Abstract: An integrated circuit (IC) device package is disclosed suitable for accommodating large terminal count IC devices in a very small space. A first set of terminals is located in notches around the periphery of the package. A second set of terminals is located inboard of the package and are comprised of metallized annular rings on the top and bottom surfaces of the package around holes or apertures through the surfaces of the package with metallization coating the holes to connect the top and bottom annular rings. This second set of terminals may be arranged in rows parallel to the edges of the package and may be connected to the IC device through buried conductor traces and wire bonding techniques. If necessary, additional rows of metallized holes can be utilized in a grid configuration, preferably at 0.050" centers.