Abstract: Magnetic domains in a thin magnetic film on information storage devices are aligned during manufacture of the device, preferably at the time the film is deposited onto a substrate by sputtering. A compact magnetic field generator generates a parallel magnetic field across the substrate with a magnet assembly that is not larger than approximately twice the size of the substrate or not larger than the sputtering target cathode assembly. The magnet assembly includes an interior magnet with poles at opposite ends of the substrate and two side magnets having pole pieces spaced by an air gap from the poles of the interior magnet. The interior magnet preferably includes a central magnet and two intermediate magnets, which share the same pole pieces as the central magnet. The interior magnets are located between the central magnet and the side magnets.

Abstract: A sputtering target assembly in which the region of attachment between the sputtering target and the backing plate has varying stiffness, thereby reducing stresses in the target during sputtering. In the region of attachment, the backing plate has varying thickness, for example a smooth taper. Alternatively, the backing plate may include structures which affect the stiffness of the backing plate in the region of attachment. These structures may be defined by machining, molding or forging during manufacture of the backing plate, or by machining or drilling voids in the backing plate. As a second alternative, the bonding material used to attach the sputtering target and the backing plate may have a varying stiffness across the region of attachment.

Abstract: An ellipsometric measuring system is set-up in association with a vacuum chamber on a production line for thin film samples. The ellipsometer has a scanner for directing the incident light beam to different locations on a thin film sample, and the ellipsometer also has an aperture for limiting the reflected light beam received by the photodetector. The scanner implements a method of aligning the incident beam to a selected surface of the sample. The scanner and the aperture are used to provide a finer adjustment of the incident beam with respect to the selected surface. The ellipsometric measuring system further uses test thin film samples with known film thicknesses and index or refractions to calculate a value for the angle of incidence of the incident light beam.