Patents by Inventor Jon Wigham

Jon Wigham has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermosetting resin compositions
    Patent number: 6316528
    Abstract: The present invention provides a thermosetting resin composition useful as an underfilling sealing resin which enables a semiconductor device, such as a CSP/BGA assembly which includes a semiconductor chip mounted on a carrier substrate, to be securely connected to a circuit board by short-time heat curing and with good productivity, which demonstrates excellent heat shock properties (or thermal cycle properties), and permits the CSP/BGA assembly to be easily removed from the circuit board in the event of semiconductor device or connection failure.
    Type: Grant
    Filed: July 8, 1999
    Date of Patent: November 13, 2001
    Assignee: Loctite (R&D) Limited
    Inventors: Kazutoshi Iida, Jon Wigham
  • Mounting structure and mounting process from semiconductor devices
    Patent number: 6274389
    Abstract: The present invention provides a mounting structure for semiconductor devices which enables a semiconductor device, such as CSP/BGA, to be fixed to a circuit board. This invention also provides a mounting process for semiconductor devices.
    Type: Grant
    Filed: July 8, 1999
    Date of Patent: August 14, 2001
    Assignees: Loctite (R&D) Ltd., Matsushita Electric Industrial Co. Ltd., Loctite Corporation
    Inventors: Kazutoshi Iida, Jon Wigham, Masaki Watanabe, Takeshi Meguro