Abstract: An electronic device may have a display. The display may include an array of pixels formed on a display panel. A system-in-package (SiP) may include a substrate, electronic components mounted on the substrate, and mold material that overlaps and conforms to the electronic components. A portion of the substrate that is not overlapped by the mold material may be bonded to the display panel. The electronic components mounted on the substrate of the SiP may include a timing controller integrated circuit and/or a display driver integrated circuit. A plurality of display driver integrated circuit chiplets may be mounted on the substrate of the SiP. The substrate of the SiP may be electrically connected to the display panel by side-wrapped conductive traces. The substrate of the SiP may have portions with different thicknesses.

Abstract: An electronic device may include a light projector module that generates image light and an optical system that redirects the image light towards an eye box. The light projector module may include multiple display modules and an optical combiner that combines the light from the multiple display modules. The light projector may include multiple system-in-packages. Adjacent display modules and/or system-in-packages may be directly bonded such that the components are orthogonal. Using these direct bonds may conserve space within the light projector module and improve alignment within the light projector module.