Abstract: A transparent component includes a functionalized surface. The functionalized surface has dimples and laser-induced periodic surface structures. The functionalized surface is functionalized by the dimples and the laser-induced periodic surface structures. The dimples and the laser-induced periodic surface structures spatially overlap. The dimples have a depth between 100 nm and 2000 nm.

Abstract: A method for producing dimples on a surface of a transparent material using laser pulses of a short-pulse laser is provided. The method includes producing at least one dimple of the dimples on the surface of the transparent material by using a single laser pulse or a single laser burst.

Abstract: A method for processing a material by using laser pulses of a pulsed laser includes introducing the laser pulses into the material in order to process the material. The laser pulses are introduced into the material in a distributed manner spatially statistically around a spatial target value. A spatial statistical distribution of the laser pulses is capable of being adjusted and adapted according to a current feed rate.

Abstract: A method for laser processing a workpiece is provided. The workpiece includes a material transparent to a laser beam of the laser processing. The method includes splitting an input laser beam by using a beam splitter into a plurality of partial beams. The splitting of the input laser beam is performed by application of phases to a beam cross section of the input laser beam. The method further includes focusing the plurality of partial beams decoupled from the beam splitter by using a focusing optical unit. Multiple focus elements are formed by the focusing of the plurality of partial beams. The method further includes subjecting the material of the workpiece to at least a subset of the multiple focus elements. The application of the phases is performed in such a way that at least two of the multiple focus elements have different intensities.

Abstract: A processing optical unit for workpiece processing includes a birefringent polarizer configured to split at least one input laser beam into a pair of partial beams polarized perpendicularly to one another. The processing optical unit further includes a focusing optical unit arranged downstream of the birefringent polarizer in the beam path and configured to focus the pair of partial beams onto focus zones in a focal plane. The processing optical unit is configured to produce at least partly overlapping focus zones of the pair of partial beams.

Abstract: A method for severing a workpiece having a transparent material includes providing multiple focus elements using an input laser beam, applying the multiple focus elements to the material, thereby forming material modifications in the material along a predetermined processing line, and severing the material along the processing line by an etching process using a wet chemical solution. A temperature of the wet chemical solution during the etching process is at least 100° C. and/or at most 150° C.

Abstract: A method for laser processing a workpiece is provided. The workpiece includes a transparent material. The method includes splitting an input laser beam into a plurality of partial beams using a beam splitter, focusing the plurality of partial beams coupled out of the beam splitter to form multiple focus elements, and subjecting the material of the workpiece to the multiple focus elements for laser processing. A distance between adjacent focus elements is at least 3 ?m and/or at most 70 ?m.

Abstract: A device for processing a workpiece includes a laser configured to emit a laser beam, a polarization switch configured to switch the polarization of the laser beam between two polarization states and/or to rotate the polarization of the laser beam, a polarization beam splitter configured to split the laser beam into two partial laser beams with mutually orthogonal polarization states. A first partial laser beam has a first offset and a second partial laser beam has a second offset after passing through the polarization beam splitter. The device further includes processing optics configured to introduce the two partial laser beams into the workpiece in two focal zones, in order to process the workpiece. The polarization switch is arranged before the polarization beam splitter in a beam propagation direction. The switching and/or the rotation of the polarization by the polarization switch alternately maximize intensities of the two partial laser beams.

Abstract: A method for laser processing a workpiece is provided. The workpiece includes a material transparent to a laser beam of the laser processing. The method includes splitting an input laser beam by using a beam splitter into a plurality of partial beams. The splitting of the input laser beam is performed by application of phases to a beam cross section of the input laser beam. The method further includes focusing the plurality of partial beams decoupled from the beam splitter by using a focusing optical unit. Multiple focus elements are formed by the focusing of the plurality of partial beams. The method further includes subjecting the material of the workpiece to at least a subset of the multiple focus elements. The application of the phases is performed in such a way that at least two of the multiple focus elements have different intensities.

Abstract: An apparatus for laser processing of a workpiece is provided. The workpiece includes a transparent material. The apparatus includes a beam shaping device for forming a focus zone from an input laser beam. The focus zone is formed in elongate fashion in relation to a longitudinal axis. The focus zone has, in a plain perpendicular to the longitudinal axis, an asymmetric cross-section with a preferred direction. The apparatus further includes an actuating device for altering the preferred direction during the laser processing of the workpiece, and a control device for controlling the actuating device based on a predefined assignment specification in order to control the preferred direction by open-loop control or closed-loop control during the laser processing of the workpiece.

Abstract: A system includes an ultrashort pulse laser for providing a laser beam, a hollow core fiber, an input coupling optical unit configured to input couple the laser beam into the hollow core fiber, a lens device on which an output coupled laser beam from the hollow core fiber is incident, a beam shaping element on which the laser beam emerging from the lens device is incident, and a focusing optical unit. The lens device is configured to adjust a divergence angle of the output coupled laser beam for adjusting a beam diameter of the laser beam on the beam shaping element. The beam shaping element is configured to impose upon the laser beam a quasi-non-diffractive beam shape with a focal zone that is elongated in the beam propagation direction. The focusing optical unit is configured to set a penetration depth of the focal zone in or on the material.

Abstract: An apparatus for laser machining a workpiece with a material transparent to the laser machining includes a first beam shaping device with a beam splitting element for splitting a first input beam into a plurality of component beams, and a focusing optical unit configured to image the plurality of component beams into at least one focal zone. The first input beam is split by the beam splitting element by phase imposition on the first input beam. The component beams are focused into different partial regions of the at least one focal zone for forming the at least one focal zone. The at least one focal zone is introduced by the focusing optical unit into the material for laser machining the workpiece. Material modifications associated with a crack formation in the material are produced in the material by exposing the material to the at least one focal zone.

Abstract: An apparatus for laser machining a workpiece includes a first beam shaping device comprising a beam splitting element for splitting a first input beam into a plurality of component beams, and a focusing optical unit configured to image the component beams into at least one focal zone. The first input beam is split by the beam splitting element by phase imposition on the first input beam. The component beams are focused into different partial regions of the at least one focal zone for forming the at least one focal zone. The at least one focal zone is introduced into the material at a work angle with respect to an outer side of the workpiece for the laser machining of the workpiece. Material modifications associated with a change of a refractive index of the material are produced in the material by exposing the material to the at least one focal zone.

Abstract: A method for separating a workpiece includes removing material of the workpiece along a separation line by using a laser beam comprising ultrashort laser pulses of an ultrashort pulse laser. The material of the workpiece is transparent to a wavelength of the laser beam, and has a refractive index between 2.0 and 3.5. The method further includes separating the workpiece along a notch formed by the removal of the material.

Abstract: A method for separating a workpiece includes providing ultrashort laser pulses using an ultrashort pulse laser, and introducing material modifications into the workpiece along a separation line using the ultrashort laser pulses. The workpiece includes a transparent material. The method further includes separating the material of the workpiece along the separation line. The laser pulses form a laser beam that is incident onto the workpiece at a work angle. An optical aberration of the laser pulses during a transition into the material of the workpiece is reduced by an aberration correction device. The laser beam has a non-radially symmetric transverse intensity distribution, with the transverse intensity distribution appearing elongate in a direction of a first axis in comparison with a second axis perpendicular to the first axis.

Abstract: A method for separating a workpiece having a transparent material includes providing ultrashort laser pulses using an ultrashort pulse laser, introducing material modifications into the transparent material of the workpiece along a separation line, and separating the material of the workpiece along the separation line. The laser pulses form a laser beam that is incident onto the workpiece at a work angle. The material modifications are Type III modifications associated with a formation of cracks in the material of the workpiece. The material modifications penetrate two sides of the workpiece that are located in intersecting planes. Separating the material of the workpiece produces a chamfer and/or a bevel. A length of a hypotenuse of the chamfer and/or bevel is between 50 ?m and 5000 ?m.

Abstract: A method for separating a workpiece having a transparent material includes providing ultrashort laser pulses using an ultrashort pulse laser, introducing material modifications into the transparent material of the workpiece along a separation line using the laser pulses, and separating the material of the workpiece along the separation line. The laser pulses form a laser beam that is incident onto the workpiece at a work angle. The material modifications are Type I and/or Type II modifications associated with a change in a refractive index of the material of the workpiece. The material modifications penetrate two sides of the workpiece that are located in intersecting planes. Separating the material of the workpiece produces a chamfer and/or a bevel. A length of a hypotenuse of the chamfer and/or bevel is between 50 ?m and 500 ?m.

Abstract: A method for separating a workpiece along a separation line by using ultrashort laser pulses of a laser beam includes splitting the laser beam, using a beam splitter optical unit, into a plurality of partial laser beams. Each partial laser beam is focused by a focusing optical unit onto a surface and/or into a volume of the workpiece so that the partial laser beams are arranged next to one another and spaced apart from one another along the separation line. The method further includes implementing material ablation in the workpiece along the separation line by introducing the ultrashort laser pulses into the workpiece. The partial laser beams are repeatedly moved away from an initial position along the separation line by a deflection value and are subsequently moved back into the initial position. The deflection value is less than or equal to a distance between two adjacent partial laser beams.

Abstract: For material processing of a material, which is in particular for a laser beam to a large extent transparent, asymmetric shaped modifications are created transverse to the propagation direction of the laser beam. Thereby, the laser beam is shaped for forming an elongated focus zone in the material, wherein the focus zone is such that it includes at least one intensity maximum, which is transverse flattened in a flattening direction, or a transverse and/or axial sequence of asymmetric intensity maxima, which are flattened in a sequence direction. After positioning the focus zone in the material, a modification is created and the material and the focus zone are moved relative to each other in the or across to the flattening direction or in the or across to the sequence direction for forming a crack along an induced preferred direction.

Abstract: A method for material processing of a workpiece includes radiating a pulsed raw laser beam into an optical beam shaping system in order to form a quasi-non-diffractive laser beam with a focal zone extending in a longitudinal direction for the material processing of the workpiece. The optical beam shaping system is configured to impose a phase onto a beam cross section of the raw laser beam for forming phase-imposed laser radiation. The method further includes focusing the phase-imposed laser radiation into the workpiece so that the quasi-non-diffractive laser beam is formed and the focal zone has an intensity distribution that is adjustable along the longitudinal direction. The phase imposed on the beam cross section of the raw laser beam is set so that the intensity distribution of the quasi-non-diffractive laser beam in the focal zone is at least approximately constant in the longitudinal direction.