Patents by Inventor Jon Weiner

Jon Weiner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060062947
    Abstract: A hotmelt-receptive packaging material, a method of making the material and a package made therefrom are described. The hotmelt-receptive packaging material includes a barrier substrate and an energy cured coating applied substantially uniformly to the substrate. The coating includes a polymerized network of oligomers and monomers, and a functional wax slip additive copolymerized with the network. The coating is receptive to hotmelt adhesive. A package can be formed from the material by wrapping it into a tubular structure with overlapping opposed edges and applying hotmelt adhesive to at least one of the opposed edges so that the hotmelt adhesive contacts the coated side of at least one of the edges and adheres the overlapped opposed edges.
    Type: Application
    Filed: September 21, 2004
    Publication date: March 23, 2006
    Inventors: Scott Huffer, Jeffrey Schuetz, Jon Weiner