Abstract: The present invention relates to a method for producing one or more electrical contacts on a component, comprising the following steps:—providing a component which has a front and a rear, an outer layer of a transparent, electrically conductive oxide (TCO) or a self-passivating metal or semiconductor being present on the front and/or rear;—applying a structured, electrically conductive seed layer, the application of the seed layer taking place non-galvanically;—galvanically depositing at least one metal on the seed layer.

Abstract: The present invention relates to a process for producing one or more electrical contacts on a component, comprising (a) applying one or more coatings on the component, where at least one of the coatings is a coating of an electrically conductive material, (b) applying a self-passivating metal or semiconductor and/or a dielectric material on the coated component, (c) structuring the passivating coating by laser treatment or etching, (d) contacting the structured coating with an electroplating bath, (e) etching the regions not covered with the galvanically deposited metal.

Abstract: The present invention relates to a process for producing one or more electrical contacts on a component, comprising (a) applying one or more coatings on the component, where at least one of the coatings is a coating of an electrically conductive material, (b) applying a self-passivating metal or semiconductor and/or a dielectric material on the coated component, (c) structuring the passivating coating by laser treatment or etching, (d) contacting the structured coating with an electroplating bath, (e) etching the regions not covered with the galvanically deposited metal.

Abstract: The present invention relates to a method for producing one or more electrical contacts on a component, comprising the following steps:—providing a component which has a front and a rear, an outer layer of a transparent, electrically conductive oxide (TCO) or a self-passivating metal or semiconductor being present on the front and/or rear;—applying a structured, electrically conductive seed layer, the application of the seed layer taking place non-galvanically;—galvanically depositing at least one metal on the seed layer.

Abstract: The present invention relates to a method for structuring layers of oxidisable materials. At least one layer, disposed on a substrate, of an oxidisable material is hereby subjected to local oxidation with at least one oxidation step. In the case of the latter, at least one selected region of the layer of oxidisable material is oxidised so that the layer, after oxidation, is sub-divided into regions, which are electrically insulated from each other, by at least one oxidised region extending over the entire layer thickness.

Abstract: The invention relates to a method for structuring layers of oxidizable materials. At least one layer, disposed on a substrate, of an oxidizable material is hereby subjected to local oxidation with at least one oxidation step. In the case of the latter, at least one selected region of the layer of the oxidizable material is oxidized such that the layer, after oxidation, is subdivided into regions, which are electrically insulated from each other, by at least one oxidized region extending across the entire layer thickness after the oxidation.