Patents by Inventor Jon W. Brunner
Jon W. Brunner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230154888Abstract: A method of calibrating an ultrasonic characteristic on a wire bonding system is provided. The method includes the steps of: (a) determining a reference ultrasonic characteristic for formation of a wire bond; (b) determining a reference non-stick ultrasonic characteristic that results in a non-stick wire bond condition; (c) determining a calibration non-stick ultrasonic characteristic, on a wire bonding system to be calibrated, that results in a non-stick wire bond condition; and (d) determining a calibration factor for the wire bonding system to be calibrated using the reference non-stick ultrasonic characteristic and the calibration non-stick ultrasonic characteristic.Type: ApplicationFiled: November 15, 2022Publication date: May 18, 2023Inventors: Jon W. Brunner, Wei Qin, Aashish Shah, Hui Xu, Jeong Ho Yang
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Publication number: 20230112270Abstract: A method of installing a wire bonding tool on a wire bonding system is provided. The method includes the steps of: (a) holding a wire bonding tool with an installation tool; (b) engaging the wire bonding tool in an aperture of a transducer of a wire bonding system while the wire bonding tool is held by the installation tool; (c) securing the wire bonding tool in the aperture; and (d) releasing the wire bonding tool from the installation tool.Type: ApplicationFiled: June 21, 2022Publication date: April 13, 2023Inventors: Jon W. Brunner, Gary W. Schulze, Aashish Shah
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Patent number: 10153247Abstract: A method of forming a wire interconnect structure includes the steps of: (a) forming a wire bond at a bonding location on a substrate using a wire bonding tool; (b) extending a length of wire, continuous with the wire bond, to another location; (c) pressing a portion of the length of wire against the other location using the wire bonding tool; (d) moving the wire bonding tool, and the pressed portion of the length of wire, to a position above the wire bond; and (e) separating the length of wire from a wire supply at the pressed portion, thereby providing a wire interconnect structure bonded to the bonding location.Type: GrantFiled: August 16, 2017Date of Patent: December 11, 2018Assignee: KULICKE AND SOFFA INDUSTRIES, INC.Inventors: Thomas J. Colosimo, Jr., Jon W. Brunner
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Patent number: 9865560Abstract: A method of forming a wire interconnect structure includes the steps of: (a) forming a wire bond at a bonding location on a substrate using a wire bonding tool; (b) extending a length of wire, continuous with the wire bond, to another location; (c) pressing a portion of the length of wire against the other location using the wire bonding tool; (d) moving the wire bonding tool, and the pressed portion of the length of wire, to a position above the wire bond; and (e) separating the length of wire from a wire supply at the pressed portion, thereby providing a wire interconnect structure bonded to the bonding location.Type: GrantFiled: October 20, 2016Date of Patent: January 9, 2018Assignee: Kulicke and Soffa Industries, Inc.Inventors: Thomas J. Colosimo, Jr., Jon W. Brunner
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Publication number: 20170345787Abstract: A method of forming a wire interconnect structure includes the steps of: (a) forming a wire bond at a bonding location on a substrate using a wire bonding tool; (b) extending a length of wire, continuous with the wire bond, to another location; (c) pressing a portion of the length of wire against the other location using the wire bonding tool; (d) moving the wire bonding tool, and the pressed portion of the length of wire, to a position above the wire bond; and (e) separating the length of wire from a wire supply at the pressed portion, thereby providing a wire interconnect structure bonded to the bonding location.Type: ApplicationFiled: August 16, 2017Publication date: November 30, 2017Inventors: Thomas J. Colosimo, JR., Jon W. Brunner
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Publication number: 20170040280Abstract: A method of forming a wire interconnect structure includes the steps of: (a) forming a wire bond at a bonding location on a substrate using a wire bonding tool; (b) extending a length of wire, continuous with the wire bond, to another location; (c) pressing a portion of the length of wire against the other location using the wire bonding tool; (d) moving the wire bonding tool, and the pressed portion of the length of wire, to a position above the wire bond; and (e) separating the length of wire from a wire supply at the pressed portion, thereby providing a wire interconnect structure bonded to the bonding location.Type: ApplicationFiled: October 20, 2016Publication date: February 9, 2017Inventors: Thomas J. Colosimo, JR., Jon W. Brunner
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Patent number: 9502371Abstract: A method of forming a wire interconnect structure includes the steps of: (a) forming a wire bond at a bonding location on a substrate using a wire bonding tool; (b) extending a length of wire, continuous with the wire bond, to another location; (c) pressing a portion of the length of wire against the other location using the wire bonding tool; (d) moving the wire bonding tool, and the pressed portion of the length of wire, to a position above the wire bond; and (e) separating the length of wire from a wire supply at the pressed portion, thereby providing a wire interconnect structure bonded to the bonding location.Type: GrantFiled: July 1, 2013Date of Patent: November 22, 2016Assignee: Kulicke and Soffa Industries, Inc.Inventors: Thomas J. Colosimo, Jr., Jon W. Brunner
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Patent number: 9153554Abstract: A method of adjusting ultrasonic bonding energy on a wire bonding machine, the method comprising the steps of: providing a reference relationship between free air ball squash and ultrasonic bonding energy; determining an actual relationship between free air ball squash and ultrasonic bonding energy on a subject wire bonding machine; and adjusting at least one ultrasonic bonding energy setting of the subject wire bonding machine such that the actual relationship of the subject wire bonding machine is closer to the reference relationship.Type: GrantFiled: April 10, 2013Date of Patent: October 6, 2015Assignee: Kulicke and Soffa Industries, Inc.Inventor: Jon W. Brunner
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Publication number: 20150132888Abstract: A method of forming a wire interconnect structure includes the steps of: (a) forming a wire bond at a bonding location on a substrate using a wire bonding tool; (b) extending a length of wire, continuous with the wire bond, to another location; (c) pressing a portion of the length of wire against the other location using the wire bonding tool; (d) moving the wire bonding tool, and the pressed portion of the length of wire, to a position above the wire bond; and (e) separating the length of wire from a wire supply at the pressed portion, thereby providing a wire interconnect structure bonded to the bonding location.Type: ApplicationFiled: July 1, 2013Publication date: May 14, 2015Applicant: Kulicke and Soffa Industries, Inc.Inventors: Thomas J. Colosimo, JR., Jon W. Brunner
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Publication number: 20130277414Abstract: A method of adjusting ultrasonic bonding energy on a wire bonding machine, the method comprising the steps of: providing a reference relationship between free air ball squash and ultrasonic bonding energy; determining an actual relationship between free air ball squash and ultrasonic bonding energy on a subject wire bonding machine; and adjusting at least one ultrasonic bonding energy setting of the subject wire bonding machine such that the actual relationship of the subject wire bonding machine is closer to the reference relationship.Type: ApplicationFiled: April 10, 2013Publication date: October 24, 2013Applicant: Kulicke and Soffa Industries, Inc.Inventor: Jon W. Brunner
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Publication number: 20120074206Abstract: A method of forming a wire bond using a wire bonding machine is provided.Type: ApplicationFiled: September 19, 2011Publication date: March 29, 2012Applicant: KULICKE AND SOFFA INDUSTRIES, INC.Inventors: Wei Qin, Jon W. Brunner, Paul A. Reid
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Patent number: 7500591Abstract: A wire bonding tool includes a first cylindrical portion having a first outside diameter and a second cylindrical portion adjacent the first cylindrical portion. The second cylindrical portion has a second outside diameter, the second outside diameter being less than the first outside diameter. The wire bonding tool also includes a tapered portion adjacent the second cylindrical portion. The tapered portion has a third outside diameter at an end adjacent the second cylindrical portion, the third outside diameter being less than the first outside diameter.Type: GrantFiled: August 15, 2007Date of Patent: March 10, 2009Assignee: Kulicke and Soffa Industries, Inc.Inventors: James E. Eder, Jon W. Brunner
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Patent number: 5421503Abstract: An improved fine pitch bonding tool for use in automatic gold ball bonders for bonding fine gold wires onto closely spaced pads on semiconductors comprises a cylindrical body portion which fits into an ultrasonic transducer and is provided with a bottle-neck working tip on the other end of the body portion for bonding fine gold wires. The working tip is provided with a wire hole diameter less than 1.4 times the diameter of the fine wire to be bonded and is further provided with a chamfer diameter on the working tip which is less than 2.5 mils across. The total tip diameter on the working tip is less than 6 mils and the working face which comprises an annular ring between the chamfer diameter and the tip diameter is provided with a face angle of approximately 22 degrees plus or minus 3 degrees. Even though the bonding tool has a smaller area working face, it has been found to produce second bonds whose pull strength is equal to prior art capillary bonding tools having larger tip diameters and working faces.Type: GrantFiled: August 24, 1994Date of Patent: June 6, 1995Assignee: Kulicke and Soffa Investments, Inc.Inventors: Gil Perlberg, Jon W. Brunner