transistors coupled to a boost node. Control electrodes of a second and third of the cascoded n-channel transistors coupled to the top plate of the capacitor. A voltage switch for positive voltages is also disclosed.

Abstract: A nonvolatile memory includes a memory array having a plurality of memory cells, a select gate driver configured to provide a select gate voltage to a select gate of a first memory cell of the plurality of memory cells, and a control gate driver configured to use the select gate voltage to provide a control gate voltage to a control gate of a second memory cell of the plurality of memory cells.

Abstract: A non-volatile memory device includes an array of memory cells and a plurality of word lines and voltage supply lines. Each memory cell of the array is coupled to one of the word lines. Each of the plurality of voltage supply lines is coupled to a first voltage supply terminal of a subset of memory cells of a plurality of subsets of memory cells of the array. Each subset includes a plurality of memory cells. A voltage switch supplies a respective one of a plurality of aged voltages to each of the plurality of subsets of memory cells in the memory array on respective ones of the voltage supply lines. The aged voltage supplied to a first of the plurality of subsets of memory cells is different than the aged voltage supplied to a second of the plurality of subsets of memory cells.

Abstract: In accordance with at least one embodiment, an onboard analog-to-digital converter (ADC) on a system-on-a-chip (SOC) is utilized to determine whether a charge pump output for a non-volatile memory (NVM) is correct or not. The SOC is directed to wait until the output is within an expected range before moving to the next step in a start-up procedure. If the maximum allowed start-up time is exceeded, an error signal is sent to the SOC such that the application can react to it.

Abstract: A non-volatile memory device includes an array of memory cells and a plurality of word lines and voltage supply lines. Each memory cell of the array is coupled to one of the word lines. Each of the plurality of voltage supply lines is coupled to a first voltage supply terminal of a subset of memory cells of a plurality of subsets of memory cells of the array. Each subset includes a plurality of memory cells. A voltage switch supplies a respective one of a plurality of aged voltages to each of the plurality of subsets of memory cells in the memory array on respective ones of the voltage supply lines. The aged voltage supplied to a first of the plurality of subsets of memory cells is different than the aged voltage supplied to a second of the plurality of subsets of memory cells.

Abstract: A circuit for driving a control gate of a split-gate nonvolatile memory cell may include a switched current source; a first transistor having a current electrode coupled to the switched current source and a control electrode coupled to a voltage source; a second transistor having a current electrode coupled to a second node of the switched current source, and a control electrode coupled to a third voltage source; a third transistor having a control electrode coupled to the second transistor, a current electrode coupled to the first transistor and a fourth switched voltage source; and a fourth transistor having a current electrode coupled to the first switched voltage source, a control electrode coupled to the switched current source, and a second current electrode coupled to the second transistor at a driver voltage node, wherein a voltage level at the driver voltage node is operable to drive the control gate.

Abstract: A method includes, in one implementation, performing a memory operation to place memory cells of a memory array to a first logic state using a voltage of a charge pump. A portion of the operation is performed on the memory cells using the voltage of the charge pump. A temperature of the memory array is compared to a threshold. If the temperature is above a reference level, a load on the charge pump is reduced by providing the voltage to only a reduced number of memory cells.

Abstract: A circuit for driving a control gate of a split-gate nonvolatile memory cell may include a switched current source; a first transistor having a current electrode coupled to the switched current source and a control electrode coupled to a voltage source; a second transistor having a current electrode coupled to a second node of the switched current source, and a control electrode coupled to a third voltage source; a third transistor having a control electrode coupled to the second transistor, a current electrode coupled to the first transistor and a fourth switched voltage source; and a fourth transistor having a current electrode coupled to the first switched voltage source, a control electrode coupled to the switched current source, and a second current electrode coupled to the second transistor at a driver voltage node, wherein a voltage level at the driver voltage node is operable to drive the control gate.

Abstract: A latching level shifter coupled to a first power supply voltage is driven by a logic circuit coupled to a second power supply voltage. The latching level shifter is driven in a first mode to store a state based on an input signal received by the logic circuit, the first and second power supply voltages are set at first and second initial voltage levels. The latching level shifter is driven in a second mode subsequent to the first mode, the first power supply voltage is set to an intermediate voltage level. The latching level shifter is driven in a high voltage protection mode to produce an output voltage based on the state, the first power supply voltage is set to a final voltage level that is greater than a final voltage level of the second power supply voltage. The high voltage protection mode is subsequent to the second mode.

Abstract: Erasing of a non-volatile memory (NVM) having an array of bit cells includes soft programming after an initial erasing of the bit cells. Over-erased bit cells are determined. A temperature is detected. A first soft program gate voltage based on the temperature is provided. Soft programming on the over-erased bit cells using the first soft program gate voltage is performed. Any remaining over-erased bit cells are identified. if there are any remaining over-erased bit cells, soft programming is performed on the remaining over-erased bit cells using a second soft program gate voltage incremented from the first soft program gate voltage.